MicroMaterials 1997

Contacts

Review of
MicroMaterials '97

Procceedings of
MicroMaterials '97

17. Metallization

• The Development of the New Direction of Submicron Technologies
  for ULSI and Substitution of Au and Ag (Keynote Lecture)
  Khoperia, T.N.; Tabatadze, T.J.; Zedgenidze, T.I.
  Georgian Academy of Sciences, Institute of Physics, Tbilisi, Georgia
  
  
• NiB - An Alternative Surface for PCBs
  Schmidt, R.; Hannemann, M.; Scheel, W.
  Fraunhofer Institute IZM Berlin, Germany
  
  
• Reliable Under Bump Metallization for Solder Flip-Chip Contacts
  Thierbach, S.; Adolphi, B.; Preuß, A.
  Technische Universität Dresden, Institut für Halbleiter- und Mikrosystemtechnik, Germany
  
  
• Excimer Lamp UV Activation of Lithium Niobate Substrates for Electroless Plating
  Campion, L.M.; O‘Reilly, M.; Kelly, P.V.; Crean, G.M.
  National Microelectronics Research Centre, Cork, Ireland
  
  
• Chemical Composition and Deposition Rate of Copper Thin Films
  Deposited by LCVD on Silicon
  Jacquorie, M.*; Pfleging, W.*; Wesner, D.A.**; Kreutz, E.W.*
  * Rheinisch-Westfälische Technische Hochschule Aachen, Lehrstuhl für Lasertechnik, Germany
  ** Fraunhofer Institut für Lasertechnik, Aachen, Germany
  
  
• Photoassisted Activation Process for Large Area Selective Electroless
  Metallisation on Ceramics Using Incoherent Ultraviolet Radiation
  Macauley, D.J.; Lafferty, E.J.; Kelly, P.V.; Mongey, K.F.; Crean, G.M.
  National Microelectronics Research Centre, Cork, Ireland