MicroMaterials 1997

Contacts

Review of
MicroMaterials '97

Procceedings of
MicroMaterials '97

2. Microscopic Testing and Nanomicroscopy

• International Programme on the Standardisation of Depth Sensing Indentation (Keynote Lecture)
  Saunders, S.R.J.
  National Physical Laboratory, Teddington, U.K.
  
  
• New X-Ray Refraction Topography Methods for Nondestructive Evaluation of Advanced Materials
  Hentschel, M.P.
  Federal Institute for Materials Research and Testing (BAM), Berlin, Germany
  
  
• SAW Materials and Devices Characterization of High Resolution and Accuracy
  Weihnacht, M.; Franke, K.; Kunze, R.; Schmidt, H.
  IFW Dresden, Germany
  
  
• Characterisation of Semiconductor Materials by Raman Microscopy
  Johnston, C.; Crossley, A.
  AEA Technology plc, U.K.
  
  
• Microscopic Methods for Micro Materials Characterization
  Hirsekorn, S.; Rabe, U.; Fassbender, S.U.; Scherer, V.; Arnold, W.
  Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren, Saarbrücken, Germany
  
  
• Micromechanical Multiple-Tip Scanning Probe Arrays for Surface Analysis and Structural Modification on the Nanometer Scale
  Müller, F.*; Müller, A.-D.*; Gessner, T.**; Hietschold, M.*
  Technische Universität Chemnitz-Zwickau, Germany
  * Institut für Physik
  ** Zentrum für Mikrotechnologien
  
  
• Electrical Characterization of Micro- and Nanoscale Devices and Systems With Scanning Probe Techniques (Keynote Lecture)
  Mertin, W.; Bangert, J.; Leyk, A.
  Gerhard-Mercator-Universität Duisburg, Fachbereich Elektrotechnik, Fachgebiet Werkstoffe der Elektrotechnik, Germany
  
  
• Cross-Sectional TEM Investigation of Layer Structures on the Nanometer Scale
  Österle, W.
  Federal Institute for Materials Research and Testing (BAM), Berlin, Germany
  
  
• Micro-Raman Spectroscopy of Contact-Induced Phase Transformations in Semiconductors
  Kailer, A.*; Gogotsi, Y.G.**; Nickel, K.G.*
  * Universität Tübingen, Angewandte Mineralogie, Germany
  ** University of Illinois at Chicago, Dept. of Mechanical Engineering, USA
  
  
• Characterization of Microsystem and Packaging Components by Acoustic Microscopy
  Vogel, D.*; Becker, K.-F.**; Aschenbrenner, R.*
  * Fraunhofer Institute IZM Berlin, Germany
  ** Technical University Berlin, Microperic Technology Center, Germany