MicroMaterials 1997

Contacts

Review of
MicroMaterials '97

Procceedings of
MicroMaterials '97

18. Soldering and Bonding

• Balling for BGA (Keynote Lecture)
  Chiu, Ch.S.; Lee, N.-Ch.
  Indium Corporation of America, Clinton, NY, USA
  
• Characterization of Technological Aspects and Materials Properties
  of Composite Solder Pastes
  Reitlinger, C.E.; Dittes, M.; Bergmann, H.W.
  Universität Erlangen-Nürnberg, Lehrstuhl Werkstoffkunde und Technologie der Metalle, Germany
  
• Oxidation and Reduction of Liquid SnPb60/40 under Ambient and Vacuum Conditions
  Kuhmann, J.F.*; Maly, K.**; Preuß, A.***; Adolphi, B.***; Wirth, T.****; Österle, W.****
  * Microelectronic Centret, Lyngby, Denmark
  ** Heinrich-Hertz-Institut für Nachrichtentechnik, Berlin, Germany
  *** Dresden University of Technology, IHM, Germany
  **** Federal Institute for Materials Research and Testing (BAM), Berlin, Germany
  
• Comparison of Low Melting Point Solders
  Dittes, M.; Reitlinger, C.E.; Bergmann, H.W.
  Universität Erlangen-Nürnberg, Lehrstuhl Werkstoffkunde und Technologie der Metalle, Germany
  
• Probe-Testability of No-Clean Solder Pastes
  Xiao, M.; Jaeger, P.A.; Lee, N.-Ch.
  Indium Corporation of America, Utica, NY, USA
  
• Investigation of Pt Diffusion Into SnPb(60/40) Solder by SIMS Profiling
  From the Backside
  Chiang, C.-H.*; Kuhmann, J.F.**; Harde, P.*; Reier, F.*; Österle, W.***
  * Heinrich-Hertz-Institut für Nachrichtentechnik, Berlin, Germany
  ** Microelectronik Centret, Lyngby, Denmark
  *** Federal Institute for Materials Research and Testing (BAM), Berlin, Germany
  
• High Temperature Characteristics of Solders and Solder Joints
  Scheel, W.; Wittke, K.; Nowottnick, M.; Pape, U.
  Fraunhofer Institute IZM Berlin, Germany
  
• Laser Beam Joining - A New Way in Eye Glass Frame Production
  Dorn, L.*; Herbert, F.*; Hofmann, F.*; Lingath, K.** ; Shrestha, S.*
  * Technische Universität Berlin, Institutsbereich Fügetechnik/ Beschichtungstechnik, Germany
  ** Brillenfabrik Rathenow GmbH, Germany
  
• Reliability Investigations on "Under the Hood" Automative Electronics
  Nitopi, L.*; Wiese, S.**
  * Magneti Marelli Divisione Eletronica, Technology Group, Pavia, Italy
  ** Technische Universität Dresden, Institut für Halbleiter- und Mikrosystemtechnik, Germany
  
• Microstructural Degradation of Solder (Keynote Lecture)
  Nylen, M.; Hutchinson, B.; Gustavsson, U.
  Swedish Institute for Metals Research, Stockholm, Sweden
  
• Reliability Analysis of PQFP Solder Joints Under Power Cycling by Hybrid Method
  Shi, L.*; Daum, W.*; Gründer, K.-P.*; Yuan, Z.**; Dai, F.**
  * Federal Institute for Materials Research and Testing (BAM), Berlin, Germany
  ** Tsinghua University, Dept. of Engineering Mechanics, Beijing, P.R. China
  
• Fatigue Life Studies on PBGA and PQFP Solder Joints
  Dudek, R.*; Nylen, M.**; Michel, B.*
  * Fraunhofer Institute IZM Berlin and Chemnitz, Germany
  ** Swedish Institute for Metals Research, Stockholm, Sweden
  
• Adhesion Mechanisms in the DCB Metallisation of AlN (invited)
  Gopalakrishnan, S.*; Lumpp, J.K.*; Dudek, R.**; Michel, B.**
  * University of Kentucky, Lexington, USA
  ** Fraunhofer Institute IZM Berlin and Chemnitz, Germany
  
• Models and Concepts for Lifetime Prediction of SMT Solder Joints:
  A Comparison and Critical Evaluation
  Jendrny, J.*; Müller, W.H.*; Albrecht, H.-J.**
  * Universität-Gesamthochschule Paderborn, Laboratorium für Technische Mechanik, Germany
  ** Siemens AG, Berlin, Germany
  
• Advanced Deformation and Failure Analysis on Flip Chip Assemblies
  Vogel, D.*; Caers, J.**; Auersperg, J.***; Schubert, A.*; Michel, B.*
  * Fraunhofer Institute IZM Berlin and Chemnitz, Germany
  ** Philips CFT, Eindhoven, The Netherlands
  *** Technical University Berlin, Germany
  
• Electric Contact Bonding of Optoelectronic Semiconductor
  Devices Using Isolating Adhesive Resins (Keynote Lecture)
  Seeberger, D.* / **; Honsberg-Riedl, M.*; Büttgenbach, S.**
  * Siemens Research Laboratories, München, Germany
  ** Technical University Braunschweig, Germany
  
• Room Temperature Wafer Direct Bonding in Ultrahigh Vacuum
  Plößl, A.; Mack, S.; Stenzel, H.; Scholz, R.; Gösele, U.
  Max-Planck-Institut für Mikrostrukturphysik, Halle, Germany
  
• The Effects of Plasma Etching on the Direct Wafer Bonding of Silicon
  Gutjahr, K.; Reiche, M.; Hopfe, S.
  Max-Planck-Institut für Mikrostrukturphysik, Halle, Germany
  
• Selective Sealing and Bonding of Silicon-Glass Compounds
  and LIGA-Components by Laser Beam Welding
  Legewie, F.; Gillner, A.; Poprawe, R.
  Fraunhofer-Institut für Lasertechnik, Aachen, Germany
  
• Anodic Bonding With Sputtered Pyrex Glass Layers
  Drost, A.; Scherbaum, S.; Klink, G.; Feil, M.
  Fraunhofer-Institut für Festkörpertechnologie, München, Germany