MicroMaterials 1997

Contacts

Review of
MicroMaterials '97

Procceedings of
MicroMaterials '97

5. Packaging

• Materials and Mechanics Issues in Flip-Chip Organic Packaging
  (Keynote Lecture)
  Wu, T.Y.*; Tsukada, Y.**; Chen, W.T.*
  * IBM Corporation, IBM Microelectronics Division, Endicott, NY, USA
  ** YASU Technology Application Laboratory, IBM Japan
  
  
• Experimental and Analytical Evaluation of Stress Fields Generated
  by Solder Bump Interconnections (invited)
  De Wolf, I.*; Soper, A.**; Pozza, G.**; Ignat, M.**; Parat, G.***; Maes, H.E.*
  * IMEC, Leuven, Belgium
  ** INP Grenoble, France
  *** LETI, Grenoble, France
  
  
• Mechanical Reliability Study of FCOB Assemblies by FEA
  and MicroDAC
  Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H.
  Fraunhofer Institute IZM Berlin and Chemnitz, Germany
  
  
• Measurements of the Stress-Strain Behaviour of Three Die
  Attach Materials and the Material Influence on Die Failure
  Dickerson, T.
  The Welding Institute, Abington, Cambridge, U.K.
  
  
• Influence of Loading History on Cyclic Mechanical Properties of
  Flip-Chip-Joints: Experiments and Simulation
  Wiese, S.; Feustel, F.; Meusel, E.
  Technische Universität Dresden, Institut für Halbleiter- und Mikrosystemtechnik, Germany
  
  
• Viscoplastic Analysis of a Solder-Bump Configuration at
  Thermo-Cyclic Loading
  Eberle, A.; Sievert, R.
  Federal Institute for Materials Research and Testing (BAM), Berlin, Germany
  
  
• Processing Mechanics for Flip-Chip Assembly (Keynote Lecture)
  Wang, J.; Qian, Z.; Liu, S.
  Wayne State University, Dept. of Mechanical Engineering,
  Electronic Packaging Laboratory, Detroit, USA
  
  
• Validity of the Extrapolation to Lower Temperatures in High
  Temperature Storage Life (HTSL) Testing in Plastic Encapsulated IC’s
  Schuddeboom, W.*; Wübbenhorst, M.**
  * Philips Semiconductors, Packaging & Technology
  Development IC, Nijmegen, The Netherlands
  ** Delft University of Technology, Faculty of Chemical
  Technology and Materials Science, The Netherlands
  
  
• Materials Problems in Advanced Circuit Boards, Multichip Module
  Applications and Electronic Packaging (invited)
  Frey, W.
  Siemens AG, München, Germany
  
  
• Heel Crack and Fracture Phenomena due to Wire Microstructural
  Changes in Ultrasonic Bonding and Temperature Aging
  Bierwirth, R.*; Lang, K.-D.**; Reichl, H.**
  * Pac Tech GmbH, Falkensee, Germany
  ** Fraunhofer Institute IZM Berlin, Germany
  
  
• A New Concept for MMIC-Packaging
  Rehme, F.; Dolp, R.; Kuffer, M.; Hager, W.
  Daimler-Benz Aerospace AG, Sensorsysteme, Ulm, Germany
  
  
• Substrates for R.F. Applications: A Choice Between Organic
  or Non Organic Materials (Keynote Lecture)
  Drevon, C.; Lacoste, J.L.
  Alcatel Espace, Toulouse, France
  
  
• AFM Investigation of the Photoselective Activation and Electroless
  Metallisation of Epoxy Substrates
  Lafferty, E.J.; Campion, L.M.; Kelly, P.V.; Crean, G.M.
  National Microelectronics Research Centre Lee Maltings, Cork, Ireland
  
  
• Low Temperatur Cofired Ceramics (LTCC) for Sensors and
  Microsystems
  Bechtold, F.*; Brode, W.**; Schiller, W.***
  * Siegert Electronic GmbH, Cadolzburg, Germany
  ** Siegert TFT GmbH, Hermsdorf, Germany
  *** Federal Institute for Materials Research and Testing (BAM), Berlin, Germany
  
  
• Surface and Solderability Judgement of Boards and Substrates
  With Energy Dispersive X-Ray Analysis (EDX)
  Schweigart, H.; Wege, S.
  Technische Universität München, Lehrstuhl für Werkstoffe im Maschinenbau, Germany
  
  
• New Applications for Low Temperature Cofiring Ceramic Multilayers
  in 3D-Shaped Devices
  Wolter, K.-J.*; Bauer, R.*; Rebenklau, L.*; Schiller, W.**
  * Dresden University of Technology, Electronics Technology Laboratory,
  Germany
  ** Federal Institute for Materials Research and Testing (BAM), Berlin, Germany