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MicroMaterials Conference "MicroMat 1997"
Berlin , April 16 - 18 , 1997

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MicroMaterials 1997

Contacts

Review of
MicroMaterials '97

Procceedings of
MicroMaterials '97

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Plenary Lectures

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Microscopic Testing and Nanomicroscopy

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Mechanical Testing

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Advanced Measuring Techniques

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Packaging

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Micromechanics

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Cracks and Fracture in Microcomponents

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Strain and Stress Properties

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Thermal Aspects

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Technological and Environmental Aspects

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Wide Bandgap Semiconductors

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Piezoelectric Materials

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Nanocrystalline and Amorphous Materials

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Thin Films and Layers

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Polymeric Materials

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Ceramics and Superhard Materials

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Metallization

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Soldering and Bonding

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Sensors and Actuators

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Poster Show

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Pre-Conference Workshop
Proceedings of Micro Materials '97

3. Mechanical Testing

  • Nano-Hardness, Friction, and Wear of Ultra-Thin Overcoat Films (Keynote Lecture)
    Bogy, D.B.; Floyd W.S. jr.
    University of California, Dept. of Mechanical Engineering, Berkeley, USA

  • Microtribology
    Klaffke, D.
    Federal Institute for Materials Research and Testing (BAM), Berlin, Germany

  • An Investigation of Effects of Kinematic Hardening and Viscosity Using Spherical Indentation
    Huber, N.*; Tsakmakis, Ch.**
    * Universität Karlsruhe (TH), Institut für Zuverlässigkeit und Schadenskunde im Maschinenbau, Germany
    ** Forschungszentrum Karlsruhe, Institut für Materialforschung II, Germany

  • Indentation Testing of Thin Films and Small Components
    Petzold, M.; Busch, M
    Fraunhofer-Institut für Werkstoffmechanik, Außenstelle Halle, Germany

  • Nondestructive and Contactless Measurement of Hardness Depth and Profile
    Reigl, M.*; Geerkens, J.**; Goch, G.*/**
    * Universität Ulm, Abt. Meß-, Regel- und Mikrotechnik, Germany
    ** Universität Ulm, Institut für Lasertechnologien in der Medizin und Meßtechnik, Germany

  • Reliability Study of Electronic Packaging Assemblies by a 6-Axial Submicron Fatigue Tester
    Lu, M.; Ren, W.; Qian, Z.; Cao, W.; Liu, S.
    Wayne State University, Dept. of Mechanical Engineering, Electronic Packaging Laboratory, Detroit, USA

  • Experimental and Numerical Investigations of the Inelastic Behaviour of Polycrystalline Materials on a Microscopic Scale
    Neuhäuser, H.; Ritter, R.; Steck, E.; Thesing, J.; Wittich, H.; Ziegenbein, A.
    Technische Universität Braunschweig, Institut für Technische Mechanik, Germany

  • Development of a Microtesting System Made by the LIGA-Process With Force Sensor Based on Strain Gauges
    Feit, K.; Bacher, W.; Ruther, P.
    Forschungszentrum Karlsruhe, Institut für Mikrostrukturtechnik, Germany

  • On the Evaluation of Coating-Substrate Systems by Depth-Sensing Indentation Measurement
    Rother, B.
    Forschungsinstitut für Edelmetalle und Metallchemie Schwäbisch Gmünd, Germany

  • Stability of Thin Elastic Layer on Elastic Substructure Loaded by Thermal Stresses
    Morozov, N.F.*; Paukshto, M.V.**; Tovstik, P.E.*
    * St.-Petersburg State University, Institute of Mathematics and Mechanics, Russia
    ** Institute for Mechanical Engineering Problems, RAS, St. Petersburg, Russia