mmconference.jpg (3878 Byte)
     

MicroMaterials Conference "MicroMat 1997"
Berlin , April 16 - 18 , 1997

MicroMaterials Homepage MicroMaterials 2000 MicroMaterials Research

MicroMaterials 1997

Contacts

Review of
MicroMaterials '97

Procceedings of
MicroMaterials '97

°

Plenary Lectures

°

Microscopic Testing and Nanomicroscopy

°

Mechanical Testing

°

Advanced Measuring Techniques

°

Packaging

°

Micromechanics

°

Cracks and Fracture in Microcomponents

°

Strain and Stress Properties

°

Thermal Aspects

°

Technological and Environmental Aspects

°

Wide Bandgap Semiconductors

°

Piezoelectric Materials

°

Nanocrystalline and Amorphous Materials

°

Thin Films and Layers

°

Polymeric Materials

°

Ceramics and Superhard Materials

°

Metallization

°

Soldering and Bonding

°

Sensors and Actuators

°

Poster Show

°

Pre-Conference Workshop

Review of Micro Materials '97

The Micro Materials ’97 was the second congress organized by the German Society for Materials Research and Testing (DVM) and the Fraunhofer Institute IZM Berlin. Support was also given by the Technical University Berlin, the VDI/VDE-IT Technology Center Teltow and the Federal Institute of Materials Research and Testing Berlin. The conference covered various fields of materials research and materials applications to microsystem technology and microelectronics. After the very successful 1st MicroMat ’95 this conference was held on an international level. In response to the call for papers the International Program Committee received more than 450 papers submitted from 36 countries. The understanding of materials problems in microelectronics and microsystem technologies applications has advanced considerably in recent years. But there are many open questions which need to be dealt with in more detail, above all the material requirements for low cost manufacturing technologies and the resulting consequences for reliability and quality estimations. The aim of this second congress was to identify and highlight the progress achieved since the first conference concerning mainly the different fields of micro materials applications and bring together specialists from all over the world to discuss the recent trends. Because there has been observed a considerable interest in microelectronic packaging the MicroMat ’97 organizers had invited outstanding scientists and engineers to deliver plenary and key-note lectures in different fields of materials research for advanced packaging. In addition to the plenary lectures, invited session and key-note session lectures, the program covered various topics of the conference with 210 oral and more than 100 poster presentations. This congress is of interest to researchers and engineers from companies, from research institutes and universities who are working on various problems of materials applications in microtechnologies and microelectronics. The conference topics cover the fields of materials applications in automotive electronics, semiconductor and telecommunication industries and other branches applying advanced microtechnologies. On behalf of the Program Committee we would like to wish you a pleasent study of the conference proceedings - and we are looking forward to meeting you at the next Micro Materials conference.

B. Michel, H. Fecht, M. Werner H. Reichl
Conference Chairmen of MicroMat '97 Head of the Fraunhofer Institute IZM Berlin

last update Oktober 30, 2003
Webmaster