MicroMaterials 1997

Contacts

Review of
MicroMaterials '97

Procceedings of
MicroMaterials '97

9. Thermal Aspects

• Thermal Conductivity of PbSn and AuSn Flip Chip Bumps
  Hahn, R.*; Kamp, A.**; Reichl, H.* / **
  * Fraunhofer Institute IZM Berlin, Germany
  ** Technical University Berlin, Microperipheric Technology Center, Germany
  
  
• A Simple Method to Reduce Thermomechanical Stress in GaAs
  Assemblies Including Diamond Heat Spreaders and AuSn Solders
  Töpfer, M.*; Kaulfersch, E.*; Michel, B.**; Reichl, H.**
  * Technical University Berlin, Microperipheric Technology Center, Germany
  ** Fraunhofer Institute IZM Berlin and Chemnitz, Germany
  
  
• Integrated Micro-Cooling System for Printed Circuit Boards
  Ilgen, H.
  ILFA GmbH, Niederlassung Dresden, Kesselsdorf, Germany
  
  
• The Thermal Expansion Coefficient of CVD Diamond
  Moelle, C.*; Szücs, F.*; Fecht, H.J.*; Röhrs, P.**; Johnston, C.***;
  Chalker, P.R.***; Werner, M.****
  * Technical University Berlin, Dept. Materials Science, Germany
  ** Federal Institute for Materials Research and Testing (BAM),
  Berlin, Germany
  *** AEA Technology plc., Oxfordshire, U.K.
  **** VDI/VDE-IT, Dept. System Integration, Teltow, Germany
  
  
• Intelligent Microcooling-Systems on Electronic Printed Circuit Boards
  (Keynote Lecture)
  Mehlhorn, T.*; Birkholtz, P.*; Schnellboegl, A.*; Straehler, B.*;
  Wolkers, L.*; Lancki, M.**; Straub, P.**; Messmer, H.**
  * Siemens AG Berlin, Germany
  ** PPC-Electronic, Cham, Switzerland
  
  
• Application of the Laser Flash Diffusivity Method to Thin High
  Thermal Conductivity Materials
  Kehoe, L.; Kelly, P.V.; Crean, G.M.
  National Microelectronics Research Centre, Lee Maltings, Cork, Ireland
  
  
• Optimizing the Cooling of High Power GaAs-Laser Diodes
  by Using Diamond Heat Spreaders
  Bonhaus, J.*; Lorenzen, D.**; Kaulfersch, E.***; Denisenko, A.*;
  Zaitsev, A.*; Kwong, S.****; Man, K.****; Reichl, H.***; Fahrner, W.R.*
  * University of Hagen, Dept. of Electrical Engineering, Germany
  ** Jenoptik Laserdiode GmbH, Jena, Germany
  *** Fraunhofer Institute IZM Berlin, Germany
  **** City University of Hong Kong, P.R. China
  
  
• Follow-up of the Crack Propagation in the Solder Joints by the
  Measurement of the Thermal Performances in a Power Hybrid
  Assembly
  Rey, P.; Woirgard, E.; Zardini, C.
  IXL/ University of Bordeaux, Talence, France
  
  
• Diode Laser Bar Mounting on Dielectric Heatspreaders
  Lorenzen, D.* Heinemann, S.*; Bonhaus, J.**
  ** University of Hagen, Dept. of Electrical Engineering, Germany