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MicroMaterials Conference "MicroMat 1997"
Berlin , April 16 - 18 , 1997

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MicroMaterials 1997

Contacts

Review of
MicroMaterials '97

Procceedings of
MicroMaterials '97

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Plenary Lectures

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Microscopic Testing and Nanomicroscopy

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Mechanical Testing

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Advanced Measuring Techniques

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Packaging

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Micromechanics

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Cracks and Fracture in Microcomponents

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Strain and Stress Properties

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Thermal Aspects

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Technological and Environmental Aspects

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Wide Bandgap Semiconductors

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Piezoelectric Materials

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Nanocrystalline and Amorphous Materials

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Thin Films and Layers

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Polymeric Materials

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Ceramics and Superhard Materials

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Metallization

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Soldering and Bonding

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Sensors and Actuators

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Poster Show

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Pre-Conference Workshop
Proceedings of Micro Materials '97

6. Micromechanics

  • Materials Science in Small Dimensions: Reliability Issues of
    VLSI Interconnects (Keynote Lecture)

    Glickman, E.E.

    Tel-Aviv University, Faculty of Engineering, Dept. of Electrical Engineering, Israel

  • Micromechanics of Composites
    Schmauder, S.; Soppa, E.

    Universität Stuttgart, Staatliche Materialprüfungsanstalt, Germany

  • A Local Cumulative Damage Measure for Composites
    Will, P.; Helbig, S.

    Hochschule für Technik und Wirtschaft Mittweida, Germany

  • Micromechanics for Thermopiezoelectric Materials With Microcracks (invited)
    Qin, Q.-H.* / **; Mai, Y.-W.*; Yu, S.-W.**

    * University of Sydney, Dept. of Mechanical & Mechatronic Engineering,
    Australia
    ** Tsinghua University, Dept. of Engineering Mechanics, Beijing, P.R. China

  • Micro- and Macromechanical Modeling of Damage in an
    Al/Si Cast Alloy

    Dong, M.; Schmauder, S.

    Universität Stuttgart, Staatliche Materialprüfungsanstalt (MPA), Germany

  • Non-Linear Deformations at Interface-Corners
    Scherzer, M.

    Technical University Chemnitz-Zwickau, Dept. of Mathematics, Germany

  • Structural Changes in Front of Microcracks in Thin Foils (invited)
    Eterashvili, T.

    Georgian Technical University, Republican Centre of Structural
    Investigations, Electron Microscopy Laboratory, Tbilisi, Georgia

  • Reliability Analysis of Micro Materials: Effect of Stochasticity
    Silberschmidt, V.V.

    Technical University München, Chair A for Mechanics, Germany

  • Thermo-Mechanical Reliability Analysis and Structural
    Optimisation of CSP

    Auersperg, J.*; Simon, J.*; Schubert, A.**; Michel, B.**

    * Technical University Berlin, Microperipheric Technology Center,
    Germany
    ** Fraunhofer Institute IZM Berlin and Chemnitz, Germany

  • On Estimations of the Compressive Strength of Materials Containing
    Long Inclusions and Cavities

    Lapusta, Y.N.

    LMPM-ENSMA, Site du Futuroscope, France

  • Fatigue Life-Time Prediction Using Random Loading Simulation
    Cacko, J.

    Slovak Academy of Sciences, Institute of Materials and Machine Mechanics, Bratislava, Slovak Rep