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MicroMaterials Conference "MicroMat 1997"
Berlin , April 16 - 18 , 1997

MicroMaterials Homepage MicroMaterials 2000 MicroMaterials Research

MicroMaterials 1997

Contacts

Review of
MicroMaterials '97

Procceedings of
MicroMaterials '97

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Plenary Lectures

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Microscopic Testing and Nanomicroscopy

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Mechanical Testing

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Advanced Measuring Techniques

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Packaging

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Micromechanics

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Cracks and Fracture in Microcomponents

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Strain and Stress Properties

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Thermal Aspects

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Technological and Environmental Aspects

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Wide Bandgap Semiconductors

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Piezoelectric Materials

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Nanocrystalline and Amorphous Materials

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Thin Films and Layers

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Polymeric Materials

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Ceramics and Superhard Materials

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Metallization

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Soldering and Bonding

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Sensors and Actuators

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Poster Show

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Pre-Conference Workshop
Proceedings of Micro Materials '97

11. Wide Bandgap Semiconductors

  • Chemical Vapour Deposition of Diamond for Thermal Management
    and Sensor Applications (Keynote Lecture)

    Koidl, P.; Wild, C.; Wörner, E.

    Fraunhofer-Institut für Angewandte Festkörperphysik, Freiburg i. Br., Germany

  • Degradation of Polycrystalline Diamond and Metal Diamond
    Contacts at High Temperatures (invited)

    Johnston, C.*; Chalker, P.R.*; Crossley, A.*; Werner, M.**

    * AEA Technology plc, Oxfordshire, U.K.
    ** VDI/VDE-IT, Dept. System Integration, Teltow, Germany

  • Influence of Defects on the Young’s Modulus of Polycrystalline
    Diamond

    Szücs, F.*; Moelle, C.*; Klose, S.*; Fecht, H.J.*; Fassbender, S.U.**;
    Meyendorf, N.**; Werner, M.***

    * Technische Universität Berlin, Dept. Material Science, Germany
    ** Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren, Saarbrücken, Germany
    *** VDI/VDE-IT, Dept. System Integration, Teltow, Germany

  • Actuator/Sensor Technology on "Electronic Grade" Diamond Films
    Gluche, P.*; Leuner, R.*; Vescan, A.*; Ebert, W.*; Kohn, E.*; Rembe, C.**;
    aus der Wiesche, S.**; Hofer, E.P.**

    University of Ulm, Germany
    * Dept. Electron Devices and Circuits
    ** Dept. Measurement, Control and Microtechnology

  • Analysis of Wide Band Gap Material Properties From Device
    Characteristics Using Device Simulation

    Lades, M.; Pschenitzka, F.; Wachutka, G.

    Technical University München, Dept. for Physics of Electrotechnology, Germany

  • Materials Characterisation Services to the Semiconductor Industry
    (invited)

    Crossley, A.; Johnston, C.; Cullen, F.; Fairchild, J.; Montgomery, N.;
    Mapledoram, L.; Sofield, C.

    AEA Technology plc, Oxfordshire, U.K.

  • Interface Reactions Between Titanium Silico-Carbides and Au,
    Al or Pd at 600°C

    Wenzel, R.; Goesmann, F.; Schmid-Fetzer, R.

    Technical University Clausthal, Electronic Materials, Germany

  • Temperature Effects in Alloy Metal and 6H-SiC Substrate Schottky
    Contacts Caused by the Current Suppressing Effect (invited)

    Rang, T.*; Blum, A.**

    * Tallinn Technical University, Institute of Electronics, Estonia
    ** University of Saarland, Institute of Electronics and
    Semiconductor Devices, Saarbrücken, Germany

  • Electronic of SiC, CGe, and Their Related Alloys
    Rezki, M.*; Tadjer, A.*; Abid, H.*; Aourag, H.**

    University of Sidi-Bel-Abbes, Algeria
    * Semiconductor Materials Research Laboratory
    ** Computational Materials Science Laboratory

  • High-Valued Thin-Film Resistors for Biomedical Applications
    Based on Nanocrystalline Silicon Carbon Alloys

    Eck, S.; Kraetschmer, H.; Bolz, A.; Schaldach, M.

    Friedrich-Alexander-University Erlangen-Nürnberg, Dept. of Biomedical Engineering, Germany

  • Evaluation of the Carrier Trapping Model for the Interpretation and
    Prediction of Transport Properties of Polycrystalline Wide Bandgap
    Semiconductor Films (invited)

    Rutsch, G.*; Werner, M.**

    * University of Pittsburgh, Department of Electrical Engineering
    and Department of Physics, USA
    ** VDI/VDE-Technologiezentrum Informationstechnik GmbH, Teltow, Germany