MicroMaterials 1997

Contacts

Review of
MicroMaterials '97

Procceedings of
MicroMaterials '97

8. Strain and Stress Properties

• Mechanical Stress Measurements Using Micro-Raman Spectroscopy
  (Keynote Lecture)
  De Wolf, I.
  IMEC, Leuven, Belgium
  
  
• A Laser Speckle Correlation Method for Strain Measurements
  of Thin Sheet Materials
  Anwander, M.; Weiss, B.
  Universität Wien, Institut für Materialphysik, Austria
  
  
• Residual Stresses in Microcomponents
  Schubert, A.; Michel, B.
  Fraunhofer Institute IZM Berlin and Chemnitz, Germany
  
  
• Determination and Effects of Residual Stress Fields in Small Areas
  Eigenmann, B.
  Universität Karlsruhe (TH), Institut für Werkstoffkunde I, Germany
  
  
• Some Remarks on Stress State at Interface of the Thin Layer
  in Metal Joints Under Tension
  Ranatowski, E.
  Technical University, Mechanical Department, Bydgoszcz, Poland
  
  
• Strain Distribution Near Si/NiSi2 Interface and Its Effects
  on Electronic Property (Keynote Lecture)
  Wakayama, Y.; Tanaka, S.-I.
  Tanaka Solid Junction Project, ERATO, Yokohama, Japan
  
  
• Measurement of Dynamic Strength With µm-Sized Mechanical
  Structures
  Mazza, E.*; Umeda, A.**; Ueda, K.**; Dual, J.*; Ohta, A.**
  * Institute of Mechanics, ETH Zentrum, Zürich, Switzerland
  ** National Research Laboratory of Metrology, AIST, MITI, Ibaraki, Japan
  
  
• Identification of Shear-Moduli of Microstructures
  Schiltges, G.; Gsell, D.; Dual, J.
  Institute of Mechanics, ETH Zentrum, Zürich, Switzerland
  
  
• Plastic Deformation of Silicon Microelements at High Temperatures
  Frühauf, J.; Franke, C.
  Technische Universität Chemnitz-Zwickau, Zentrum für Mikrotechnologien, Germany
  
  
• Measurement of the Stresses at the Surface of a Silicon Die:
  Application to the Evaluation of a Creep Law of the Sn62Pb36Ag2
  Solder Alloy
  Rey, P.; Woirgard, E.; Zardini, C.
  IXL/ University of Bordeaux, Talence, France
  
  
• Investigations of Relaxation Effects in Cu-Lines on Si-Substrates
  Köhler, B.; Meißner, O.; Melov, V.G.; Schreiber, J.
  Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren, EADQ, Dresden, Germany
  
  
• Creep and Relaxation Behaviour of a Butt Soldered Component
  on PCBs - Mechanical and Metallographic Investigations
  Villain, J.*; Brüller, O.**; Kaltefleiter, J.***
  * Fachhochschule Augsburg, Germany
  ** Technische Universität München, Germany
  *** Siemens AG, Verkehrstechnik, Erlangen, Germany
  
  
• The Behavior of Viscoelastic Minibuffers Under Spring Load
  Brüller, O.*; Villain, J.**
  * Technische Universität München, Germany
  ** Fachhochschule Augsburg, Germany