mmconference.jpg (3878 Byte)
     

MicroMaterials Conference "MicroMat 1997"
Berlin , April 16 - 18 , 1997

MicroMaterials Homepage MicroMaterials 2000 MicroMaterials Research

MicroMaterials 1997

Contacts

Review of
MicroMaterials '97

Procceedings of
MicroMaterials '97

°

Plenary Lectures

°

Microscopic Testing and Nanomicroscopy

°

Mechanical Testing

°

Advanced Measuring Techniques

°

Packaging

°

Micromechanics

°

Cracks and Fracture in Microcomponents

°

Strain and Stress Properties

°

Thermal Aspects

°

Technological and Environmental Aspects

°

Wide Bandgap Semiconductors

°

Piezoelectric Materials

°

Nanocrystalline and Amorphous Materials

°

Thin Films and Layers

°

Polymeric Materials

°

Ceramics and Superhard Materials

°

Metallization

°

Soldering and Bonding

°

Sensors and Actuators

°

Poster Show

°

Pre-Conference Workshop
Proceedings of Micro Materials '97

15. Polymeric Materials

  • Low Dielectric Constant Materials for Interlayer Dielectric
    Applications: Materials Science Issues (invited)

    Mc Kerrow, A.J.*; Shih, Wei-Yan*; Leu, Jihperng**; Ho, P.S.***

    * Texas Instruments Inc., Dallas, USA
    ** Sematech, Austin, USA
    *** University of Texas at Austin, USA

  • Positive Photopatternable Dielectrics for Microelectronic Applications
    Sezi, R.*; Schmid, G.*; Radlik, W.**; Krabe, D.***; Buschick, K.***

    * Siemens AG, Erlangen, Germany
    ** Siemens AG, München, Germany
    *** Technical University Berlin, Microperipheric Technology Center, Germany

  • BCB - A Polymer for Thinfilm Applications
    Töpper, M.*; Ehrmann, O.*; Reichl, H.* / **; Glaw, V.**; Wolf, J.**;
    Fischbeck, G.***; Petermann, K.***

    * Technical University Berlin, Microperipheric Technology Center, Germany
    ** Fraunhofer Institute IZM Berlin, Germany
    *** Technische Universität Berlin, Institut für Hochfrequenztechnik, Germany

  • Reduction of Stress in Micromachined Components Caused
    by Humidity-Induced Volume Expansion of Polymer Layers

    Buchhold, R.*; Nakladal, A.*; Sager, K.*; Gerlach, G.*; Sahre, K.**;
    Müller, M.**; Eichhorn, K.-J.**

    * Dresden University of Technology, Institute of Solid-State Electronics, Germany
    ** Institute of Polymer Research, Dresden, Germany

  • Evaluation of ORMOCERs for Microelectronics Applications
    Dabek, A.*; Popall, M.**; Olsowski, B.**; Reichl, H.*

    * Technical University Berlin, Microperipheric Technology Center, Germany
    ** Fraunhofer Institut für Silikatforschung, Würzburg, Germany

  • Polymer Materials for Microsystem Technologies (Keynote Lecture)
    Ruprecht, R.; Hanemann, T.; Piotter, V.; Hausselt, J.

    Forschungszentrum Karlsruhe, Institut für Materialforschung III, Germany

  • Specially Designed UV-Adhesives for Fiber-Chip-Coupling
    Battermann, A.*; Labs, J.**

    * Panacol-Elosol Oberursel, Germany
    ** Fraunhofer Institute IZM Berlin, Germany

  • Influence of Material Properties on the Performance of Polymer Micropumps
    Ahrens, R.; Bacher, W.; Martin, J.; Rummler, Z.; Schomburg, W.K.

    Forschungszentrum Karlsruhe, Institut für Mikrostrukturtechnik, Germany

  • Polycyanurates - Innovative Thermosets
    Bauer, M.; Bauer, J.; Uhlig, C.

    Fraunhofer-Institut für Angewandte Materialforschung, Außenstelle Polymerverbunde Teltow, Germany

  • Load Free Determination of the Coefficient of Thermal Expansion on Polymer Foils
    Feustel, F.*; Vogel, D.**; Wiese, S.*

    * Technische Universität Dresden, Institut für Halbleiter- und Mikrosystemtechnik, Germany
    ** Fraunhofer Institute IZM Berlin, Germany