MicroMaterials 1997

Contacts

Review of
MicroMaterials '97

Procceedings of
MicroMaterials '97

1. PLENARY LECTURES

• Materials Science and Engineering - A Major Topic in the Future of Microelectronic Packaging
  Reichl, H.; Wolf, J.
  Fraunhofer Institute IZM, Berlin, Germany
  
  
• Microelectronics Materials Challenges in the 21st Century
  Tummala, Rao R.
  Georgia Institute of Technology, Atlanta, USA
  
  
• Structural Mechanics and Manufacturing Mechanics in Electronic Packaging
  Yu, S.W.; Xu, Q.J.
  Tsinghua University, Beijing, P.R.China
  
  
• Use of Adhesives for Electronics Packaging Applications - The State of the Art
  Liu, J.
  IVF-The Swedish Institute of Production Engineering Research, Mölndal, Sweden
  
  
• A Novel Thick Film Materials Technology Offering High Performance Packaging Solutions
  Barnwell, P.
  Heraeus Inc., Cermalloy Division, Conshohocken, PA, USA
  
  
• Material and Technology Approaches of Surface Micromachining
  Gessner, T.; Bertz, A.; Steiniger, C.; Wollmann, U.
  Technische Universität Chemnitz-Zwickau, Zentrum für Mikrotechnologien, Germany
  
  
• Electromigration; Microstructure and IC Interconnect Reliability
  Thompson, C.V.*; Knowlton, B.D.**
  * Massachusetts Institute of Technology, Department of Materials Science and Engineering, Microsystems Technology Laboratory, Cambridge, USA
  ** Digital Equipment Corporation, Hudson, USA
  
  
• Micro-Formability of Bulk Amorphous Alloys
  Inoue, A.; Zhang, T.; Takeuchi, A.
  Tohoku University, Institute for Materials Research, Japan
  
  
• New Bonding Technologies for Metal / Ceramic Interconnections
  Suga, T.
  University of Tokyo, RCAST, Japan
  
  
• Stable Metal-Semiconductor Contacts: Practice, Concepts, and Examples
  Nicolet, M.-A.
  California Institute of Technology, Pasadena, USA
  
  
• Materials of LIGA Technology
  Ehrfeld, W.; Hessel, V.; Löwe, H.; Schulz, Ch.; Weber, L.
  Institut für Mikrotechnik Mainz GmbH, Germany
  
  
• Structure and Properties of Nanophase Materials
  Siegel, R.W.
  Rensselear Polytechnic Institute, Department Materials Science and Engineering, Troy, NY, USA
  
• CVD Diamond: A New Engineering Material for Thermal, Mechanical and Optical Applications
  Sussmann, R.S.
  De Beers Industrial Diamond Division, Ascot, Berkshire, U.K.
  
  
• Diamond Growth, Characterization, and MEMS Applications
  Dreifus, D.L.
  Kobe Steel USA Inc., Electronic Materials Center, Research Triangle Park, NC, USA
  
  
• Transducer and Protective PVD-Films for Applications in Microsystem Components
  Holleck, H.; Quandt, E.
  Forschungszentrum Karlsruhe, Institut für Materialforschung I, Germany