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MicroMaterials Conference "MicroMat 1997"
Berlin , April 16 - 18 , 1997

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MicroMaterials 1997

Contacts

Review of
MicroMaterials '97

Procceedings of
MicroMaterials '97

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Plenary Lectures

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Microscopic Testing and Nanomicroscopy

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Mechanical Testing

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Advanced Measuring Techniques

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Packaging

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Micromechanics

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Cracks and Fracture in Microcomponents

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Strain and Stress Properties

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Thermal Aspects

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Technological and Environmental Aspects

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Wide Bandgap Semiconductors

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Piezoelectric Materials

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Nanocrystalline and Amorphous Materials

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Thin Films and Layers

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Polymeric Materials

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Ceramics and Superhard Materials

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Metallization

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Soldering and Bonding

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Sensors and Actuators

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Poster Show

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Pre-Conference Workshop
Proceedings of Micro Materials '97

7. Cracks and Fracture in Microcomponents

  • ´Fracture Electronics´ - Concepts of Fracture Mechanics for Reliability
    Estimation in Microelectronics and Microsystem Technology
    (Keynote Lecture)

    Michel, B.

    Fraunhofer Institute IZM Berlin and Chemnitz, Germany

  • Temperature Dependence of Ductility and Fracture Behavior
    of Cu Bicrystals With Dispersed Fe Particles

    Miura, H.*; Watanabe, S.*; Sakai, T.*; Kato, M.**

    * The University of Electro-Communications, Department of
    Mechanical and Control Engineering, Tokyo, Japan
    ** Tokyo Institute of Technology, Department of Materials Science
    and Engineering, Yokohama, Japan

  • Fatigue Crack Growth Measurements in Microstructures
    Schlums, D.H.; Dual, J.

    Swiss Federal Institute of Technology Zürich, ETH Zentrum, Institute of Mechanics, Switzerland

  • Some Remarks on Fracture Mechanics of Piezoelectric Solids
    Balke, H.; Kemmer, G.; Drescher, J.

    Technische Universität Dresden, Institut für Festkörpermechanik, Germany

  • Local Fracture Toughness in Metallic Materials
    Stampfl, J.*; Hofer, G.**; Ziehenberger, K.H.*; Kolednik, O.*

    * Erich-Schmid-Institut für Festkörperphysik, Leoben, Austria
    ** Institut für Maschinelles Sehen und Darstellen, Graz, Austria

  • Development of Mechanical Testing Machine for Microelements and
    Fracture and Fatigue of Si-Single Crystals (Keynote Lecture)

    Komai, K.; Minoshima, K.; Inoue, S.

    Kyoto University, Department of Mechanical Engineering, Japan

  • Atomic-Force-Microscopy (AFM) Observation of Martensitic Phase
    Transition at Stress-Loaded Crack Tips in an Intermetallic Phase

    Hangen, U.; Sauthoff, G.

    Max-Planck-Institut für Eisenforschung, Düsseldorf, Germany

  • General Description of Distributed Crack Propagation Problem
    in Polycrystalline Ceramic Materials

    Sadowski, T.

    Technical University of Lublin, Faculty of Mechanical Engineering, Poland

  • A New Approach for the Characterisation of Surface Cracks Using Microtechnology
    Bühling, L.*; Dietz, M.*; Grimm, J.**; Rößler, K.*

    Westsächsische Hochschule Zwickau (FH), Germany
    * Fachbereich Maschinenbau
    ** Fachbereich Elektrotechnik