MicroMaterials Conference "MicroMat 2000"

Berlin, April 17 - 19 , 2000

MicroMaterials Homepage Contact Micromaterials Research

Review

Introduction

Program Committee

Topics

Selected Papers

Alph. Author Index

Sponsors

Local Organ. Committee

Contacts


Alphabetic Author Index


Abé, H., Tohoku University, Sendai, Japan

Abid, H., University of Sidi-Bel-Abbes, Physics Department, Computational Materials Science Laboratory, Sidi-Bel-Abbes, Algeria

Abramowitz, P., The University of Texas at Austin, Laboratory for Interconnect & Packaging, Austin, USA

Adamschik, M., University of Ulm, Department of Electron Devices and Circuits, Ulm, Germany

Adriansen, S., Université catholique de Louvain, Laboratoire de Microélectronique, Louvain-la-Neuve, Belgium

Ahn, J.-H., Seoul National University, School of Materials Science and Engineering, Seoul, Korea

Akovali, G., Middle East Technical University , Department of Polymer Science and Technology, Ankara, Turkey

Aktaa, J., Forschungszentrum Karlsruhe Technik und Umwelt, Institut für Materialforschung II, Karlsruhe, Germany

Al-Douri, Y., University of Sidi-Bel-Abbes, Physics Department, Computational Materials Science Laboratory, Sidi-Bel-Abbes, Algeria

Albrecht, H.-J. , Siemens AG, Berlin, Germany

Alonso, F., INASMET, San Sebastian, Spain

Altpeter, I., Fraunhofer Institute for Nondestructive Testing, Saarbruecken, Germany

Alvensleben, F. von, Laser Zentrum Hannover e.V., Hannover, Germany

Amagai, M., Texas Instruments Japan, New Package Development Department, Hayami-gun, Japan

Amelio, S., Fraunhofer Institute for Nondestructive Testing, Saarbrücken, Germany

Anhöck, S., TU Berlin, Center of Microperipherics, Berlin, Germany

Ansorge, F., Fraunhofer IZM Berlin, Germany

Anwander, M., University Vienna, Institute of Materialphysics, Vienna, Austria

Aourag, H., University of Sidi-Bel-Abbes, Physics Department, Computational Materials Science Laboratory, Sidi-Bel-Abbes, Algeria

Arndt-Staufenbiel, N., Fraunhofer IZM Berlin, Germany

Arnold, W., Fraunhofer Institute for Nondestructive Testing, Saarbrücken, Germany

Arzt, E., Max-Planck-Institut für Metallforschung und Universität Stuttgart, Institut für Metallkunde, Stuttgart, Germany

Aschenbrenner, R., Fraunhofer IZM Berlin, Germany

Ashida, K., Agency of Industrial Science and Technology, Mechanical Engineering Laboratory, Tsukuba, Ibaraki, Japan

Asundi, A., Nanyang Technological University, School of Mechanical & Production Engineering, Singapore

Auersperg, J., Fraunhofer IZM Berlin, Dept. Mechanical Reliability and Micro Materials, Germany

Auerswald, E., Fraunhofer IZM Berlin, Dept. Mechanical Reliability and Micro Materials, Germany

Auerswald, J., Universität Ulm, Abteilung Werkstoffe der Elektrotechnik-Materialwissenschaften, Ulm, Germany

Baaijens, F.P.T., Eindhoven University of Technology, Faculty of Mechanical Engineering, Netherlands Institute for Metals Research, Eindhoven, The Netherlands

Baaklini, G.Y., NASA Glenn Research Center, Cleveland, Ohio, USA

Babushkina, N.V., National Academy of Sciences of Belarus, Institute of Electronics, Minsk, Belarus

Bae, S., Gerhard-Mercator-Universität Duisburg, Werkstoffe der Elektrotechnik, Duisburg, Germany

Bagdahn, J., Fraunhofer Institut für Werkstoffmechanik, Halle, Germany

Baik, S., National Technical University of Ukraine, Kiev, Ukraine

Balk, L.J., Bergische Universität Gesamthochschule Wuppertal, Fachbereich Elektrotechnik, Fachgebiet Elektronik, Wuppertal, Germany

Balke,H., Technische Universität Dresden, Institute of Solid Mechanics, Dresden, Germany

Balueva, A.V., Georgia Institute of Technology, School of Civil and Environmental Engineering, Atlanta, USA

Barabanenkov, M.Yu., Institute of Microelectronics Technology and High Purity Materials, Chernogolovka, Russia

Bartelink, D., Hewlett-Packard Laboratories, Palo Alto, USA

Bauer, M., Fraunhofer Institute for Reliability and Microintegration, Branch Lab EPC Teltow, Teltow, Germany

Bauer, M., Fraunhofer IZM, Teltow, Germany

Baumbach, T., Fraunhofer IZFP/ EADQ, Dresden,  Germany

Bayard, O., Ecole normale Superieure de Cachan, Laboratoire de Mecanique et Technologie, Cachan, France

Becker, G., Infineon Technologies AG, Munich, Germany

Becker, H., Jenoptik Mikrotechnik GmbH ,Jena, Germany

Becker, K., University of Applied Science Bingen, Germany

Becker, K.F., Technische Universität Berlin, Forschungsschwerpunkt Technologien der Mikroperipherik, Berlin, Germany

Becker, M., University of Bremen, Bremen, Germany

Beckert, W., Technische Universität Dresden, Institut für Werkstoffwissenschaft, Dresden, Germany

Beckmann, J., Bundesanstalt für Materialforschung und –prüfung (BAM), Berlin, Germany

Begemann, M., Institut für Mikrotechnik Mainz GmbH, Mainz, Germany

Behnke, K., Universität Kiel, Technische Fakultät ,Lehrstuhl für Materialkunde, Kiel, Germany

Behnke, U., Gerhard-Mercator-Universität Duisburg, Werkstoffe der Elektrotechnik, Germany

Beige, H., Martin-Luther-Universität Halle-Wittenberg, FB Physik, EP II, Halle/S., Germany

Beil, A., Laser Zentrum Hannover e.V., Hannover, Germany

Benecke, W., University of Bremen, Bremen, Germany

Bereck, H., Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH, Freiberg, Germany

Berg, G., Martin-Luther-University, Department of Physics, Halle/Saale, Germany

Berg, U., Institut für Mikrotechnik Mainz GmbH, Mainz, Germany

Berger, H., University of Ulm, Ulm, Germany

Berger, L., Ulm University, Div. of Materials, Ulm, Germany

Bergmann, H.W., University of Bayreuth, Department of Metallic Materials, Bayreuth, Germany

Bergmann, U., Technical University Dresden, Institute of Materials Research, Dresden, Germany

Bergner, F., Technical University Dresden, Institute of Materials Research, Dresden, Germany

Berka, L., Czech Technical University Prague, Faculty of Civil Engineering, Prague, Czech Rep.

Berthold, L., Fraunhofer IWM Freiburg und Halle, Germany

Bethke, J., Philips, Almelo, The Netherlands

Bidstrup, S.A., Georgia Institute of Technology, School of Chemical Engineering, Packaging Research Center, Atlanta, USA

Bieroegel, C., Martin-Luther-University Halle-Wittenberg, Germany

Binkle, O., Institut für Neue Materialien GmbH Saarbrücken, Germany

Birke, J., University of Ulm, Ulm, Germany

Bitz, C., DaimlerChryslerAG, Frankfurt a.M., Germany

Blank, V.D., Technological Institute for Superhard and Novel Carbon Materials, Moscow, Russia

Bläsi, B., Fraunhofer Institut für Solare Energiesysteme, Freiburg, Germany

Bloch, H., Aktiv Sensor GmbH, Germany

Blum, F., University of Hagen, Department of Electronic Devices, Hagen, Germany

Boeffel, Ch., Fraunhofer IZM, Teltow, Germany

Boerner, V., Fraunhofer Institut für Solare Energiesysteme, Freiburg, Germany

Böhm, J., Fraunhofer IWU, Chemnitz, Germany

Boit, C., Infineon Technologies AG , Failure Analysis CFE FA 5, Munich, Germany

Bombach, C., Fraunhofer IZM Berlin, Dept. Mechanical Reliability and Micro Materials, Germany

Borneman, J., Universität Gh Kassel, Institut für Werkstofftechnik, Kassel, Germany

Boseck, S., University of Bremen, Institute for Materials Science and Structure Research, Bremen, Germany

Bosse, L., Fraunhofer-Institut für Lasertechnik, Aachen, Germany

Bouabdallah, A., Laboratoire Energetique, Institut de Physique, Bab Ezzouar, Algeria

Bouhafs, B., University of Sidi-Bel-Abbes, Physics Department, Computational Physics Laboratory, Sidi-Bel-Abbes, Algeria

Braceras, I., INASMET, San Sebastian, Spain

Brand, U., Physikalisch-Technische Bundesanstalt Braunschweig, Germany

Brandt, O., PDI, Berlin, Germany

Braun, T., Fraunhofer IZM Berlin, Germany

Brekelmans, W.A.M., Eindhoven University of Technology, Faculty of Mechanical Engineering, Netherlands Institute for Metals Resaerch, Eindhoven, The Netherlands

Brenoaie, I., Metallurgical Surveyor-Lloyd’s Register, Romania

Bressers, H.J.L., Philips, Eindhoven, The Netherlands

Brizuela, M., INASMET, San Sebastian, Spain

Brocks, W., GKSS Research Center, Institute of Materials Research, Geesthacht, Germany

Brüller, O., Technical University München, Department of Mechanics and Material Testing, Garching, Germany

Brüning, H., Institut für Mikrotechnik Mainz GmbH, Mainz, Germany

Buchhold, R., Technische Universität Dresden, Institut für Festkörperelektronik, Dresden, Germany

Burkhardt, T., Fraunhofer IWU, Chemnitz, Germany

Busmann, H.G., Fraunhofer IFAM Bremen, Germany

Bütefisch, S., TU Braunschweig, Institut für Mikrotechnik, Braunschweig, Germany

Büttgenbach, S., TU Braunschweig, Institut für Mikrotechnik, Braunschweig, Germany

Bykova, L.N., National Academy of Sciences of Belarus, Institute of Electronics, Minsk, Belarus

Bystrzycki, J., Military University of Technology, Department of Materials Technology, Poland

Caers, J.F.J., Philips, Eindhoven, The Netherlands

Cantor, B., University of Oxford, Department of Materials, Oxford, Great Britain

Celis, Kathol. Universität Leuven, Belgium

Chalker, P.R., University of Liverpool, Department of Engineering, Liverpool, United Kingdom

Chen, W.T., National University of Singapore, Singapore

Chichak, S., Uzhgorod State University, Department of Solid State Electronics, Uzhgorod, Ukraine

ChmelÍk, R., Brno University of Technology, Institute of Physical Engineering, Brno, Czech Republic

Choi, Y., Seoul National University, School of Materials Science and Engineering, Seoul, Korea

Christ, V., Ilmenau Technical University, Department of Glass and Ceramic Technology, Ilmenau, Germany

Chu, J., Ministry of International Trade and Industry, Agency of Industrial Science and Technology, Mechanical Engineering Laboratory, Tsukuba, Japan

Cleave, V., University of Cambridge, Cavendish Laboratory, Cambridge, Great Britain

Coniclione, S., Universita‘ di Bologna, Dipartimento di Fisica ed Instituto Nationale di Fisica della Materia, Bologna, Italy

Consiglio, R., Centre Suisse d’Electronique et de Microtechnique SA, Neuchatel, Switzerland

Cramer, R.M., Bergische Universität Gesamthochschule Wuppertal, Fachbereich Elektrotechnik, Fachgebiet Elektronik, Wuppertal, Germany

Crossley, A., AEA Technology plc., Didcot, Great Britain

Dai, X., University of Texas at Austin, Laboratory for Interconnect and Packaging, Austin, USA

Dambacher, J., University of Ulm, Ulm, Germany

Davidson, J., Telrad Communication and Electronic Industries Ltd., Lod, Israel

Davletbaev, R.S., Kazan State Technological University, Department of Synthetic Rubber, Kazan, Russia

Davletbaeva, I.M., Kazan State Technological University, Department of Synthetic Rubber, Kazan, Russia

DeCristofaro, N., Allied Signal, USA

Degischer, H.P., Vienna University of Technology, Institute of Material Science & Testing, Vienna, Austria

Del Piero, G., Universita di Ferrara, Facolta di Ingegneria, Ferrara, Italy

Delatte, P., Université catholique de Louvain, Laboratoire de Microélectronique, Louvain-la-Neuve, Belgium

Demeus, L., Université catholique de Louvain, Laboratoire de Microélectronique, Louvain-la-Neuve, Belgium

den Boer, A.W.J., Philips, Eindhoven, The Netherlands

Depetasse, S., Fraunhofer Institut Zerstörungsfreie Prüfverfahren, Saarbrücken, Germany

Dessard, V., Laboratoire de Microélectronique, Université catholique de Louvain, Louvain-la-Neuve, Belgium

Dieter, S., Hahn-Meitner-Institut, Abt. Strukturforschung, Berlin, Germany

Dittes, M., University of Bayreuth, Department of Metallic Materials, Bayreuth, Germany

Dittrichova, L., Brno University of Technology, Brno, Czech Republic

Djeu, N., University of South Florida, Department of Physics, Tampa, USA

Dlubek, G., Fraunhofer Institut Zerstörungsfreie Prüfverfahren, Saarbrücken, und Institut für Innovative Technologien GmbH, Außenstelle Halle, Germany

Dommann, A., Institut für Mikrosystemtechnik, Buchs, Schweiz

Donnet, M., Ecole Polytechnique Fédéral de Lausanne, Lausanne, Switzerland

Döring, R., Chemnitzer Werkstoffmechanik GmbH, Chemnitz, und Fraunhofer IZM, Berlin, Germany

Dorn, L., TU Berlin, Institutsbereich Fügetechnik und Beschichtungstechnik, Berlin, Germany

Dost, M., Chemnitzer Werkstoffmechanik GmbH, Chemnitz, Germany

Dötzel, W., Chemnitz University of Technology, Faculty of Electrical Engineering and Information Technology, Chemnitz, Germany

Dragosits, K., TU Vienna, Institute for Microelectronics, Vienna, Austria

Dudek, R., Fraunhofer IZM Berlin, Dept. Mechanical Reliability and Micro Materials, Berlin and Chemnitz, Germany

Eberle, A., Bundesanstalt für Materialforschung und –prüfung, Berlin, Germany

Ebersberger, B., Infineon Technologies AG, Failure Analysis, Munich, Germany

Ebling, F., Fraunhofer IZM Berlin, Germany

Ehrfeld, W., Institut für Mikrotechnik Mainz GmbH, Mainz, Germany

Ehrlich, R., Fraunhofer IZM Berlin, Germany

Ehrmann, O., Fraunhofer IZM Berlin, Germany

Einenkel, A., Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH, Freiberg, Germany

Enders, S., Martin-Luther-University, Department of Physics, Halle/Saale, Germany

Engelhardt, M., Infineon Technologies AG, Corporate Research, Erlangen, Germany

Engelmann, G., Fraunhofer IZM Berlin, Germany

Engemann, J., Infineon Technologies AG, Munich, Germany

Erb, R., Chemnitzer Werkstoffmechanik GmbH, Chemnitz, Germany

Ernst, L.J., Delft University of Technology, Faculty of Mechanic Engineering and Marine Technology, Delft, The Netherlands

Ertl, S., University of Ulm, Department of Electron Devices and Circuits, Ulm, Germany

Eterashvili, T., Georgian Technical University, Tbilisi, Georgia

Ettemeyer, A., Dr. Ettemeyer GmbH & Co., Neu-Ulm, Germany

Ettl, G., Ulm University, Div. of Materials, Ulm, Germany

Fahrner, W.R., University of Hagen, Chair of Electronic Devices, Hagen, Germany

Fandel, M., Dornier GmbH, Friedrichshafen, Germany

Fang, H., Institute of Technology, National Key Laboratory of Advanced Welding Production Technology of Harbin, Harbin, China

Fassler, R., Jenoptik Laser.Optik.Systeme GmbH, Jena, Germany

Faupel, F., University of Kiel, Faculty of Engineering, Kiel, Germany

Faust, W., Fraunhofer IZM Berlin, Dept. Mechanical Reliability and Micro Materials, Berlin and Chemnitz, Germany

Fecht, H.-J., University of Ulm, Faculty of Engineering, Materials Division, Ulm, Germany

Fedtke, M., Fraunhofer IZM Berlin, Germany

Feustel, F., Dresden University of Technology, Semiconductor and Microsystemy Technology Lab (IHM) Dresden, Germany

Fiege, G.B.M., Bergische Universität Wuppertal, Lehrstuhl für Elektronik, Wuppertal, Germany

Finn, M., Federal Institute for Materials Research and Testing, Lab. Mechanical Behavior of Advanced Ceramics and Workability, Berlin, Germany

Fischer, Th., WITEGA - Applied Materials Research, Berlin, Germany

Flandre, D., Université catholique de Louvain, Laboratoire de Microélectronique, Louvain-la-Neuve, Belgium

Fleischer, L., GPA Dr. Fleischer und Partner, Lichtenstein, Germany

Flöter, A., Gesellschaft für Diamantprodukte mbH, Ulm, Germany

Foulds, J., Failure Analysis Associates, Menlo Park, USA

Frank, T., TU Ilmenau, Germany

Franke, T., Siemens AG, Corporate Technology, Munich, Germany

Friedel, K., Wroclaw University of Technology, Institute of Microsystems Technoloy, Wroclaw, Poland

Friend, R.H., University of Cambridge, Cavendish Laboratory, Cambridge, Great Britain

Fritz, T., RWTH Aachen, Institute for Materials in Electrical Engineering I, Aachen, Germany

Frohnmeyer, A., Siemens AG, Corporate Technology, and Munich University of Technology, Physics of Electrotechnology, Munich, Germany

Frübing, P., University of Potsdam, Department of Physics, Applied Condensed-Matter Physics, Potsdam, Germany

Frühauf, J., Technical University of Chemnitz, Chemnitz, Germany

Fuc, P., Poznan University of Technology, Poznan, Poland

Fujimoto, K., Osaka University, Graduate School of Engineering, Department of Manufacturing Science, Osaka, Japan

Gajerski, R., University of Mining and Metallurgy, Faculty of Materials Science and Ceramics, Department of Inorganic Chemistry, Krakow, Poland

Gaponenko, N.V., Belarussian State University of Informatics and Radioelectronics, Minsk, Belarus

Garcia, A., INASMET, San Sebastian, Spain

Gärtner, E., Technical University of Chemnitz, Chemnitz, Germany

Gatzen, H.H., Hanover University, Institute for Microtechnology, Hanover, Germany

Gebhardt, S., Fraunhofer-IKTS, Dresden, Germany

Geers, M.G.D., Eindhoven University of Technology, Faculty of Mechanical Engineering, Netherlands Institute for Metals Research, Eindhoven, The Netherlands

Gemeinert, M., Federal Institute for Materials Research and Testing, Lab. Electroceramics, Berlin, Germany

Gemmler, A., Fraunhofer IPA Stuttgart, Germany

Gentzsch, S., Fraunhofer IZM Berlin, Dept. Mechanical Reliability and Micro Materials, Berlin, and AMIC Angewandte Micro-Messtechnik GmbH, Rangsdorf, Germany

Gerhard-Multhaupt, R., University of Potsdam, Department of Physics, Applied Condensed-Matter Physics, Potsdam, Germany

Gessner, T., *Chemnitz University of Technology, Faculty of Electrical Engineering and Information Technology, Chemnitz, Germany
**Fraunhofer IZM Berlin, Dept. Micro Devices and Equipment, Chemnitz, Germany

Gier, A., Institut für Neue Materialien GmbH, Saarbrücken, Germany

Giezelt, T., Forschungszentrum Karlsruhe GmbH, Institut für Materialforschung III, Karlsruhe, Germany

Gillner, A., Fraunhofer-Institut für Lasertechnik, Aachen, Germany

Glickman, E.E., Tel Aviv University, Department of Electrical Engineering – Physical Electronics, Tel Aviv, Israel

Gluche, P., Gesellschaft für Diamantprodukte mbH, Ulm, Germany

Gnaser, H., Universität Kaiserslautern, Institut für Oberflächen- und Schichtanalytik, Kaiserslautern, Germany

Gobronidze, V., Georgian Technical University, Tbilisi, Georgia

Goebbels, J., Bundesanstalt für Materialforschung und –prüfung (BAM), Berlin, Germany

Gogotsi, Y., University of Illinois at Chicago, Department of Mechanical Engineering, Chicago, USA

Goh, T.J., Intel Products, Assembly Technology Development-Malaysia, Kulim, Malaysia

Goldstein, R.V., Russian Academy of Sciences, Institute for Problems in Mechanics, Moscow, Russia

Gollhardt, A., Fraunhofer IZM Berlin, Dept. Mechanical Reliability and Micro Materials, Berlin, Germany

Gombert, A., Fraunhofer Institut für Solare Energiesysteme, Freiburg, Germany

Gotszalk, T.P., Wroclaw University of Technology, Institute of Microsystem Technology, Wroclaw, Poland

Gottfried, K., Chemnitz University of Technology, Zentrum für Mikrotechnologien, Chemnitz, Germany

Grabosch, G., University of Hagen, Chair of Electronic Devices, Hagen, Germany

Grambole, D., Research Centre Rossendorf, Institute of Ion-Beam Physics and Materials Research, Schönfeld-Weißig, Germany

Granström, M., University of Cambridge, Cavendish Laboratory, Cambridge, Great Britain

Grau, P., Martin-Luther-Universität Halle-Wittenberg, FB Physik, Halle, Germany

Greer, A.L., Cambridge University, Department of Materials Science and Metallurgy, UK

Grellmann, W., Martin-Luther-University Halle-Wittenberg, Germany

Griese, H.-J., IZM Fraunhofer Institute for Reliability and Microintegration Berlin, Germany

Grob, A., Universität Augsburg, Institut für Physik, Augsburg, Germany

Grosser, V., Fraunhofer IZM Berlin, Dept. Mechanical Reliability and Micro Materials, Germany

Grossmann, G., Swiss Federal Institute for Materials Testing and Research, Duebendorf, Switzerland

Gruska, B., Sentech Instruments Berlin GmbH, Berlin, Germany

Gudat, W., BESSY mbH Berlin, Berlin, Germany

Günterodt, University of Basel, Department of Physics and Astronomy, Basel, Switzerland

Günther, W., Federal Institute for Materials Research and Testing, Laboratory Electroceramics, Berlin, Germany

Gusakow, G.A., Belarussian State University, Institute of Applied Physics Problems, Minsk, Belarus

Gust, W., Universität Stuttgart, Institut für Metallkunde, Stuttgart, Germany

Güttler, H., DaimlerChrysler Forschungszentrum, Ulm, Germany

Hadrboletz, A., University of Vienna, Institute of Materialphysics, Vienna, Austria

Hager, W., DaimlerChrysler Aerospace AG, Ulm, Germany

Halser, K., Fraunhofer IZM Berlin, Germany

Hammer, R., Freiberger Compound Materials GmbH, Freiberg, Germany

Hanemann, T., Forschungszentrum Karlsruhe GmbH, Institut für Materialforschung III, Karlsruhe, Germany

Hangen, U.D., SURFACE nanoLab, Hueckelhoven, Germany

Hanke, R., Fraunhofer IISA/IZFP, Erlangen/Saarbrücken, Germany

Harnisch, A., Ilmenau Technical University, Department of Glass and Ceramic Technology, Ilmenau, Germany

Harutyunyan, M., State Engineering University of Armenia, Department of Mechanics and Machine Science, Jerewan, Armenia

Hasche, K., Physikalisch-Technische Bundesanstalt Braunschweig und Berlin, Germany

Haschke, M., X-Ray Analytics and Measurement Technology, Taunusstein, Germany

Hauck, T., Motorola GmbH, Munich, Germany

Hauke, T., Martin-Luther-Universität Halle-Wittenberg, FB Physik, EP II, Halle/S., Germany

Haußelt, J., Forschungszentrum Karlsruhe GmbH, Institut für Materialforschung III, Karlsruhe, Germany

Hecht-Mijic, S., Ilmenau Technical University, Department of Glass and Ceramic Technology, Ilmenau, Germany

Heck, W., Forschungszentrum der Alcatel, Stuttgart, Germany

Heeg, J., Dresden University of Technology, Semiconductor and Microsystems Technology Lab (IHM), Dresden, Germany

Heicherle, R., Universität Augsburg, Institut für Experimentalphysik III, Augsburg, Germany

Heiderhoff, R., Bergische Universität Gesamthochschule Wuppertal, Fachbereich Elektrotechnik, Fachgebiet Elektronik, Wuppertal, Germany

Heinze, L., Fraunhofer IZM, Abt. Environmental Engineering, Berlin, Germany

Heinzel, A., Fraunhofer Institut für Solare Energiesysteme, Freiburg, Germany

Helbig, S., University of Applied Sciences Mittweida, Germany

Helneder, H., Wireless Products, Technology Development, Munich, Germany

Heppke, G., TU Berlin, Iwan-N.-Stranski-Institut, Berlin, Germany

Herbert, F., TU Berlin, Institutsbereich Fügetechnik und Beschichtungstechnik, Berlin, Germany

Herms, M., Fraunhofer Institute of Non-destructive Testing, Dresden, Germany

Herr, U., Universität Augsburg, Institut für Physik, Augsburg, Germany

Herringer, J.H., University of South Florida, Department of Physics, Tampa, USA

Herrmann, K., Physikalisch-Technische Bundesanstalt Braunschweig und Berlin, Germany

Herrmann, K.P., Laboratorium für Technische Mechanik, Paderborn, Germany

Hessel, V., Institut für Mikrotechnik Mainz GmbH, Mainz, Germany

Higo, Y., Tokyo Institute of Technology, Precision and Intelligence Laboratory, Tokyo, Japan

Hiller, K., Chemnitz University of Technology, Faculty of Electrical Engineering and Information Technology, Centre of Microtechnology, Chemnitz, Germany

Hillmann, V., Fraunhofer IZM Berlin, Dept. Mechanical Reliability and Micro Materials, Berlin, Germany

Hirsekorn, S., Fraunhofer Institute for Nondestructive Testing, Saarbrücken, Germany

Ho, P.S., The University of Texas at Austin, Laboratory for Interconnect & Packaging, Austin, USA

Hoffmann, R., Chemnitz University of Technology, Zentrum für Mikrotechnologien, Chemnitz, Germany

Holbery, J.D., Centre Suisse d’Electronique et de Microtechnique SA, Neuchatel, Switzerland

Holzbauer, H.-R., WITEGA - Applied Materials Research, Berlin, Germany

Hombach, V., University of Ulm, Ulm, Germany

Hopp, B., Hungarian Academy of Sciences, Research Group on Laser Physics, Budapest, Hungary

Horecka, L., Czech Technical University Prague, Faculty of Civil Engineering, Prague, Czech Rep.

Hoyer, W., Chemnitz University of Technology, Institute of Physics, Chemnitz, Germany

Huang, B., Indium Corporation of America, Clinton, USA

Huber, N., Forschungszentrum Karlsruhe Technik und Umwelt, Institut für Materialforschung II, Karlsruhe, Germany

Hübner, Ch., Martin-Luther-Universität Halle-Wittenberg, Halle/S., Germany,

Hülsenberg, D., Ilmenau Technical University, Department of Glass and Ceramic Technology, Ilmenau, Germany

Hüntrup, V., Universität Karlsruhe, Institut für Werkzeugmaschinen und Betriebstechnik, Karlsruhe, Germany

Ianev, V., Technical University Ilmenau, Faculty of Mechanical Engineering, Department of Microsystem Technology, Ilmenau, Germany

Ichikawa, Y., Tokyo Institute of Technology, Precision and Intelligence Laboratory, Tokyo, Japan

Ichilov, O., Telrad Communication and Electronic Industries Ltd., Lod, Israel

Illerhaus, B., Bundesanstalt für Materialforschung und –prüfung (BAM), Berlin, Germany

Illgner, J., Deutsche Bank AG, Microtechnology Innovation Team, Berlin, Germany

Im, J.S., Columbia University, USA

Inasaki, I. , Keio University, Yokohama, Japan

Inoue, A., Tohoku University, Department of Mechanical Engineering, Sendai, Japan

Ishikawa, H., University of Electro Communications, Tokyo, Japan

Ismagilova, A.S., Kazan State Technological University, Departement of Synthetic Rubber, Kazan, Russia

Itoh, T., The University of Tokyo, Research Center for Advanced Science and Technology (RCAST), Tokyo, Japan

Iwamoto, N.E., Allied Signal, Electronic Materials, San Diego, USA

Iwazaki, H., Gunma University, Graduate School, Kiryu, Japan

Jackman, R., King‘s College, London, Great Britain

Jakschik, S., Dresden University of Technology, Semiconductor and Microsystems Technology Lab (IHM), Dresden, Germany

Janssen, J., Philips, Eindhoven, The Netherlands

Jäntsch, E., Technical University of Chemnitz, Chemnitz, Germany

Janus, P., Wroclaw University of Technology, Institute of Microsystem Technology, Wroclaw, Poland

Jedicke, O., Fraunhofer Institut für Chemische Technologie, Pfinztal-Berghausen, Germany

Jendrny, J. , Universität Paderborn, Laboratorium für Werkstoff- und Fügetechnik, Paderborn, Germany

Jeon, E.-c., Seoul National University, School of Materials Science and Engineering, Seoul, Korea

Jeong, A., Seoul National University, School of Materials Sciences and Engineering, Seoul, Korea

Jeong, J.-h., Seoul National University, School of Materials Sciences and Engineering, Seoul, Korea

Jiruše, J., Brno University of Technology, Institute of Physical Engineering, Brno, Czech Republic

Jishiashvili, D., Georgian Technical University, Tbilisi, Georgia

Job, R., University of Hagen, Chair of Electronic Devices, Hagen, Germany

Johansen, H., Max-Planck-Universität für Mikrostrukturphysik, Halle, Germany

John, L.-G., VDI/VDE Technologizentrum Informationstechnik GmbH, Teltow, Germany

Johnson, W.L., California Institute of Technology, Pasadena, USA

Johnston, C., AEA Technology plc., Didcot, U.K.

Jordan, M., Schlötter, Geislingen, Germany

Jung, Ch., BESSY mbH Berlin, Berlin, Germany

Jurczyk, M., Poznan University of Technology, Institute of Materials Science and Engineering, Poznan, Poland

Jurisch, M., Freiberger Compound Materials GmbH, Freiberg, Germany

Kahle, O., Fraunhofer Institute for Reliability and Microintegration, Branch Lab EPC Teltow, Germany

Kaindl, G., University Vienna, Institute of Materialphysics, Vienna, Austria

Kalleder, A., Institut für Neue Materialien GmbH, Saarbrücken, Germany

Kallenbach, E., TU Ilmenau, Germany

Kallenbach, M., TU Ilmenau, Germany

Kalnowski, G., TU Berlin, Institut für Techn. Umweltschutz, FG Umweltmikrobiologie und Technische Hygiene, Berlin, Germany

Kalousek, R., Brno University of Technology, Brno, Czech Republic

Kamiya, S., Tohoku University, Department of Mechanical Engineering, Sendai, Japan

Kämpfe, A., Universität Karlsruhe (TH), Institut für Werkstoffkunde I, Karlsruhe, Germany

Kämpfe, B., Fraunhofer IZM Berlin, Dept. Mechanical Reliability and Micro Materials, Berlin, Germany

Karpen, W., Fraunhofer Institute for Nondestructive Testing, Saarbruecken, Germany

Kassem, M.E., Assiut University, Engineering Faculty, Assiut, Egypt

Kassing, R., University of Kassel, Institute of Microsystem Technologies and Analytics, Kassel, Germany

Kataoka, K., The University of Tokyo, Research Center for Advanced Science and Technology (RCAST), Tokyo, Japan

Katzer, D., Fraunhofer IWM Freiburg und Halle, Germany

Kaufmann, C., Chemnitz University of Technology, Faculty of Electrical Engineering and Information Technology, Chemnitz, Germany

Kaulfersch, E., Fraunhofer IZM Berlin, Dept. Mechanical Reliability and Micro Materials, Berlin, Germany

Kawamura, Y., Tohoku University, Institute for Materials Research, Sendai, Japan

Kehr, K., Chemnitz University of Technology, Faculty of Electrical Engineering and Information Technology, Chemnitz, Germany

Keoschkerjan, R., Technische Universität Ilmenau, Fachgebiet Mikrosystemtechnik, Ilmenau, Germany

Kester, E., Fraunhofer Institute for Nondestructive Testing, Saarbrücken, Germany

Khatibi, G., University of Vienna, Institute of Materialphysics, Vienna, Austria

Khoperia, T.N., Georgian Academy of Sciences, Institute of Physics, Tbilisi, Georgia

Kiasat, M.S., Delft University of Technology, Faculty of Design, Engineering and Production, Delft, The Netherlands

Kiene, M., The University of Texas at Austin, Laboratory for Interconnect & Packaging, Austin, USA

Kiene, M., Universität Kiel, Technische Fakultät, Lehrstuhl für Materialkunde, Kiel, Germany

Kieselstein, E., Chemnitzer Werkstoffmechanik GmbH, Chemnitz, Germany

Kikuchi, K., Mechanical Engineering Laboratory, Agency of Industrial Science and Technology, Ministry of International Trade and Industry, Tsukuba, Japan

Kim, D.W., Seoul National University, School of Materials Science and Engineering, Seoul, Korea

Kim, J.-j., Seoul National University, School of Materials Scienses and Engineering, Seoul, Korea

Kim, Y.-J., Samsung Electronic Co., Ltd., Corporate R & D Center, Opto-Mechatronics Lab., Suwon City, Korea

Kinuta, S., Optonics precision Co., Ltd.

Kishimoto, K., Tokyo Institute of Technology, Department of Mechanical and Intelligent Systems Engineering, Tokyo, Japan

Kitada, T., Osaka University, Graduate School of Engineering, Department of Manufacturing Science, Osaka, Japan

Klauß, H.-J., Institute of Solid State and Materials Research, Dresden, Germany

Kleine-Besten, T., Physikalisch-Technische Bundesanstalt Braunschweig, Braunschweig, Germany

Knöfler, R., TU Chemnitz, Zentrum für Mikrotechnologien, Chemnitz, Germany

Knoll, H., Fraunhofer IWM Freiburg und Halle, Germany

Know, D., Seoul National University, School of Materials Science and Engineering, Seoul, Korea

Knüwer, M., Fraunhofer Institute Production Technology and Materials Research, Bremen, Germany

Kobelev, N.P., Institute of Solid State Physics, Chernogolovka, Russia

Kocdemir, B., University of Ulm, Faculty of Engineering, Department of Materials, Ulm, Germany

Koch, T., Vienna University of Technology, Institute of Materials Science and Testing, Vienna, Austria

Kohl, P.A., Georgia Institute of Technology, School of Chemical Engineering, Packaging Research Center, Atlanta, USA

Köhler, A., University of Cambridge, Cavendish Laboratory, Cambridge, Great Britain

Köhler, T., Deutsche Bank AG, Microtechnology Innovation Team, Berlin, Germany

Kohn, E., University of Ulm, Department of Electron Devices and Circuits, Ulm, Germany

Kolawa, E., Jet Propulsion Laboratory, USA

Kolleck, A., Technische Universität Hamburg-Harburg, Advanced Ceramics Group, Hamburg, Germany

Komai, K., Kyoto University, Department of Mechanical Engineering, Kyoto, Japan

Köpp, N., VEW Vereinigte Elektronikwerkstätten GmbH, Bremen, Germany

Körber, K., Laser Zentrum Hannover e.V., Hannover, Germany

Korczynski, E., Tru-Si Technologies, Sunnyvale, USA

Körner, H., Wireless Products, Technology Development, Munich, Germany

Korolkow, O., Tallinn Technical University, Department of Electronics, Tallinn, Estonia

Kosaca, G.C., University of Hagen, Department of Electronic Devices, Hagen, Germany

Kosobutskyy, Y., The University Lvivska Polytechnika, Lviv, Ukraine

Kouznetsov, V.L., The Moscow State Technical University of Civil Aviation, Moscow, Russia

Kouznetsova, V., Eindhoven University of Technology, Faculty of Mechanical Engineering, The Netherlands Institute for Metals Research, Eindhoven, The Netherlands

Krabe, D., Fraunhofer IZM Berlin, Germany

Kraft, O., Max-Planck-Institut für Metallforschung und Universität Stuttgart, Institut für Metallkunde, Stuttgart, Germany

Král, J., Department of Physical Electronics, Czech Technical University, Prague, Czech Republic

Kramer, T., Fraunhofer-Institut für Lasertechnik, Aachen, Germany

Krause, F., Fraunhofer IZM Berlin, Germany

Krause-Rehberg, R., Martin-Luther-Universität Halle-Wittenberg, Fachbereich Physik, Halle/S., Germany

Kreher, W.S., Technische Universität Dresden, Institut für Werkstoffwissenschaft, Dresden, Germany

Kreutzer, R., Institut für Neue Materialien GmbH, Saarbrücken, Germany

Kriwanek, J., WITEGA - Applied Materials Research, Berlin, Germany

Krüger, C., RWTH Aachen, Institute for Materials in Electrical Engineering I, Germany

Krüger, H., Fraunhofer Institute for Reliability and Microintegration, Branch Polymeric Materials and Composites, Teltow, Germany

Krujatz, J., TU Chemnitz, Zentrum für Mikrotechnologien, Chemnitz, Germany

Kubalek, E., Gerhard-Mercator-Universität Duisburg, Werkstoffe der Elektrotechnik, Germany

Kübler, V., Fraunhofer Institut für Solare Energiesysteme, Freiburg, Germany

Kucera, U., Ilmenau Technical University, Department of Actuators, Ilmenau, Germany

Küchler, M., TU Chemnitz, Zentrum für Mikrotechnologien, Chemnitz, Germany

Kühnert, R., Kühnert & Tränkner Meßsysteme GmbH Chemnitz, Germany

Kullenberg, E., Fraunhofer IZFP, Saarbrücken, Germany

Kuna, M., Freiberg University of Mining and Technology, Institute of Mechanics and Machine Components, Freiberg, Germany

Kunath-Fandrei, G., Carl Zeiss Jena GmbH, Jena, Germany

Kurel, R., Tallinn Technical University, Department of Electronics, Tallinn, Estonia

Kurosawa, Y., Gumna University, Graduate School, Kiryu, Japan

Kurth, S., TU Chemnitz, Zentrum für Mikrotechnologien, Chemnitz, Germany

Kuschel, F., MLS GmbH Leuna, Germany

Kusterer, J., University of Ulm, Ulm, Germany

Kwon, D., Seoul National University, School of Materials Science and Engineering, Seoul, Korea

Kynak, C., Middle East Technical University, Department of Polymer Science and Technology, Ankara, Turkey

Labus, S., University of Mining and Metallurgy, Faculty of Materials Science and Ceramics, Department of Inorganic Chemistry, Krakow, Poland

Lambert, D., Bull, VLSI Packaging, Les Clais-sous-Bois, France

Lammel, G., Swiss Federal Institute of Technology, Institute of Microsystems, Lausanne, Switzerland

Lang, G., Fraunhofer IZM, Berlin, Germany

Lang, G.-K., University of Ulm, Ulm, Germany

Lang, K.-D., Fraunhofer IZM, Berlin, Germany

Lazarouk, S., Belarussian State University of Informatics and Radioelectronics, Minsk, Belarus

Lee, C., Mechanical Engineering Laboratory, Surface and Interface Technology Division, Tsukuba, Japan

Lee, K.-R., Korea Institute of Science and Technology, Thin Films Technology Research Center, Seoul, Korea

Lee, N.-C., Indium Corporation of America, Clinton, USA

Leester-Schädel, M., TU Braunschweig, Institut für Mikrotechnik, Braunschweig, Germany

Lefranc, G., Siemens AG, Corporate Technology, Munich, Germany

Lefu, Z., Huazhong University of Science and Technology, Department of Materials, Wuhan, P.R. China

Legewie, F., Fraunhofer-Institut für Lasertechnik, Aachen, Germany

Leonhard, W., Fraunhofer IPA, Stuttgart, Germany

Leshok, A., Belarussian State University of Informatics and Radioelectronics, Minsk, Belarus

Leue, A., Universität Augsburg, Institut für Experimentalphysik III, Germany

Leuerer, T., RWTH Aachen, Institute for Materials in Electrical Engineering I, Aachen, Germany

Leutenbauer, R., Fraunhofer IZM, Berlin, Germany

Levin, V.M., Institute of Biochemical Physics, Moscow, Russia

Libera, J., University of Illinois at Chicago, Department of Mechanical Engineering, Chicago, USA

Licht, T., eupec GmbH, Warstein, Germany

Lin, W.-M., Mechanical Engineering Laboratory, Surface and Interface Technology Division, Tsukuba, Japan

Linsenfelder, C., Gesellschaft für Diamantprodukte mbH, Ulm, Germany

Liu, J., IVF Mölndal, Sweden

Liyi, C., Graduate School of Chiba University, Chiba, Japan

Lo,K.W., The National University of Singapore, Department of Civil Engineering, Singapore

Löbner, B., Chemnitz University of Technology, Center of Microtechnologies, Chemnitz, Germany

Löhe, D., Universität Karlsruhe (TH), Institut für Werkstoffkunde I, Karlsruhe, Germany

Loheide, S., Physikalisch-Technische Bundesanstalt Braunschweig, Braunschweig, Germany

Lopour, F., Brno University of Technology, Brno, Czech Republic

Lorenz, D., Martin-Luther-Universität Halle-Wittenberg, FB Physik, Halle, Germany

Lötzsch, D., WITEGA - Applied Materials Research, Berlin, Germany

Löwe, H., Institut für Mikrotechnik Mainz GmbH, Mainz, Germany

Lu, J., Université de Technologie de Troyes, LASMIS, GSM, Troyes, France

Lugert, G., Siemens AG, AT PT EL Innovation Center, Germany

Luniak, M., Dresden University of Technology, Electronics Technology Laboratory, Dresden, Germany

Lütke-Notarp, D., University of Bremen, Bremen, Germany

Lux, F.A., Berlin, Germany (The work was done at the Intelligent Polymer Research Institute, Wollong University, Australia)

Ma, B., National Starch and Chemical Company, Bridgewater, USA

Macht, M.-P., Hahn-Meitner-Institut, Berlin, Germany

Maeda, R., Mechanical Engineering Laboratory, Head of Surface and Interface Technology Division, AIST, MITI, Tsukuba, Japan

Mahlich, M., University of Ulm, Faculty of Engineering, Department of Materials, Ulm, Germany

Malecki, A., University of Mining and Metallurgy, Faculty of Materials Science and Ceramics, Department of Inorganic Chemistry, Krakow, Poland

Malyshev, S.A., National Academy of Sciences of Belarus, Institute of Electronics, Minsk, Belarus

Mapledoram, L., AEA Technology plc., Harwell, Didcot, U.K.

Mariella., R.P.Jr., Lawrence Livermore National Laboratory, Livermore, USA

Marissen, R., Delft University of Technology, Faculty of Design, Engineering and Production, Delft, The Netherlands

Masuda, K., Tokyo Institute of Technology, Department of Mechanical and Intelligent Systems Engineering, Tokyo, Japan

Matêjka, F., Brno University of Technology, Brno, Czech Republic

Maurer, D., Universität Augsburg, Institut für Experimentalphysik III, Augsburg, Germany

McCluskey, P., University of Maryland, CALCE, College Park, USA

Meakawa, S., Tokyo Institute of Technology, Precision and Intelligence Laboratory, Tokyo, Japan

Mechler, S., Hahn-Meitner-Institut, Berlin, Germany

Mehner, J., Chemnitz University of Technology, Faculty of Electrical Engineering and Information Technology, Chemnitz, Germany

Meier, P., Fraunhofer IZM, Berlin, Germany

Melbert, J., Ruhr-University Bochum, Institute for Electronic Circuits and Measurement, Bochum, Germany

Melov, V.G., Fraunhofer Institute of Non-destructive Testing, Dresden, Germany

Memhard, D., Fraunhofer IWM Freiburg und Halle, Germany

Menelao, F., Physikalisch-Technische Bundesanstalt Braunschweig und Berlin, Germany

Mennig, M., Institut für Neue Materialien GmbH, Saarbrücken, Germany

Mertin, W., Gerhard-Mercator-Universität Duisburg, Werkstoffe der Elektrotechnik, Duisburg, Germany

Meusel, E., Dresden University of Technology, Semiconductor and Microsystems Technology Lab (IHM), Dresden, Germany

Meyendorf, N., Fraunhofer Institute for Nondestructive Testing, Saarbruecken, Germany

Meyer-Piening, H.-R., Swiss Federal Institute of Technology, Institute of Lightweight Structures and Ropeways, ETH-Zentrum, Zürich, Switzerland

Michel, B., Fraunhofer IZM Berlin, Dept. Mechanical Reliability and Micro Materials, Berlin, Germany

Michel, F., Institut für Mikrotechnik Mainz GmbH, Mainz, Germany

Michel, M., Chemnitz University of Technology, Chemnitz, Germany

Mießner, R., Technische Universität Berlin, Forschungsschwerpunkt Technologien der Mikroperipherik, Berlin, Germany

Mietke, S., Deutsche Bank AG, Core, Microtechnology Innovation Team, Berlin, Germany

Miller, M.R., University of Texas at Austin, Laboratory for Interconnect and Packaging, Austin, USA

Minoshima, K., Kyoto University, Department of Mechanical Engineering, Kyoto, Japan

Mitic, G., Siemens AG, Corporate Technology, Munich, Germany

Mitic, V.V., University of Nis, Serbian Academy of Sciences and Arts, Belgrade, Yugoslavia

Mitrovic, I., University of Nis, Serbian Academy of Sciences and Arts, Belgrade, Yugoslavia

Mohammed, I., University of Texas at Austin, Laboratory for Interconnect and Packaging, Austin, USA

Mojzes, I., Technical University of Budapest, Dept. of Electronics Technology, Budapest, Hungary

Mokwa, W., RWTH Aachen, Institute for Materials in Electrical Engineering I, Germany

Mollenhauer, O., Tetra GmbH Ilmenau, Germany

Morida, N., Chiba University, Department of Electronics and Mechanical Engineering, Chiba, Japan

Morozov, N., Institute of Mathematics and Mechanics, St. Petersburg, Russia

Morris, J.E., State University of New York at Binghamton, T.J. Watson School of Engineering & Applied Science, Department of Electrical Engineering, Binghamton, USA

Mrosk, J., University of Ulm, Faculty of Engineering, Department of Materials, Ulm, Germany

Mrotzek, S., Ilmenau Technical University, Department of Glass and Ceramic Technology, Ilmenau, Germany

Mücke, U., Federal Institute for Materials Research and Testing, Laboratory Metallography, Ceramography and Stereography, Berlin, Germany

Mudryi, A.V., Academy of Sciences of Belarus, Institute of Physics of Solids and Semiconductors, Minsk, Belarus

Müller, J., IZM Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany

Müller, T., University of Applied Science Mittweida, Germany

Müller, V., Universität Augsburg, Institut für Experimentalphysik III, Augsburg, Germany

Müller, W.H. , Heriot-Watt University, Department of Mechanical and Chemical Engineering, Edinburgh, Great Britain

Müllers, J., DaimlerChrysler Research Dornier GmbH, Friedrichshafen, Germany

Murakoshi, Y., Mechanical Engineering Laboratory, Surface and Interface Technology Division, Tsukuba, Japan

Myhra, S., Griffith University, School of Science, Nathan, Australia

Nakagawa, M., Colorado School of Mines, Particulate Sciences and Technology Group, Golden, USA

Nakagawa, S., Okayama University of Science, Graduate School of Science, Okayama, Japan

Nakano, S., Mechanical Engineering Laboratory, AIST, MITI, Tsukuba, Japan

Nakata, S., Osaka University, Graduate School of Engineering, Department of Manufacturing Science, Osaka, Japan

Nakladal, A., Technische Universität Dresden, Institut für Festkörperelektronik, Dresden, Germany

Nathan, M., Tel Aviv University, Department of Electrical Engineering – Physical Electronics, Tel Aviv, Israel

Nebojsa, A., Masaryk University, Laboratory of Thin Films and Nanostructures, Brno, Czech Republic

Needleman, A., Brown University, Division of Engineering, Providence, USA

Nellen, Ph.M., EMPA, Swiss Federal Laboratories for Materials Testing and Research, Dübendorf, Switzerland

Nenov, T., Technical University of Gabrovo, Gabrovo, Bulgaria

Netzelmann, U., Fraunhofer Institute for Nondestructive Testing, Saarbruecken, Germany

Nguyen, S.v., Laboratorium für Technische Mechanik, Paderborn, Germany

Niedernostheide, F.-J., Siemens AG, Corporate Technology, Munich, Germany

Niefanger, R., Technische Universität Hamburg-Harburg, Advanced Ceramics Group, Hamburg, Germany

Nieland, C., TU Berlin, Center of Microperipherics, Berlin, Germany

Nienhaus, M., Institut für Mikrotechnik Mainz GmbH, Mainz, Germany

Nonninger, R., Institut für Neue Materialien GmbH, Saarbrücken, Germany

Oblakowski, J., University of Mining and Metallurgy, Faculty of Materials Science and Ceramics, Department of Inorganic Chemistry, Krakow, Poland

Oesterschulze, E., University of Kassel, Department of Physics, Institute for Microstructure Technology and Analytics (IMA), Kassel, Germany

Ogiso, H., Mechanical Engineering Laboratory and National Institute for Advanced Interdisciplinary Research, AIST, MITI, Tsukuba, Japan

Ogitani, S., Asahi Chemical Industry Co., Ltd.

Olbrich, A., Infineon Technologies AG , Failure Analysis CFE FA 5, Munich, Germany

Olowinsky; A., Fraunhofer-Institut für Lasertechnik, Aachen, Germany

Omiya, M., Tokyo Institute of Technology, Department of Mechanical and Intelligent Systems Engineering, Tokyo, Japan

Onate, J.I., INASMET, San Sebastian, Spain

Onraet, S., Eindhoven University of Technology, Mechanical Engineering, Materials Technology, Eindhoven, The Netherlands

Oppert, T., Packaging Technologies GmbH, Nauen, Germany

Orawski, W., Wroclaw University of Technology, Institute of Microsystem Technology, Wroclaw, Poland

Orth, K., University of Ulm, Ulm, Germany

Osten, W., BIAS Bremer Institut für Angewandte Strahltechnik, Bremen, Germany

Ostmann, A., TU Berlin, Center of Microperipherics, Berlin, Germany

Otto, T., Fraunhofer IZM, Chemnitz, Germany

Outkina, E.A., Belarussian State University of Informatics and Radioelectronics, Minsk, Belarus

Pageler, A., University of Bremen, Institute for Materials Science and Structure Research, Germany

Palankovski, V., TU Vienna, Institute for Microelectronics, Vienna, Austria

Pang, J.H.L.., Nanyang Technological University, School of Mechanical & Production Engineering, Singapore

Paproth, A., TU Dresden, Fakultät Elektrotechnik, Institut für Elektronik-Technologie, Germany

Parameswaran, V., University of Rhode Island, Department of Mechanical Engineering and Applied Mechanics, Kingston, USA

Parfenov, V.V., Kazan State University, Department of Physics, Kazan, Russia

Parkoun, V., Belarussian State University of Informatics and Radioelectronics, Minsk, Belarus

Paschschwöll, H., Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH, Freiberg, Germany

Pászti, Z., Research Institute for Technical Physics and Materials Science of the Hungarian Academy of Science, Hungary

Paszula, J., Military University of Technology, Faculty of Armament and Aviation Technology, Poland

Patuelli, C., Universita‘ di Bologna, Dipartimento di Fisica ed Instituto Nationale di Fisica della Materia, Bologna, Italy

Patzak, A. , WITEGA - Applied Materials Research, Berlin, Germany

Paulasto, M., Motorola GmbH, Munich, Germany

Pavelka, T., Semiconductor Physics Laboratory RT, Budapest, Hungary

Pedrak, R., Institute of Microsystem Technology, Wroclaw University of Technology, Wroclaw, Poland

Peerlings, R.H.J., Eindhoven University of Technology, Faculty of Mechanical Engineering, Eindhoven, The Netherlands

Peichl, A., Universität Karlsruhe, Institut für Werkstoffkunde I, Karlsruhe, Germany

Petkovic, P., University of Nis, Serbian Academy of Sciences and Arts, Belgrade, Yugoslavia

Petzold, M., Fraunhofer Institut für Werkstoffmechanik Halle, Germany

Pickles, C.S.J., DeBeers Industrial Diamond Division Ltd., Sunninghill, Great Britain

Pikkov, M., Tallinn Technical University, Department of Electronics, Tallinn, Estonia

Piotter, V., Forschungszentrum Karlsruhe GmbH, Institut für Materialforschung III, Karlsruhe, Germany

Pitkin, A., Marine Technical University, St. Petersburg, Russia

Ple, O., Ecole normale Superieure de Cachan, Laboratoire de Mecanique et Technologie, Cachan, France

Ploog, K.H., PDI, Berlin, Germany

Poech, M.H., Fraunhofer-Institut für Siliziumtechnologie, Itzehoe, Germany

Pohlenz, F., Physikalisch-Technische Bundesanstalt Braunschweig und Berlin, Germany

Poon, W.K., Nanyang Technological University, Singapore

Poplavko, Y., National Technical University of Ukraine, Kiev, Ukraine

Popp, P., Fraunhofer Institut für Solare Energiesysteme, Freiburg, Germany

Poprawe, R., Fraunhofer-Institut für Lasertechnik, Aachen, Germany

Priesnitz, U., MTS Berlin, Germany

Prinz, F.B., Stanford University, Rapid Prototyping Lab., Stanford, USA

Prochowska-Klisch, B., University of Mining and Metallurgy, Faculty of Materials Science and Ceramics, Department of Inorganic Chemistry, Krakow, Poland

Prokhorov, V.M., Technological Institute for Superhard and Novel Carbon Materials, Moscow, Russia

Prokopenko, Y., National Technical University of Ukraine, Kiev, Ukraine

Pyzalla, A., Hahn-Meitner-Institut, Abt. Strukturforschung, Berlin, Germany

Qi, W., GKSS Research Center, Institute of Materials Research, Geesthacht, Germany

Qian, Y., Harbin Institute of Technology, National Key Laboratory of Advanced Welding Production Technology, Harbin, China

Rabe, U., Fraunhofer Institute for Nondestructive Testing, Saarbrücken, Germany

Radojewski, J., Wroclaw University of Technology, Institute of Microsystem Technology, Wroclaw, Poland

Ramminger, S., Siemens AG, Corporate Technology, Munich, Germany

Ranatowski, E., Technical University Mechanical Department, Bydgoszcz, Poland

Rang, T., Tallinn Technical University, Department of Electronics, Tallinn, Estonia

Raschke, T., TU Chemnitz, Chemnitz, Germany

Rehme, F., DaimlerChrysler Aerospace AG, Ulm, Germany

Rehmer, B., Federal Institute for Materials Reseach and Testing, Lab. Mechanical Behavior of Advanced Ceramics and Workability, Berlin, Germany

Reichl, H., Fraunhofer IZM Berlin and TU Berlin, Center of Microperipherics, Berlin, Germany

Reimers, W., Hahn-Meitner-Institut, Abt. Strukturforschung, Berlin, Germany

Reitlinger, C.E., University of Bayreuth, Department of Metallic Materials, Bayreuth, Germany

Renaud, P., Swiss Federal Institute of Technology, Institute of Microsystems, Lausanne, Switzerland

Renaux, C., Université catholique de Louvain, Laboratoire de Microélectronique, Louvain-la-Neuve, Belgium

Rentsch, A., DaimlerChrysler AG, Research and Technology, Frankfurt, Germany

Richter, H.P., University of Ulm, Ulm, Germany

Richter, Th., Institut für Mikrotechnik Mainz GmbH, Mainz, Germany

Ricoeur, A., Freiberg University of Mining and Technology, Institute of Mechanics and Machine Components, Freiberg, Germany

Riepl, T., Siemens AG, AT PT EL Innovation Center, Regensburg, Germany

Riesemeier, H., Bundesanstalt für Materialforschung und –prüfung (BAM), Berlin, Germany

Ripka, G., Technical University of Budapest, Dept. of Electronics Technology, Budapest, Hungary

Romanova, L.I., National Academy of Sciences of Belarus, Institute of Electronics, Minsk, Belarus

Roosen, A., University of Erlangen-Nuremberg, Dept. Glass and Ceramics, Erlangen, Germany

Rösch, R., Gesellschaft für Diamantprodukte mbH, Ulm, Germany

Rümmler, N., Amitronics Angewandte Mikromechatronik GmbH, München, Germany

Ruprecht, R., Forschungszentrum Karlsruhe GmbH, Institut für Materialforschung III, Karlsruhe, Germany

Rzepka, F., Dresden University of Technology, Semiconductor and Microsystems Technology Lab (IHM), Dresden, Germany

Sadowski, T., Technical University of Lublin, Faculty of Mechanical Engineering, Lublin, Poland

Saglam, E.S., Middle East Technical University, Department of Polymer Science and Technology, Ankara, Turkey

Saka, M., Tohoku University, Department of Mechanical Engineering, Sendai, Japan

Samborski, S., Technical University of Lublin, Faculty of Mechanical Engineering, Lublin, Poland

Samwer, K., Universität Göppingen, I. Physikalisches Institut, Göttingen, Germany

Sändig, T., Technical University Ilmenau, Faculty of Mechanical Engineering, Department of Microsystem Technology, Ilmenau, Germany

Sano, T., Mechanical Engineering Laboratory, Surface and Interface Technology Division, Tsukuba, Japan

Saotome, Y., Gunma University, Department of Mechanical Engineering, Kiryu, Japan

Sato, H., Mechanical Engineering Laboratory, AIST, MITI, Tsukuba, Japan

Savastiouk, S., Tru-Si Technologies, Sunnyvale, USA

Savoca, A., National Starch and Chemical Company, Bridgewater, USA

Schäfer, W., Dornier GmbH, Friedrichshafen, Germany

Schaper, M., Technical University Dresden, Institute of Materials Research, Dresden, Germany

Scheibe, H.-J., Fraunhofer Institut für Werkstoff- und Strahltechnik, Dresden, Germany

Scherer, V., Fraunhofer IZFP, Saarbrücken, Germany

Scherzer, M., Freiberg University of Mining and Technology, Institute of Mechanics and Machine Components, Freiberg, Germany

Schiemann, K., Gerhard-Mercator-Universität Duisburg, Werkstoffe der Elektrotechnik, Duisburg, Germany

Schiewe, J., Institut für Mikrotechnik Mainz GmbH, Mainz, Germany

Schiller, W.A., Federal Institute for Materials Research and Testing, Laboratory Electroceramics, Berlin, Germany

Schilling, C., TU Ilmenau, Germany

Schlimmer, M., Universität Gh Kassel, Institut für Werkstofftechnik, Kassel, Germany

Schmid, P., University of Ulm, Department of Electron Devices and Circuits, Ulm, Germany

Schmidt, G., Infineon Technologies AG, Corporate Research, Erlangen, Germany

Schmidt, H., Institut für Neue Materialien GmbH, Saarbrücken, Germany

Schnakenberg, U., RWTH Aachen, Institute for Materials in Electrical Engineering I, Aachen, Germany

Schneider, D., Fraunhofer-Institut für Werkstoff- und Strahltechnik, Dresden, Germany

Schneider, G.A., Technische Universität Hamburg-Harburg, Advanced Ceramics Group, Hamburg, Germany

Schneider, H., Forschungszentrum Karlsruhe Technik und Umwelt, Institut für Materialforschung II, Karlsruhe, Germany

Schneider, J., WITEGA - Applied Materials Research, Berlin, Germany

Schneider, W., Microelectronic Packaging Dresden GmbH, Dresden, Germany

Schnitzer, R., Chemnitzer Werkstoffmechanik GmbH, Chemnitz, Germany

Schönecker, A., Fraunhofer-IKTS, Dresden, Germany

Schreiber, J., Fraunhofer Institute of Non-destructive Testing Dresden, Germany

Schrenk, M., Wireless Products, Technology Development, Munich, Germany

Schröter, B., Chemnitz University of Technology, Faculty of Electrical Engineering and Information Technology, Chemnitz, Germany

Schroth, A.,, Mechanical Engineering Laboratory, Surface and Interface Technology Division, Tsukuba, Japan

Schubach, H., Dr. Ettemeyer GmbH & Co., Neu-Ulm, Germany

Schubert, A., Fraunhofer IZM, Dept. Mechanical Reliability and Micro Materials, Berlin, Germany

Schulgow, W., Belarussian State University of Informatics and Radioelectronics, Minsk, Belarus

Schultrich, B, Fraunhofer-Institut für Werkstoff- und Strahltechnik, Dresden, Germany

Schulze, H.-J., Siemens AG, Corporate Technology, Munich, Germany

Schulze, V., Universität Karlsruhe, Institut für Werkstoffkunde I, Karlsruhe, Germany

Schwaiger, R., Max-Planck-Institut für Metallforschung und Institut für Metallkunde, Universität Stuttgart, Stuttgart, Germany

Schwarz, B., Siemens AG, Berlin, Germany

Schwarz, T., Fraunhofer-Institut für Werkstoff- und Strahltechnik, Dresden, Germany

Schwencke, B., IZM Fraunhofer Institute for Reliability and Microintegration Berlin, Germany

Schwerd, M., Wireless Products, Technology Development, Munich, Germany

Schwesinger, N., Technical University Ilmenau, Faculty of Mechanical Engineering, Department of Microsystem Technology, Ilmenau, Germany

Seeboth, A., WITEGA - Applied Materials Research, Berlin, Germany

Seemann, R., Physikalisch-Technische Bundesanstalt Braunschweig und Berlin, Germany

Seffner, L., Fraunhofer-IKTS, Dresden, Germany

Seidel, H., TEMIC Microsystems München, München, Germany

Seidel, M., Hahn-Meitner-Institut, Berlin, Germany

Seidel, U., Wireless Products, Technology Development, Munich, Germany

Seidler, S., Vienna University of Technology, Institute of Materials Science and Testing, Vienna, Austria

Seifert, W., Martin-Luther-Universität Halle-Wittenberg, FB Physik, EP II, Halle/S., Germany

Seifert, W., Fachhochschule Münster, Electrical Engineering, Microsensor Lab., Münster, Germany

Seiler, B., Chemnitzer Werkstoffmechanik GmbH, Chemnitz, Germany

Seitz, E., Forschungszentrum Jülich GmbH, Projectmanagement Organization New Materials and Chemical Technologies (NMT), Jülich, Germany

Selberherr, S., TU Vienna, Institute for Microelectronics, Vienna, Austria

Seliger, N., Siemens AG, Corporate Technology, Munich, Germany

Sennhauser, U., EMPA, Swiss Federal Laboratories for Materials Testing and Research, Dübendorf, Switzerland

Senske, W., DaimlerChrysler AG, Research and Technology, Frankfurt, Germany

Sergeev, O., Belarussian State University of Informatics and Radioelectronics, Minsk, Belarus

Sezi, R., Infineon Technologies AG, Corporate Research, Erlangen, Germany

Shakin, I.A., Academy of Sciences of Belarus, Institute of Physics of Solids and Semiconductors, Minsk, Belarus

Sharp, R., HITEN Office, AEA Technology, Culham, Abington, Great Britain

Sharpe, W.N.jr., John Hopkins University, Department of Mechanical Engineering, Baltimore, USA

Shibuya, T., Tokyo Institute of Technology, Department of Mechanical and Intelligent Systems Engineering, Tokyo, Japan

Shimizu, T., Mechanical Engineering Laboratory, Surface and Interface Technology Division, Tsukuba, Japan

Shimojo, M., Tokyo Institute of Technology, Precision and Intelligence Laboratory, Tokyo, Japan

Shiolashvili, Z., Georgian Academy of Science, Institute of Cybernetics, Tbilisi, Georgia

Shrestha, S., TU Berlin, Institutsbereich Fügetechnik und Beschichtungstechnik, Berlin, Germany

Shukla, A., University of Rhode Island, Department of Mechanical Engineering and Applied Mechanics, Kingston, USA

Shull, R.D., National Institute of Science and Technology,.Gaithersburg, USA

Siegel, R.W., Rennselear Polytechnic Institute, Materials Science and Engineering Department, Troy, NY, USA

Siemroth, P., Fraunhofer Institut für Werkstoff- und Strahltechnik, Dresden, Germany

Sievert, R., Bundesanstalt für Materialforschung und –prüfung, Berlin, Germany

Šikola, T., Brno University of Technology, Institute of Physical Engineering, Brno, Czech Republic

Silvestrov, V., Georgia Institute of Technology, School of Chemical Engineering, Packaging Research Center, Atlanta, USA

Simon, J., Fraunhofer IZM Berlin, Dept. Mechanical Reliability and Micro Materials, Berlin, Germany

Siniaguine, O., Tru-Si Technologies, Sunnyvale, USA

Sirringhaus, H., University of Cambridge, Cavendish Laboratory, Cambridge, Great Britain

Sitaraman, S.K., Georgia Institute of Technology, The George W. Woodruff School of Mechanical Engineering, Atlanta, USA

Škoda, D., Brno University of Technology, Brno, Czech Republic

Smith, D.L., NanoNexus, San Jose, USA

Sofield, C., AEA Technology plc., Harwell, Didcot, Great Britain

Soifer, Ja.M., Institute of Solid State Physics, Chernogolovka, Russia

Sokol, V.A., Belarussian State University of Informatics and Radioelectronics, Minsk, Belarus

Solovyev, V.S., Belarussian State University, Institute of Applied Physics Problems, Minsk, Belarus

Sommer, E., Fraunhofer Institut für Werkstoffmechanik, Freiburg, Germany

Sommer, J.-P., Fraunhofer IZM, Dept. Mechanical Reliability and Micro Materials, Berlin, Germany

Song, K., University of Waterloo, Department of Mechanical Engineering, Waterloo, Canada

Sourkov, A., Fraunhofer Institut Zerstörungsfreie Prüfverfahren, Saarbrücken, Germany

Spath, D., Universität Karlsruhe, Institut für Werkzeugmaschinen und Betriebstechnik, Karlsruhe, Germany

Spousta, J., Brno University of Technology, Institute of Physical Engineering, Brno, Czech Republic

Spousta, J., Brno University of Technology, Brno, Czech Republic

Spraul, C., University of Ulm, Ulm, Germany

Stampfl, J., Stanford University, Rapid Prototyping Lab., Stanford, USA

Steinhausen, R., Martin-Luther-Universität Halle-Wittenberg, FB Physik, EP II, Halle/S., Germany

Steiniger, C., TU Chemnitz, Zentrum für Mikrotechnologien, Chemnitz, Germany

Stolle, T., TU Berlin, Research Centre for Microperipheric Technologies, Berlin, Germany

Straube, B., Ilmenau Technical University, Department of Glass and Ceramic Technology, Ilmenau, Germany

Strunskus, T., Technische Fakultät der Universität Kiel, Lehrstuhl für Materialkunde, Kiel, Germany

Suga, T., The University of Tokyo, Research Center for Advanced Science and Technology (RCAST), Tokyo, Japan

Sugiura, S., Nissei Sangyo Co., Ltd., Tokyo, Japan

Suhir, E., Lucent Technologies, Inc., Bell Laboratories, Murray Hill, USA

Sussmann, R.S., DeBeers Industrial Diamond Division Ltd., Sunninghill, Great Britain

Swain, M.V., University of Sydney, Faculty of Dentistry and Department of Mechanical & Mechatronic Engineering, Everleigh, Australia

Szeloch, R.F., Wroclaw University of Technology, Institute of Microsystem Technology, Wroclaw, Poland

Szilassi, Z., Technical University of Budapest, Dept. of Electronics Technology, Budapest, Hungary

Szuecs, F., California Institute of Technology, W.M. Keck Laboratory of Engineering Materials, Pasadena, USA

Takashima, K., Tokyo Institute of Technology, Precision and Intelligence Laboratory, Tokyo, Japan

Tatasciore, P., Swiss Federal Institute of Technology, Institute of Lightweight Structures and Ropeways, ETH-Zentrum, Zürich, Switzerland

Teichmann, H., Siemens AG, Berlin, Germany

Terada, T., Kyoto University, Department of Mechanical Engineering, Kyoto, Japan

Tessler, N., University of Cambridge, Cavendish Laboratory, Cambridge, Great Britain

Teutsch, T., Packaging Technologies GmbH, Nauen, Germany

Thamasett, S., University of Ulm, Ulm, Germany

Thamm, T., PDI, Berlin, Germany

Thebaud, J.-M., Université Bordeaux 1, Laboratoire IXL – ENSERB, Bordeaux, France

Thran, A., Universität Kiel, Technische Fakultät, Lehrstuhl für Materialkunde, Kiel, Germany

Tilgner, R., Siemens AG, München, Germany

Todorova, V., Technical University, Department of Electronics and Microelectronics, Gabrovo, Bulgaria

Tognato, R., Universita‘ di Bologna, Dipartimento di Fisica ed Instituto Nationale di Fisica della Materia, Bologna, Italy

Tong, Quinn K., National Starch and Chemical Company, Bridgewater, USA

Tönshoff, H.K., Laser Zentrum Hannover e.V., Hannover, Germany

Toth, L., Bay Zoltan Foundation for Applied Research, Institute of Logistics and Production Systems, Miskolctapolca, Hungary

Totzauer, W., University of Applied Science, Mittweida, Germany

Tovar, D., Pac Tech USA, Fremont, USA

Trampert, A., PDI, Berlin, Germany

Tsakmakis, Ch., Forschungszentrum Karlsruhe, IMF II, Karlsruhe und Technische Universität Darmstadt, Institut für Mechanik 1, Darmstadt, Germany

Tütto, P., Semiconductor Physics Laboratory RT, Budapest, Hungary

Uhlenbrock, R., Ruhr-University Bochum, Institute for Electronic Circuits and Measurement, Bochum, Germany

Uhlig, C., Fraunhofer Institute for Reliability and Microintegration, Branch Lab EPC Teltow,Germany

Ullner, C., Bundesanstalt für Materialforschung und –prüfung (BAM), Berlin, Germany

Urbánek, M., Brno University of Technology, Institute of Physical Engineering, Brno, Czech Republic

Valizadeh, S., ACREO AB, Norrköping, Sweden

van’t Hof, C., Delft University of Technology, Delft, The Netherlands

Varin, R.A., University of Waterloo, Department of Mechanical Engineering, Waterloo, Canada

Vasilescu, E., University"Dunarea de Jos", Galatzi, Romania

Vasilescu, I., SIDEX"S.A., Galatzi, Romania

Vellinga, W.P., Eindhoven University of Technology, Mechanical Engineering, Materials Technology, Eindhoven, The Netherlands

Villain, J., University of Applied Sciences Augsburg, Department of Material and Production Engineering in Electrical Engineering, Augsburg, Germany

Viviente, J.L., INASMET, San Sebastian, Spain

Vogel, D., Fraunhofer IZM Berlin, Dept. Mechanical Reliability and Micro Materials, Berlin, Germany

Vogel, J., Angewandte Micro-Messtechnik GmbH Rangsdorf, Germany

Vorobyova, A.I., Belarussian State University of Informatics and Radioelectronics, Minsk, Belarus

Vrublevsky I., Belarussian State University of Informatics and Radioelectronics, Minsk, Belarus

Wachutka, G., Munich University of Technology, Physics of Electrotechnology, Munich, Germany

Wagner, T., PDI, Berlin, Germany

Walle, G., Fraunhofer Institute for Nondestructive Testing, Saarbruecken, Germany

Walter, H., Fraunhofer IZM Berlin, Dept. Mechanical Reliability and Micro Materials, Berlin, Germany

Wandel, K., Sentech Instruments Berlin GmbH, Berlin, Germany

Wanderka, N., Hahn-Meitner-Institut, Berlin, Germany

Wang, G., Academy of Sciences of China, Shanghai Institute of Metallurgy, Shanghai, China

Wang, L., Harbin Institute of Technology, National Key Laboratory of Advanced Welding Production Technology, Harbin, China

Wang, Z., Mechanical Engineering Laboratory, Agency of Industrial Science and Technology, Ministry of International Trade and Industry, Tsukuba, Japan

Weber, L., Institut für Mikrotechnik Mainz GmbH, Mainz, Germany

Wegner, R., Dr. Ettemeyer GmbH & Co., Neu-Ulm, Germany

Wehnert, C., Technical University of Berlin, Berlin, Germany

Weidemann, G., Bundesanstalt für Materialforschung und –prüfung (BAM), Berlin, Germany

Weima, J.A., University of Hagen, Department of Electronic Devices, Hagen, Germany

Weimar, U., University of Tübingen, Institute of Physical Chemistry, Tübingen, Germany

Weining, W., Capital Normal University, Department of Physics, Beijing, P.R. China

Weiss, B., University of Vienna, Institute of Materialphysics, Vienna, Austria

Weiss, M.R., BESSY mbH Berlin, Berlin, Germany

Weiß, U., Chemnitz University of Technology, Center of Microtechnologies, Chemnitz, Germany

Wellner, P., Max-Planck-Institut für Metallforschung und Universität Stuttgart, Institut für Metallkunde, Stuttgart, Germany

Werner, M., Deutsche Bank AG, Innovationteam Microtechnology, Berlin, Germany

Werner, T., TU Chemnitz, Zentrum für Mikrotechnologien, Chemnitz, Germany

Wichmann, K.-H., DaimlerChrysler Aerospace AG, Ulm, Germany

Wielage, B., TU Chemnitz, Germany

Wiemer, M., Fraunhofer Institute of Reliability and Microintegration, Department Microdevices and Equipment, Chemnitz, Germany

Wienecke, B., LaVision 2D-Meßtechnik GmbH, Göttingen, Germany

Wiese, S., Dresden University of Technology, Semiconductor and Microsystem Technology Lab (IHM), Dresden, Germany

Wilde, J., University of Freiburg, Institute for Microsystem Technology, Freiburg, Germany

Will, P., University of Applied Sciences, Mittweida, Germany

Wilson, J., University of Cambridge, Cavendish Laboratory, Cambridge, Great Britain

Winkler, M., Technische Universität Dresden, Institute of Solid Mechanics, Germany

Winkler, T., Chemnitzer Werkstoffmechanik GmbH, Chemnitz, Germany

Witke, T., Fraunhofer-Institut für Werkstoff- und Strahltechnik, Dresden, Germany

Wittwer, V., Fraunhofer Institut für Solare Energiesysteme, Freiburg, Germany

Wogersien, A., TU Braunschweig, Institut für Mikrotechnik, Braunschweig, Germany

Woirgard, E., Université Bordeaux 1, Laboratoire IXL – ENSERB, Bordeaux, France

Wolf, J., Fraunhofer IZM, Berlin, Germany

Wolf, R., Sentech Instruments Berlin GmbH, Berlin, Germany

Wolff, U., Siemens AG, Corporate Technology, München, Germany

Wolter, K.-J., Dresden University of Technology, Electronics Technology Laboratory, Dresden, Germany

Wondrak, W., DaimlerChrysler AG, Research and Technology, Frankfurt, Germany

Wurmus, H., Technical University Ilmenau, Faculty of Mechanical Engineering, Department of Microsystem Technology, Ilmenau, Germany

Wymyslowski, A., Wroclaw University of Technology, Institute of Microsystems Technology, Wroclaw, Poland

Yanagisawa, T., Gumna University, Graduate School, Kiryu, Japan

Yang, D.G., Delft University of Technology, Delft, The Netherlands

Yang, L., Dr. Ettemeyer GmbH & Co., Neu-Ulm, Germany

Yasuda, K., Osaka University, Graduate School of Engineering, Department of Manufacturing Science, Osaka, Japan

Yi, S., Nanyang Technological University, Singapore

Yiping, W., Huazhong University of Science and Technology, Department of Materials, Wuhan, China

Yoshida, Y., Chiba University, Department of Electronics and Mechanical Engineering, Chiba, Japan

Young, R., AEA Technology plc., Didcot, Great Britain

Zackel, E., Packaging Technologies GmbH, Nauen, Germany

Zaitsev, A.M., Ruhr University of Bochum, Institute of Mineralogy, Bochum, Germany

Zang, G.Q., Philips, Eindhoven, The Netherlands

Zapf, R., Institut für Mikrotechnik Mainz GmbH, Mainz, Germany

Zaporojtchenko, V., Universität Kiel, Technische Fakultät, Lehrstuhl für Materialkunde, Kiel, Germany

Zardini, C., Université Bordeaux 1, Laboratoire IXL – ENSERB, Bordeaux, France

Zeidler, H., NRU Präzisionstechnologie GmbH Neukirchen, Germany

Zhang, T., Tohoku University, Institute for Materials Research, Sendai, Japan

Zizi, M., Institut de Physique, Laboratoire Energetique, Bab Ezzouar, Algeria

Zlámal, J., Brno University of Technology, Institute of Physical Engineering, Brno, Czech Republic


last update Oktober 30, 2003
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