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MicroMaterials Conference "MicroMat 1997"
Berlin , April 16 - 18 , 1997

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MicroMaterials 1997

Contacts

Review of
MicroMaterials '97

Procceedings of
MicroMaterials '97

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Plenary Lectures

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Microscopic Testing and Nanomicroscopy

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Mechanical Testing

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Advanced Measuring Techniques

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Packaging

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Micromechanics

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Cracks and Fracture in Microcomponents

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Strain and Stress Properties

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Thermal Aspects

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Technological and Environmental Aspects

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Wide Bandgap Semiconductors

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Piezoelectric Materials

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Nanocrystalline and Amorphous Materials

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Thin Films and Layers

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Polymeric Materials

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Ceramics and Superhard Materials

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Metallization

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Soldering and Bonding

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Sensors and Actuators

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Poster Show

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Pre-Conference Workshop
Proceedings of Micro Materials '97

10. Technological and Environmental Aspects

  • Fabrication of Micro Parts by High Aspect Ratio Structuring and
    Metal Injection Molding With Supercritical Debinding Method
    (Keynote Lecture)

    Shimizu, T.*; Murakoshi, Y.*; Sano, T.*; Maeda, R.*; Sugiyama, S.**

    * Mechanical Engineering Laboratory, AIST/MITI, Ibaraki, Japan
    ** Ritsumeikan University, Japan

  • Optimisation of the LIGA-droplet Technology for Microlenses
    Moldovan, N.*; Göttert, J.**; Mohr, J.**; Nedelcu, S.*;
    Oßmann, Ch.**; Ilie, M.*

    * Institute of Microtechnology, Bucharest, Romania
    ** Forschungszentrum Karlsruhe GmbH, Institut für
    Mikrostrukturtechnik, Germany

  • Micro-Structuring by Laser Beam Removal
    Hellrung, D.; Gillner, A.; Poprawe, R.

    Fraunhofer-Institut für Lasertechnik, Aachen, Germany

  • Manufacturing of Thin Movable Micro-Mirrors in Silicon
    by Using an Optimized CMP-Process

    Wollmann, U.; Steiniger, C.; Kehr, K.; Kaufmann, C.; Gessner, T.

    Technische Universität Chemnitz-Zwickau, Zentrum für Mikrotechnologien, Germany

  • Laser Machining of Ceramics for MCM-D Applications
    Glaw, V.*; Hahn, R.*; Wolf, J.*; Töpper, M.**; Buschick, K.*;
    Hein, U.*; Ginolas, A.**; Ehrmann, O.*; Reichl, H.*

    * Fraunhofer Institute IZM Berlin, Germany
    ** Technical University Berlin, Microperipheric Technology Center,
    Germany

  • Electron Microscopic Investigation of Structural Changes
    in Single Crystalline Silicon Induced by Short Pulse Laser Drilling

    Kaspar, J.; Luft, A.

    Fraunhofer-Institut für Werkstoff- und Strahltechnik, Dresden, Germany

  • A New Approach to Halogen Free FR-4 Base Materials
    (Keynote Lecture)

    Flury, P.; Magendie, F.; Scharf, W.; Weidmann, U.

    Ciba Speciality Chemicals, Inc., Basel, Switzerland

  • Chemical Analysis of Electronic Materials
    Danzer, B.; Brodersen, K.; van Eldik, R.

    Universität Erlangen/Nürnberg, Germany

  • Environmental Impact of Materials in Electronics
    Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Pötter, H.

    Fraunhofer Institute IZM Berlin, Germany

  • Recycling Aspects of Micro Materials
    Müller, J.; Griese, H.

    Fraunhofer Institute IZM Berlin, Germany