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MicroMaterials Conference "MicroMat 1997"
Berlin , April 16 - 18 , 1997

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MicroMaterials 1997

Contacts

Review of
MicroMaterials '97

Procceedings of
MicroMaterials '97

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Plenary Lectures

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Microscopic Testing and Nanomicroscopy

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Mechanical Testing

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Advanced Measuring Techniques

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Packaging

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Micromechanics

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Cracks and Fracture in Microcomponents

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Strain and Stress Properties

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Thermal Aspects

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Technological and Environmental Aspects

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Wide Bandgap Semiconductors

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Piezoelectric Materials

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Nanocrystalline and Amorphous Materials

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Thin Films and Layers

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Polymeric Materials

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Ceramics and Superhard Materials

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Metallization

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Soldering and Bonding

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Sensors and Actuators

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Poster Show

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Pre-Conference Workshop
Proceedings of Micro Materials '97

4. Advanced Measuring Techniques

  • Applications of Full-Field Optical Methods in Micromechanics and Material Engineering (Keynote Lecture)
    Kujawinska, M.
    Warsaw University of Technology, Faculty of Micromechanics and Photonics, Poland

  • Measuring Deformation, Shape and Vibration of Small Objects Using Digital Holography
    Seebacher, S.; Osten, W.; Jüptner, W.
    BIAS, Bremer Institut für Angewandte Strahltechnik, Germany

  • 3D Measurement of Microstructures Using Projected Fringe and Confocal Microscopy
    Frankowski, G.
    OMECA Messtechnik GmbH, Teltow, Germany

  • Non-Destructive Thermal and Optical Characterization of Buried Micro Systems by Scanning Probe Microscopy
    zur Mühlen, E.; Koschinski, P.; Gehring, S.; Reineke, F.
    TopoMetrix GmbH, Darmstadt, Germany

  • Image Processing Analysis in Micropackaging
    Wiese, S.*; Rossek, U.**, Feustel, F.*; Meusel, E.*
    * Technische Universität Dresden, Institut für Halbleiter- und Mikrosystemtechnik, Germany
    ** Röntec GmbH, Berlin, Germany

  • Hall Effect Analysis Techniques for Multicarrier Materials (invited)
    Holmes, D.S.*; Lindemuth, J.R.*; Meyer, J.R.*; Hoffman, C.A.**; Antoszewski, J.***; Faraone, L.***
    * Lake Shore Cryotronics, Inc., Westerville, OH, USA
    ** Naval Research Laboratory, Washington DC, USA
    *** The University of Western Australia, Nedlands, Australia

  • Solder Joint Inspection on Double Sided Printed Circuit Boards Using Planar Computer Tomography (PCT)
    Wennmacher, C.; Hanke, R.; Schröpfer, S.; Bauscher, I.; Kostka, G.
    Fraunhofer-Institut für Integrierte Schaltungen, Erlangen, Germany

  • Characterization of Thermo-Mechanical Properties of MEMS and Microcomponents Using Laseroptical Methods
    Großer, V.; Bombach, C.; Faust, W.; Dudek, R.; Michel, B.
    Fraunhofer Institute IZM Berlin and Chemnitz, Germany

  • Object-Screen-Method for Microscopic Deformation-Measurements
    Bornholdt, O.*; Krumm, M.**; Ahrens, T.*
    * Fraunhofer Institut für Siliziumtechnologie, Itzehoe, Germany
    ** Centrum für Mikroverbindungstechnik, Itzehoe, Germany