Ahn, J.-H., Jeon, E.-c., Choi, Y., Know, D.
Seoul National University, Seoul, Korea
Effects of work-hardening characteristics on evaluating flow properties from indentation load-depth curve

Albrecht, H.-J., Jendrny, J.*, Müller, W.H.**, Schwarz, B., Teichmann, H., Tilgner, R.***
Siemens AG, Berlin, *Universität Paderborn, ** Heriot-Watt University, Edinburgh, U.K., ***Siemens AG, München, Germany
Flex, rigid, and ceramic CSP - lifetime behavior

Al-Douri, Y.; Abid, H.; Aourag, H.
University of Sidi-Bel-Abbes, Algeria
Using of charge density to calculate bulk modulus in semiconductors

Amelio, S., Rabe, U., Kester, E., Hirsekorn, S., Arnold, W.
Fraunhofer Institute for Nondestructive Testing, Saarbrücken, Germany
Quantitative contact spectroscopy by atomic-force acoustic microscopy

Anhöck, S., Ostmann, A., Nieland, C., Auerswald, E.*, Reichl, H.*
TU Berlin, *Fraunhofer IZM Berlin, Germany
Influence of microstructure of electroless deposited Ni used as under bump metallization for high temperature solders

Anhöck, S.; Auerswald, E.*; Ostmann, A., Aschenbrenner, R.*, Reichl, H.*
TU Berlin, *Fraunhofer IZM Berlin, Germany
Reliability of soldered Nickel bumps for high temperature application

Ansorge, F., Becker, K.-H.*, Michel, B., Leutenbauer, R., Großer, V., Aschenbrenner, R., Reichl, H.
Fraunhofer IZM Berlin, *TU Berlin, Berlin, Germany
Integration of micro-mechatronics in automotive applications

Anwander, M., Kaindl, G., Weiss, B.
University Vienna, Vienna, Austria
Noncontacting laser based techniques for the determination of elastic constants of thin foils

Arzt, E.
Max-Planck-Institut für Metallforschung und Universität Stuttgart, Stuttgart, Germany
Micromaterials: Materials science in small dimensions

Ashida, K., Liyi, C.*, Morida, N.**, Yoshida, Y.**
Agency of Industrial Science and Technology, Tsukuba, *Graduate School of Chiba University, **Chiba University, Chiba, Japan
Nano-scale cutting of single crystal silicon by using friction force microscope and identification of affected layer

Asundi, A.
Nanyang Technological University, Singapore
Grating and Moire methods for micro-measurement

Auersperg, J.*,**, Kieselstein, E.***, Schubert, A.*, Michel, B.*
Fraunhofer IZM, Berlin*, **AMIC GmbH Rangsdorf, Germany, ***CWM Chemnitz, Germany
Mixed mode interfacial fracture toughness investigations for thermo-mechanical reliability enhancement of plastic packages

Auerswald, E., Anhöck, S., Kieselstein, E.*, Vogel, J.**, Michel, B.
Fraunhofer IZM, Berlin, *CWM GmbH Chemnitz, **AMIC GmbH Rangsdorf, Germany
X-ray diffraction at elevated temperatures in microsystem technology

Auerswald, J., Fecht, H.-J.
University Ulm, Germany
Wear resistant Ni-W-B layers deposited by electroplating

Baaklini, G.Y.
NASA Glenn Research Center, Cleveland, Ohio, USA
NDE for materials characterization in aeronautic and space applications

Babushkina, N.V., Malyshev, S.A., Romanova, L.I., Bykova, L.N.
National Academy of Sciences of Belarus, Minsk, Belarus
The formation of the Dy_xO_x films on the InP substrates

Bae, S., Schiemann, K., Mertin, W., Kubalek, E.
Gerhard-Mercator-University Duisburg, Germany
Contactless current detection at megahertz band width via the implementation of the heterodyne mixing technique

Bagdahn, J., Petzold, M., Seidel, H.*
Fraunhofer Institut für Werkstoffmechanik Halle, *TEMIC Microsystems München, Germany
Strength analysis of a micromechanical acceleration sensor by fracture mechanical approaches

Bagdahn, J., Petzold, M., Sommer, E.
Fraunhofer Institut für Werkstoffmechanik, Freiburg und Halle
Lifetime investigations of directly wafer-bonded samples under static and cyclic loading

Balueva, A.V.
Georgia Institute of Technology, Atlanta, Georgia, USA
Environmentally assistant damage of metals with covering

Barabanenkov, Yu.N., Kouznetsov, V.L.*, Barabanenkov, M.Yu.**
Institute of Radioengineering and Electronics Moscow, *The Moscow State Technical University of Civil Aviation, Moscow, **Institute of Microelectronics Technology and High Purity Materials, Chernogolovka, Russia
A method of transfer relation - new perspectives in physical grounds of near-field optics

Bauer, M.
Fraunhofer IZM, Branch Lab EPC Teltow, Germany
High performance thermosets – An overview

Baumbach, T., Hanke, R.*
Fraunhofer IZFP/EADQ, Dresden, *Fraunhofer IISA/IZFP, Erlangen/Saarbrücken, Germany
Nanofocus CT - a new dimension in radioscopic inspection on micro materials

Bayard, O., Ple, O.
Ecole Normale Superieure de Cachan, France
An analysis of crack nucleation in fibre-reinforced concrete

Becker, K.-F.*, Ehrlich, R., Ansorge, F., Aschenbrenner, R., Krause, F., Kämpfe, B., Reichl, H.
Fraunhofer IZM Berlin, *TU Berlin, Germany
BGA packaging technology for rapid prototyping increased reliability by advanced analytics

Becker, M., Lütke Notarp, D., Benecke, W..
University of Bremen, Bremen, Germany
Application of electroplating in MEMS-micromachining exemplified by a microrelay

Behnke, U., Mertin, W., Kubalek, E.
Gerhard-Mercator-Universität Duisburg, Duisburg, Germany
Voltage contrast measurement with an electric force microscope based test system

Berger, L., Mrosk, J.W., Ettl, G., Fecht, H.J., Wolff, U.*
Universität Ulm, *Siemens AG München, Germany
Migration-resistant amorphous AIY thin film metallizations for SAW devices

Bergner, F., Bergmann, U., Schaper, M., Hammer, R.*, Jurisch, M.*
Technische Universität Dresden, *Freiberger Compound Materials GmbH Freiberg, Germany
Deformation and cracking at microindentations in GaAs

Berka, L.; Horecka, L.
Czech Technical University Prague, Czech Rep.
On a deformation of the polycrystalline structure

Blank, V.D., Prokhorov, V.M., Levin, V.M.*, Soifer, Ja.M.**, Kobelev, N.P.**
Technological Institute for Superhard and Novel Carbon Materials, Moscow, *Institute of Biochemical Physics, Moscow, **Institute of Solid State Physics, Chernogolovka, Russia
Elastic modulus of solid C₆₀: Measurement and relationship with
nanostructure

Blum, F., Weima, J.A., Kosaca, G.C., Fahrner, W.R.
University of Hagen, Germany
Implanted pressure sensors on CVD diamond films

Boeffel, Ch., Bauer, M., Kuschel, F.*
Fraunhofer IZM, Branch Lab EPC, Teltow, *MLS GmbH Leuna, Germany
Reflective bistable liquid crystal displays on flexible substrates

Boerner, V., Bläsi, B., Gombert, A., Heinzel, A., Kübler, V., Popp, P., Wittwer, V.
Fraunhofer Institut für Solare Energiesysteme, Freiburg, Germany
Large area surface-relief microstructures for optical applications

Böhm, J., Schubert, A., Otto, T.*, Burkhardt, T.
Fraunhofer IWU, Chemnitz, *Fraunhofer IZM, Chemnitz, Germany
Micro-metalforming with silicon dies

Borneman, J., Schlimmer, M.
University Gh Kassel, Germany
Experimental determination of the correlation of conductivity and mechanical stress of a silver-filled electrically conducting adhesive

Bouabdallah, A., Zizi, M.
Institut de Physique, Bab Ezzouar, Algeria
Delay-time sensors for electrodiffusion measurements

Bouhafs, B.; Aourag, H.
University of Sidi-Bel-Abbes, Algeria
Anomalous trends in electronic properties of boron compounds BP, Bas, and BSb

Braun, T., Mießner, R.*, Becker, K.F.*
Fraunhofer IZM Berlin, *Technische Universität Berlin, Germany
Dynamic mechanical analysis of an high-filled epoxy resin in thin layers

Bütefisch, S., Büttgenbach, S., Kleine-Besten, T.*, Loheide, S.*, Brand, U.*
TU Braunschweig, *Physikalisch-Technische Bundesanstalt Braunschweig, Germany
Silicon three-axial tactile sensor for micromaterial characterization

Büttgenbach, S., Bütefisch, S., Leester-Schädel, M., Wogersien, A.
TU Braunschweig, Germany
Micromechanical actuators based on shape memory effect

Cantor, B.
University of Oxford, Oxford, U.K.
Functional nanomaterials and thin films

Chalker, P.R.
University of Liverpool, United Kingdom
The material properties, growth technology and applications of wide bandgap semiconductors for sensors and electronics

Clech, J.P.
Electronics Packaging Solutions International, Inc., Montclair, USA
BGA, Flip-Chip and solder joint reliability

Coniclione, S., Patuelli, C., Tognato, R.
Universita‘ di Bologna, Italy
Microstructural characterization of Al/SiC interface after thermal treatments by TEM, X-ray diffration and AFM

Crossley, A., Mapledoram, L., Sofield, C., Johnston, C., Myhra, S.*
AEA Technology plc., Harwell, Didcot, U.K., *School of Science, Griffith University, Nathan, Australia
Nano-writing with atomic force microscopy

Davletbaeva, I.M., Ismagilova, A.S., Davletbaev, R.S., Parfenov, V.V.*
Kazan State Technological University, *Kazan State University, Kazan, Russia
Thermotropic metal-containing liquid crystal polyurethanes, possessing high electric conductivity

DeCristofaro, N.
Allied Signal, USA
Development and applications of softmagnetic materials

Del Piero, G.
Universita di Ferrara, Italy
Damage modelling via bi-modal surface energies

Demeus, L., Delatte, P., Dessard, V., Adriansen, S., Renaux, C., Flandre, D.
Université catholique de Louvain, Louvain-la-Neuve, Belgium
A review of fully-depeted SOI CMOS technology for microsystems

Dieter, S, Pyzalla, A., Reimers, W.
Hahn-Meitner-Institut, Berlin, Germany
Texture and internal stresses in FeCo-layers for microinductors

Dlubek, G., Buchhold, R.*, Hübner, Ch.**, Nakladal, A.*, Meyendorf, N.
Institut für innovative Technologien GmbH, Köthen/Halle, Germany, *Technische Universität Dresden, Dresden, Germany, **Martin-Luther-Universität Halle-Wittenberg, Halle/S., Germany
Water in subnanometer-size local free volumes of polyimides and polyamides: A positron lifetime study

Dlubek, G., Depetasse, S.*, Sourkov, A.*, Meyendorf, N.*, Kruase-Rehberg, R.**
Institut für innovative Technologien GmbH, Köthen/Halle, *IZFP Saarbrücken, **Martin-Luther-Universität Halle-Wittenberg, Halle/S., Germany
Submicroscopic and atomic scale structure changes during decomposition of Al alloys: a position annihilation study

Dommann, A.
NTB Institut für Mikrosystemtechnik, Buchs, Schweiz
Internal stresses and lifetime evaluation of MEMS

Dorn, L., Herbert, F., Shrestha, S.
TU Berlin, Berlin, Germany
Lead-free solders – rapidly reflowed under the laser beam

Dost, M., Kieselstein, E., Erb, R., Seiler, B., Vogel, J., Bombach, C.*, Grosser, V.*, Vogel, D.*, Michel, B.*
Chemnitzer Werkstoffmechanik GmbH, Chemnitz, *Fraunhofer IZM Berlin, Germany
UNIDAC: cross correlation based deformation analysis at digitized micrographs to study material behaviour and parameters in MST

Dragosits, K., Selberherr, S.
TU Vienna, Austria
Simulation of ferroelectric nonvolatile memory cells with MINIMOS-NT

Dudek, R., Schubert, A., Michel, B.
Fraunhofer IZM Berlin, Germany
Thermo-mechanical reliability of microcomponents

Eberle, A., Sievert, R.
Bundesanstalt für Materialforschung und –prüfung, Berlin, Germany
Analysis of an electronic structure bearing deep cracks

Ebersberger, B., Olbrich, A., Boit, C.
Infineon Technologies AG, Munich, Germany
Scanning probe microscopy in semiconductor failure analysis

Ehrfeld, W., Begemann, M., Berg, U., Brüning, H., Michel, F., Nienhaus, M., Weber, L.
Institut für Mikrotechnik Mainz GmbH, Mainz, Germany
Material aspects for mass fabrication of microdevices by molding processes

Einenkel, A., Paproth, A.*, Schneider, W.**, Berek, H., Pachschwöll, H.*
Forschungsinstitut für Nichteisen-Metalle Freiberg, *TU Dresden, **Microelectronic Packaging Dresden GmbH, Dresden, Germany
Development and application of ultra fine pitch solder paste for advanced microelectronic packaging

Enders, S., Grau, P., Berg, G.
Martin-Luther-University, Halle/Saale, Germany
Nanotribological characterization of brittle surface

Ernst, L.J., van’t Hof, C., Yang, D.G., Kiasat, M.S., Zang, G.Q.*, Bressers, H.J.L.*, Caers, J.F.J.*, den Boer, A.W.J.*, Janssen, J.*
Delft University of Technology, Delft, *Philips, Eindhoven, The Netherlands
Mechanical characterisation and simulation of packaging polymer curing

Fahrner, W.R., Job, R., Werner, M.*
University of Hagen, Hagen,* Deutsche Bank AG, Berlin, Germany
Sensors and smart electronics in environment applications

Fandel, M., Schäfer, W., Rehme, F.*, Wichmann, K.-H.*, Hager, W.*
Dornier GmbH, Friedrichshafen, *DaimlerChrysler Aerospace AG, Ulm, Germany
Powder injection moulded aluminium nitride for packaging of mm-wave circuits

Faust, W., Bombach, C., Michel, M.*, Michel, B.
Fraunhofer IZM Berlin, *Chemnitz University of Technology, Chemnitz, Germany
Insitu measurement of deformations on microelectronic components by means of microscopic methods

Feustel, F., Meusel, E.
Dresden University of Technology, Dresden, Germany
Modeling of the deformation behavior of a flip chip underfill for finite element analyses

Feustel, F., Wiese, S., Meusel, E.
Dresden University of Technology, Dresden, Germany
Influence of different modeling approaches for solder and underfill on the reliability of flip chip assemblies

Fiege, G.B.M., Becker, G.*, Engemann, J.*, Boit, C.*, Balk, L.J.
Bergische Universität Wuppertal, *Infineon Technologies AG, Munich, Germany
Thermomicroscopy of materials and devices at nanometer dimensions

Fleischer, L., Zeidler, H.*, Faust, W.**, Dost, M.***, Vogel, J.****, Michel, B.**
GPA Dr. Fleischer und Partner GbR, Lichtenstein, *NRU Präzisionstechnologie, Neukirchen, **Fraunhofer IZM Berlin, ***Chemnitzer Werkstoffmechanik GmbH, Chemnitz, ****Angewandte Micro-Meßtechnik GmbH, Rangsdorf, Germany
Rapid prototyping of microcomponents and demonstrators in micro system technology

Friedel, K., Wymyslowski, A.
Wroclaw University of Technology, Wroclaw, Poland
The thermo-mechanical analysis of twin-chips silicon piezoresistive pressure sensors

Fritz, T., Leuerer, T., Krüger, C., Mokwa, W., Schnakenberg, U.
RWTH Aachen, Germany
Mechanical properties of electroplated nickel

Frohnmeyer, A., Niedernostheide, F.-J., Schulze, H.-J., Tütto, P.*, Pavelka, T.*, Wachutka, G.**
Siemens AG, Munich, *Semiconductor Physics Laboratory RT, Budapest, Hungary, **Munich University of Technology, Munich, Germany
Analysis of the injection level and temperature dependence of carrier lifetime by microwave photoconductivity decay

Frühauf, J., Gärtner, E., Jäntsch, E.
Chemnitz University of Technology, Germany
Plastic reshaping of silicon microstructures: process, characterization and application

Gaponenko, N.V.
Belarusian State University of Informatics and Radioelectronics, Minsk, Belarus
Characterization of sol-gel derived films in mesoporous matrices

Garcia, A., Viviente, J.L., Brizuela, M., Alonso, F, Braceras, I., Onate, J.I.
INASMET, San Sebastian, Spain
Development of lubricous DLC coating for microsystems

Gatzen, H.H.
Hanover University, Hanover, Germany
Dicing challenges in microelectronics and micro electro-mechanical systems

Geers, M.G.D., Peerlings, R.H.J., Kouznetsova, V., Brekelmans, W.A.M., Baaijens, F.P.T.
Eindhoven University of Technology, Eindhoven, The Netherlands
Gradient-enhanced macroscopy constitutive principles for the mechanical description of microstructures

Gemeinert, M., Günther, W., Mücke, U., Schiller, W.A.
Federal Institute for Materials Research and Testing, Berlin, Germany
Dielectric strength of ceramic substrates

Gessner, T. *, **, Kaufmann, C.**, Gottfried, K.**, Hoffmann, R. **
*Fraunhofer IZM Berlin, Berlin, Germany, **Chemnitz University of Technology, Chemnitz, Germany
Development of contact and wireing systems for high temperature sensor applications

Glickman, E.E., Davidson, J.*, Ichilov, O.*
Tel Aviv University, Tel Aviv, * Telrad Communication and Electronic Industries Ltd., Lod, Israel
Thermal-fatigue kinetics in SMC solder joints by SEM/EDS fractography

Glickman, E.E., Nathan, M.
Tel Aviv University, Tel Aviv, Israel
On the origin of the short line effect in electromigration

Gluche, P., Flöter, A., Ertl, S., Rösch, R., Lingenfelder,
C., Adamschik, M.*, Dambacher, J.*, Kusterer, J.*,
Kohn, E.*, Spraul, C.*, Lang, G.K.*, Thamasett, S.*,
Hombach, V.*, Orth, K.*, Birke, J.*, Beger, H.*,
Richter, H.P.*
GFD Gesellschaft für Diamantprodukte mbH, Ulm, *University of Ulm,
Ulm, Germany
CVD diamond and its application in medical
technologies

Goebbels, J., Illerhaus, B., Riesemeier, H., Weidemann, G.
Bundesanstalt für Materialforschung und –prüfung Berlin (BAM), Berlin, Germany
Analysis of structure and dimension of electronic parts with high resolution X-ray tomography

Goh, T.J.
Intel Products, Kulim, Malaysia
Reliability Risk Assessment of Organic Flip Chip Pin Grid Array Package under Thermal and Mechanical Loading Conditions

Goldstein, R.V.
Institute for Problems in Mechanics, Russian Academy of Sciences, Moscow, Russia
Modeling and testing of strength and fracture of microelectronic materials and components

Gollhardt, A., Vogel, D., Michel, B.
Fraunhofer IZM Berlin, Germany
Strain measurement in solder interconnects of advanced electronic packages

Grabosch, G., Fahrner, W.R.
University of Hagen, Hagen, Germany
Spectroscopy ellipsometry and dark conductivity measurements on p- and n-type microcrystalline silicon films

Greer, A.L.
Cambridge University, U.K.
Atomic diffusion and phase stability in thin films

Grosser, V., Bombach, C., Gentzsch, S., Hillmann, V., Sommer, J.-P., Michel, B.
Fraunhofer IZM Berlin, Germany
Evaluation and testing of microsystems using optical methods

Grossmann, G.
Swiss Federal Institute for Materials Testing and Research, Duebendorf, Switzerland
Location and magnitude of maximum strain in SMT solder joints

Güntherodt, H.-J.
University of Basel, Basel, Switzerland
Local scanning probe methods

Güttler, H.
DaimlerChrysler Forschungszentrum Ulm, Germany
CVD diamond and its applications

Hadrboletz, A., Weiss, B., Khatibi, G.
University of Vienna, Austria
The "size effect" on the fatigue- and fracture properties of thin metallic foils and wires

Hangen, U.D.
SURFACE nanoLab Hueckelhoven, Germany
Determination of mechanical and tribological properties in the nm-range with the Hysitron triboscope

Haschke, M.; Kämpfe, B.*
X-Ray Analytics and Measurement Technology Taunusstein, *Fraunhofer IZM Berlin, Germany
m -XRF - A new powerful analytic tool for microstructures

Hauck, T., Paulasto, M.
Motorola GmbH, Munich, Germany
Multi chip power packaging – Reliability assessment

Hecht-Mijic, S.; Christ, V.; Straube, B.; Harnisch, A.; Mrotzek, S.; Hülsenberg, D.; Kucera, U.; Mollenhauer, O.*
Ilmenau Technical University, *Tetra GmbH Ilmenau, Germany
Photostructurable glasses with integrated waveguides

Heinze, L., Kalnowski, G.*, Heppke, G.**
Fraunhofer IZM Berlin, *TU Berlin, Institut für Techn. Umweltschutz, **TU Berlin, Iwan-N.-Stranski-Institut, Berlin, Germany
Experiments for the assessment of the biological effects of LCD materials on the environment

Herr, U., Grob, A., Samwer, K.*
University Augsburg, *University Göppingen, Germany
Determination of intrinsic stress during the growth of FE(Zr) thin films

Herringer, J.H.; Djeu, N.
University of South Florida, Tampa, USA
High temperature fiber optic thermal device

Herrmann, K., Hasche, K., Pohlenz, F., Seemann, R., Menelao, F.
Physikalisch-Technische Bundesanstalt Braunschweig und Berlin, Germany
About the accuracy of the determination of mechanical properties of thin layers with the nanoindentation method

Hessel, V., Ehrfeld, W, Löwe, H., Richter, Th., Schiewe, J., Zapf, R., Donnet, M.*, Binkle, O.**, Nonninger, R.**
Institut für Mikrotechnik Mainz GmbH, Mainz, *Ecole Polytechnique Fédéral de Lausanne, Lausanne, Switzerland, ** Institut für Neue Materialien GmbH, Saarbrücken, Germany
Nano- and microscale materials in microreactors

Higo, Y.,Takashima, K., Shimojo, M., Sugiura, S.*, Swain, M.V.**
Tokyo Institute of Technology, Tokyo, *Nissei Sangyo Co. Ltd., Yokohama, Japan, **University of Sydney, Australia
New equipment for evaluating performance of microelements on MEMS

Hillmann, V.*,**, Großer, V.**, Gentsch, S.**,***, Bloch, H.****, Michel, B.**
*Chemnitzer Werkstoffmechanik GmbH, Chemnitz, **Fraunhofer IZM Berlin, ***Angewandte Micro-Messtechnik GmbH Rangsdorf, ****Aktiv Sensor GmbH, Germany
Automated optical measurements under vacuum

Holbery, J.D., Consiglio, R.
Centre Suisse d’Electronique et de Microtechnique SA, Neuchatel, Switzerland
Analytical simulation tools to determine the behavior of bulk and layered sustrates

Horecka, L.; Berka, L.
Czech Technical University Prague, Czech Rep.
The micro stereoimage strain analysis by the microscope Zeiss Neophot 21 with Practica Scan 2000

Huang, B., Lee, N.-C.
Indium Corporation of America, Clinton, USA
Lead free alternatives: an analysis of performance characteristics

Huber, N., Tsakmakis, Ch.*
Forschungszentrum Karlsruhe, *Technische Universität Darmstadt, Germany
The fictitious indendation depth-load trajectory as a new approach for determining thin film mechanical properties without substrate effects

Ianev, V., Schwesinger, N., Wurmus, H., Friedel, K., Sändig, T.
Technische Universität Ilmenau, Germany
Patterning of thin plasma polymerized fluorocarbon films

Ilgner, J., Mietke, S., Köhler, T., Werner, M.
Deutsche Bank AG, Microtechnology Innovation Team, Berlin, Germany
The impact of research and the market on the economic success of small and sized enterprises

Im, J.S.
Columbia University, USA
Non-equilibrium processing of silicon

Inasaki, I.
Keio University, Yokohama, Japan
Dicing of silicon wafers

Inoue, A.
Tohoku University, Sendai, Japan
Production of high precision microparts for machines using metallic glass

Inoue, A. Kawamura, Y., Zhang, T.
Tohoku University, Sendai, Japan
High-strain rate superplasticity due to Newtonian flow of supercooled liquid in bulk glassy alloys

Iwamoto, N.E., Nakagawa, M.*
Allied Signal, San Diego, *Colorado School of Mines, Golden, USA
Molecular modeling and discrete element modeling applied to the microelectronics packaging industry

Jackman, R.
King‘s College, London, U.K.
Properties of diamond for sensor applications

Jedicke, O.
Fraunhofer Institut für Chemische Technologie, Pfinztal-Berghausen, Germany
Thermo-mechanical testing of polymeric materials under rates of deformation between 10^-2m/s - 10⁺²m/s

Jeong, J.-h., Kim, J.-j., Jeong, A., Lee, K.-R.*, Kwon, D.*
Seoul National University, Seoul, *Korea Institute of Science and Technology, Seoul, Korea
Determination of critical interfacial release rate in hard coatings on ductile substrate

John, L.-G.
VDI/VDE Technologiezentrum Informationstechnik GmbH, Teltow, Germany
Technologies and materials of microsystems

Johnson, W.L.
California Institute of Technology, Pasadena, USA
Mechanics of nanowires

Johnston, C., Chalker, P.*, Werner, M.**
AEA Technology plc., Didcot, U.K., *University of Liverpool, U.K., **Deutsche Bank AG, Germany
B-doping and piezoresistivity of CVD diamond

Johnston, C., Young, R., Crossley, A.
AEA Technology plc., Didcot, U.K.
Thermal management with novel materials

Jung, Ch., Weiss, M.R., Gudat, W.
BESSY mbH Berlin, Germany
Materials characterization on a nanometer scale at BESSY

Jurczyk, M.
Poznan University of Technology, Poznan, Poland
Nanocrystalline hydride electrode materials

Jurczyk, M.
Poznan University of Technology, Poznan,Poland
Nanocomposite permanent magnets

Kalleder, A., Kreutzer, R., Mennig, M., Schmidt, H.
Institut für Neue Materialien GmbH, Saarbrücken, Germany
Sol-gel pastes for conductive fine line printing

Kallenbach, E., Schilling, C., Frank, T., Kallenbach, M., Wurmus, H.
TU Ilmenau, Germany
Micromechatronics - a foundation for future products

Kamiya, S., Inoue, A., Saka, M., Abé, H.
Tohoku University, Sendai, Japan
A new method of quantitative evaluation for the adhesive toughness of thin films and substrates

Kämpfe, A.; Löhe, D.; Stolle, T.*; Kämpfe, B.**
Universität Karlsruhe (TH), *TU Berlin, **Fraunhofer IZM Berlin, Germany
X-ray texture and residual stress analysis on photoactivated electroless plated Cu-layers

Kämpfe, B.; Kämpfe, A.*; Auerswald, E.; Kassem, M.E.**
Fraunhofer IZM Berlin, *Universität Karlsruhe (TH), Germany, **Assuit University, Assuit, Egypt
Residual stress determination in microsystems using X-ray diffraction

Kassem, M.E.
Assiut University, Assiut, Egypt
Metal recycling as renewable resource of clean energy and raw materials

Kassing, R.
Universität Kassel, Germany
Micro- and nanostructures – preparation and applications

Kataoka, K., Itoh, T., Suga, T., Engelmann, G.*, Wolf, J.*, Ehrmann, O.*, Reichl, H.*
University of Tokyo, Japan, *Fraunhofer IZM, Berlin, Germany
Fritting contacts utilized for micromachined wafer probe cards

Kaulfersch, E., Vogel, J., Sommer, J.-P.*, Michel, B.*
AMIC Angewandte Micro-Messtechnik GmbH Rangsdorf, *Fraunhofer IZM Berlin, Germany
Finite-Element investigation on testing devices for solder joint reliability evaluation

Keoschkerjan, R., Harutyunyan, M.*, Wurmus, H.
Technische Universität Ilmenau, Germany, * State Engineering University of Armenia, Jerewan, Armenia
Thermo-electro-mechanical analysis of piezoelectric microcomponents by harmonic oscillations

Khoperia, T.N.
Georgian Academy of Sciences, Tbilisi, Georgia
Electroless metallization of non-metallic materials

Khoperia, T.N.
Georgian Academy of Sciences, Tbilisi, Georgia
Combination of electroless and electroplating methods in electronics and instrument-making

Kiasat, M.S., Marissen, R.
Delft University of Technology, Delft, The Netherlands
Modelling the cure-dependent viscoelastic behavior of a thermosetting resin and residual curing stresses

Kiene, M., Abramowitz, P., Ho, P.S.
University of Texas at Austin, Austin, USA
Ion assisted growth of ultrathin diffusion barriers on low dielectric constant polymers

Kieselstein, E., Seiler, B., Winkler, T., Auersperg, J.*, Dudek, R.*, Schubert, A.*, Schneider, W., **, Michel, B.*
Chemnitzer Werkstoffmechanik GmbH, Chemnitz,* Fraunhofer IZM, Berlin,**Microelectronic Packaging Dresden GmbH, Germany
Investigation of interface cracking in electronic packages

Kim, D.W., Kwon, D.
Seoul National University, Seoul, Korea
Nondestructive evaluation of fracture characteristics by quantification of Barkhausen noise method and microstructure analysis

Kim, Y.-J.
Samsung Electronic Co., Ltd., Suwon City, Korea
Real-time monitoring and measurement of mechanical properties of polymeric films using resonant string structures

Kishimoto, K., Masuda, K., Omiya, M., Shibuya, T., Amagai, M.*
Tokyo Institute of Technology, Tokyo, Japan, *Texas Instruments Japan, Oita, Japan
Effect of intermetallic compound layer development on mechanical strength of 63Sn-37Pb solder joints

Kocdemir, B., Fecht, H.-J.
Ulm University, Ulm, Germany
Microstructure characterization and mechanical properties of Mo-Cu composite for electronic packaging applications

Koch, T., Seidler, S.
Vienna University of Technology, Vienna, Austria
Mechanical properties of micro-injektion moulded components

Köhler, A., Cleave, V., Wilson, j., Sirringhaus, H., Tessler, N., Granström, M., Friend, R.H.
University of Cambridge, Cambridge, U.K.
Properties, characterization and challanges of semiconducting polymer applications

Kolawa, E.
Jet Propulsion Laboratory, USA
Development and applications of sensors for deep space explorations

Kosaca, G.C., Blum, F., Weima, J.A. Fahrner, W.R.
University of Hagen, Hagen, Germany
Characterization of gated p-i-p-structures on CVD diamond films and natural crystals

Kosobutskyy, Y.
University "L’vivska Polytechnika", Lviv, Ukraine
Simulation of resonant interference of light by thin films

Kouznetsova, V., Brekelmans, W.A.M., Geers, M.G.D., Baaijens, F.P.T.
Eindhoven University of Technology, Eindhoven, The Netherlands
Multi-level modelling of heterogeneous micro materials

Krabe, D., Ebling, F., Lang, G., Arndt-Staufenbiel, N.
Fraunhofer IZM Berlin, Germany
Property profiles of materials for micro-structuring by hot-embossing

Kraft, O., Schwaiger, R., Wellner, P.
University Stuttgart, Stuttgart, Germany
Fatigue testing of thin metal films on substrates

Krause, F., Halser, K.
Fraunhofer IZM Berlin, Germany
Surface modification due to technological treatment evaluated by SPM and XPS techniques

Kreher, W.S., Beckert, W.
Technische Universität Dresden, Germany
Modeling piezoelectric composites for adaptronics

Krüger, H., Frübing, P.*, Gerhard-Multhaupt, R.*
Fraunhofer IZM, Teltow, *University of Potsdam, Potsdam, Germany
Synthesis, dielectrical and dynamic mechanical characterization of new thermoplastic polyurethanes for pyro- and piezoelectric applications

Krujatz, J., Werner, T., Kaufmann, C., Gessner, T.
Chemnitz University of Technology, Germany
Optical properties and film stress behavior of silver reflection coating for micro mirrors

Küchler, M., Knöfler, R., Steiniger, C., Raschke, T., Gessner, T., Dudek, R.*, Döring, R.**
Chemnitz University of Technology, **Fraunhofer IZM Berlin/Chemnitz, ***CWM GmbH Chemnitz, Germany
Stress-induced lateral deflection of microstructures

Kuna, M.; Scherzer, M.; Ricoeur, A.
Freiberg University of Mining and Technology, Freiberg, Germany
Finite element techniques for flaw analyses in piezoelectric micro-components

Kunath-Fandrei, G.*, Faust, W., Michel, B.
*Carl Zeiss Jena GmbH, Jena, Fraunhofer IZM Berlin, Germany
News in materials investigation by laser scanning microscopy

Kurel, R., Rang, T.
Tallinn Technical University, Tallinn, Estonia
Temperature influence on current suppressing effect in SiC schottky diode

Kurth, S., Kaufmann, C., Faust, W.*, Dötzel, W., Michel, B.*
Chemnitz University of Technology, Zentrum für Mikrotechnologien, Chemnitz, *Fraunhofer IZM Berlin, Germany
Deformation behavior of micro mirror arrays under optical power

Lammel, G.; Renaud, P.
Swiss Federal Institute of Technology, Lausanne, Switzerland
Porous silicon as new micro material for actuated 3D flip-up structures

Lazarouk, S., Leshok, A.
Belarussian State University of Informatics and Radioelectronics, Minsk, Belarus
Light emitting devices based on Al/porous silicon schottky junctions on the supphire substrates for microdisplay applications

Lee, Ning-Cheng
Indium Corporation of America, Clinton, USA
Lead free soldering - are you ready for this global trend?

Lefranc, G., Degischer, H.P.*, Mitic, G., Licht, T.**
Siemens AG, Munich, Germany, *Vienna University of Technology, Vienna, Austria, **eupec GmbH, Warstein, Germany
Mechanical and thermomechanical properties of AI-SiC-MMC

Lefu, Z., Weining, W.*, Yiping, W.
Huazhong University of Science and Technology, Wuhan, *Capital Normal University Beijing, P.R. China
Study of thermal deformation in BGA assemblies using FEM

Leonhard, W., Heck, W.*, Jordan, M.**, Gust, W.***, Gemmler, A.
Fraunhofer IPA Stuttgart, *Forschungszentrum der Alcatel, Stuttgart, **Schlötter, Geislingen, ***Universität Stuttgart, Germany
Lead-free Solders for Flipchip-Technology

Leuerer, T., Krüger, C., Bartelink, D.*, Fritz, T., Mokwa, W., Schnakenberg, U.
RWTH Aachen, Germany, *Hewlett-Packard Laboratories, Palo Alto, USA
Design optimization for electroplated micro-springs

Libera, J., Gogotsi, Y.
University of Illinois at Chicago, USA
Carbon components for micro-world maschines

Lin, W.-m., Lee, C., Schroth, A., Maeda, R.
Mechanical Engineering Laboratory, Tsukuba, Japan
Development of micro scanning devices actuated with PZT thin films

Lo, K.W.
The National University of Singapore, Singapore
Non self-similar crack extension: to "KINK"or not to "KINK"

Lopour, F., Šikola, T., Spousta, J., Dittrichova, L., Kalousek, R., Škoda, D., Matêjka, F., Král, J.*
Brno University of Technology, *Czech Technical University, Prague, Czech Republic
Etching of microstructures and modification of solid surface by low energy ion beams

Lorenz, D., Johansen, H.*, Grau, P.
Martin-Luther-University Halle-Wittenberg, *Max-Planck-Universität für Mikrostrukturphysik, Halle, Germany
Dislocation nucleation during nanoindentation

Lu, J.
Université de Technologie de Troyes, France
Process and mechanical behavior of micro and nano materials

Lütke Notarp, D.
University of Bremen, Bremen, Germany
Control of electroplating depositions in MEMS-fabrication

Luniak, M., Wolter, K.-J.
Dresden University of Technology, Dresden, Germany
Thermal matching of a glass-ceramic-interface for a carbon dioxide sensor

Lux, F.A.
Berlin, Germany
Corrosion protection with conducting polymers: mechanism, stability and durability of the protective component

Mahlich, M., Fecht, H.-J., Szuecs, F.*, Werner, M.**, Sussmann, R.S.***, Pickles, C.S.J.***
University of Ulm, Ulm, Germany, *California Institute of Technology, Pasadena, USA, **Deutsche Bank AG, Berlin, ***DeBeers Industrial Diamond Division Ltd., Sunninghill, U.K.
Temperature dependence of Young’s modulus and degradation of CVD diamond

Mariella, R.P.jr.
Lawrence Livermore National Laboratory, Livermore, USA
MEMS in portable applications

Mariella, R.P.Jr.
Lawrence Livermore National Laboratory, Livermore, USA
Yield issues with dicing for MEMS devices

Maurer, D., Leue, A., Heicherle, R., Müller, V.
Universität Augsburg, Germany
Characterization of transition metal oxides by ultrasonic microscopy

McCluskey, P.
University of Maryland, CALCE, College Park, USA
Stress and fatigue life modeling in thin attach layers

Mehner, J., Kehr, K., Schröter, B., Kaufmann, C., Dötzel, W., Gessner, T.
Chemnitz University of Technology, Chemnitz, Germany
A resonance method for the determination of Young’s modulus and residual stress of thin microstructures

Mennig, M., Gier, A., Schmidt, H.
Institut für Neue Materialien GmbH, Saarbrücken, Germany
Preparation of micro patterns with profile heights up to 100 µm by sol gel technology

Meyendorf, N., Altpeter, I., Netzelmann, U.
Fraunhofer Institute for Nondestructive Testing, Saarbruecken, Germany
Non-destructive characterization of ferromagnetic layers and layer systems

Michel, B., Winkler, T.*
Fraunhofer IZM Berlin, *Chemnitzer Werkstoffmechanik GmbH, Chemnitz, Germany
Fracture electronics and thermo-mechanical compatibility (TMC) of microcomponents in HighTech Systems

Mietke, S., Wehnert, C.*, Becker, H.**, Gluche, P.***, Fecht, H.-J.****, Werner, M.
Deutsche Bank AG, Microtechnology Innovation Team, Berlin, * Technical University of Berlin, ** Jenoptik Mikrotechnik GmbH Jena, *** Gesellschaft für Diamantprodukte mbH, **** University of Ulm, Ulm, Germany
Fabrication and characterization of plastic (PMMA) for inexpensive MEMS components

Miller, M.R., Mohammed, I., Dai, X., Ho, P.S.
University of Texas at Austin, Austin, USA
Study of thermal deformation in underfilled flip-chip packages using high resolution Moire interferometry

Minoshima, K., Terada, T., Komai, K.
Kyoto University, Kyoto, Japan
Submicrometer notch machining by FIB and fracture and fatigue behavior in silicon microelements

Mitic, V.V.*, Petkovic, P., Mitrovic, I.
University of Nis, Nis, *Serbian Academy of Sciences and Arts,
Belgrade, Yugoslavia
BaTiO₃ – Ceramics cluster intergranular
impedance model

Morozov, N., Pitkin, A.*
Institute of Mathematics and Mechanics, St. Petersburg, *Marine Technical University, St. Petersburg, Russia
Stability of flat boundary under surface diffusion

Morris, J.E.
State University of New York at Binghamton, USA
Future developments in electrically conductive adhesive technology

Mrosk, J., Mahlich, M., Kocdemir, B., Fecht, H.-J.
University of Ulm, Ulm, Germany
Materials properties with respect to microsystems technologies

Mudryi, A.V., Shakin, I.A., Solovyev, V.S.*, Gusakow, G.A.*
Academy of Sciences of Belarus, Minsk, *Belarussian State University, Minsk, Belarus
Synthesis and optical properties of diamond crystals

Müllers, J., Knüwer, M.*, Wichmann, K.-H.**, Hager, W.**
DaimlerChrysler Research Dornier GmbH, Friedrichshafen, *IFAM, Bremen, **DaimlerChrysler Aaerospace AG Ulm, Germany
New MoCu and WCu MIM-Materials designed for heat dissipation purposes in RF packages

Murakoshi, Y., Shimizu, T., Maeda, R., Sano, T.
Mechanical Engineering Laboratory, Tsukuba, Japan
High aspect ratio structuring by IPC etching and metal and ceramics forming

Nakano, S., Ogiso, H.*, Nakagawa, S.**, Ishikawa, H.***, Sato, H.
Mechanical Engineering Laboratory, AIST, MITI, Tsukuba, *National Institute for Advanced Interdisciplinary Research, AIST, MITI, Tsukuba, **Okayama University of Science, Okayama, ***University of Electro Communications, Tokyo, Japan
Ion implantation for micromaterial fabrication - fabrication and material properties

Needleman, A.
Brown University, Providence, USA
Cohesive surface modeling of fracture

Nellen, Ph.M., Sennhauser, U.
Swiss Federal Laboratories for Materials Testing and Research, Dübendorf, Switzerland
Characterization and aging of optical fiber Bragg gratings

Nenov, T.
Technical University of Gabrovo, Gabrovo, Bulgaria
Humidity ceramic sensor materials on the basis of TiO₂

Netzelmann, U., Walle, G., Karpen, W., Meyendorf, N.
Fraunhofer Institute for Nondestructive Testing, Saarbruecken, Germany
Thermographic testing methods with high temporal and spatial resolution

Nguyen, S.v., Herrmann, K.P., Müller, W.H.*, Albrecht, H.-J.**, Foulds, J.***
Laboratorium für Technische Mechanik, Paderborn, *Heriot-Watt-University, Edinburgh,U.K., **Siemens AG, Berlin, Germany, ***Failure Analysis Associates, Menlo Park, USA
Determination of mechanical parameters of solder materials using the miniature measuring method ^"Small Punch Test"

Niefanger, R., Kolleck, A., Schneider, G.A.
Technische Universität Hamburg-Harburg, Germany
R-Curve behavior of PZT-ceramics under the influence of an electric field

Oblakowski, J., Gajerski, R., Labus, S., Malecki, A., Prochowska-Klisch, B.
University of Mining and Metallurgy, Krakow, Poland
Catalytic application of sol-gel deposited YSZ/Pd,Pt,RuO_x and YSZ/Pd,Pt,Rh layers on Corning^TM catalytic substrates

Oblakowski, J., Gajerski, R., Labus, S., Malecki, A., Prochowska-Klisch, B., Fuc, P.*
Universiry of Mining and Metallurgy, Krakow, Poland, *University of Technology, Poznan, Poland
Degradation of Pt electrodes and micro-headers of NO_X sensors

Oesterschulze, Egbert, Kassing, Rainer
University of Kassel, Kassel, Germany
Sensors for scanning probe microscopy (SPM)

Ogitani, S.*, Silvestrov, V., Bidstrup, S.A., Kohl, P.A.
Georgia Institute of Technology, Atlanta, USA, *Asahi Chemical Industry Co., Ltd.
Develoment of a high-k composite for integral capacitors

Olbrich, A., Ebersberger, B., Boit, C.
Infineon Technologies AG , Munich, Germany
Conducting atomic force microscopy - A new tool for the quantitative electrical characterization of thin oxides at a nanometer scale length

Olowinsky, A., Legewie, F., Kramer, T., Bosse, L., Gillner, A., Poprawe, R.
Fraunhofer-Institut für Lasertechnik, Aachen, Germany
Laser beam micro joining for electronics industry

Onraet, S., Vellinga, W.P., Geers, M.
Eindhoven University of Technology, Eindhoven, The Netherlands
Strain fields associated with cracks in thin hard layers: an experimental study at different lengthscales

Pageler, A., Busmann, H.G.*, Boseck, S.
University of Bremen, *Fraunhofer IFAM Bremen, Germany
Properties of nanocrystalline diamond films deposited in argon microwave plasmas

Palankovski, V., Selberherr, S.
TU Vienna, Vienna, Austria
State-of-the-art micro materials models in MINIMOS-NT

Pang, J.H.L.
Nanyang Technological University, Singapore
FEA modelling of FCOB assembly

Peichl, A., Hüntrup, V., Schulze, V., Spath, D., Löhe, D.
Universität Karlsruhe, Karlsruhe, Germany
Determination of heat treatment states fit for microcutting of steels

Petzold, M., Berthold, L., Katzer, D., Knoll, H., Memhard, D., Meier, P.*, Lang, K.-D.*
Fraunhofer IWM Freiburg und Halle, *Fraunhofer IZM Berlin, Germany
The influence of surface oxide films on hardness and thermosonic wire bonding of Al bondpads

Piotter, V., Giezelt, T., Hanemann, T., Ruprecht, R., Haußelt, J.
Forschungszentrum Karlsruhe GmbH, Karlsruhe, Germany
Materials for molding processes in microsystem technology

Poech, M.H.
Fraunhofer-Institut für Siliziumtechnologie, Itzehoe, Germany
Modelling of thermal aspects of power electronic assemblies

Poplavko, Y., Prokopenko, Y., Baik, S.
National Technical University of Ukraine, Kiev, Ukraine
Paraelectric film as microwave phase shifter

Qi, W., Brocks, W.
GKSS Research Center, Geesthacht, Germany
FE-simulation of anisotropic damage development in creep process

Ranatowski, E.
Technical University, Bydgoszcz, Poland
An assessment of mechanical properties of mismatched weld joint with thin layer

Rang, T., Korolkow, O., Pikkov, M.
Tallinn Technical University, Tallinn, Estonia
Large area 4H-SiC power schottky diode

Rehmer, B., Finn, M., Gemeinert, M., Schiller, W.A.
Federal Institute for Materials Reseach and Testing, Berlin, Germany
Measurements of the Young‘s modulus of ceramic substrates in the range of 20-300°C

Reichl, H., Michel, B.
Fraunhofer IZM, Berlin, Germany
Materials science and engineering - a major topic in the future of electronic packaging

Reitlinger, C.E., Dittes, M., Bergmann, H.W.
University of Bayreuth, Bayreuth, Germany
Correlation of reliability with the mechanical properties of laedfree solders

Rentsch, A., Wilde, J.*
DaimlerChrysler AG Frankfurt, *University of Freiburg, Germany
Use of alternative materials for packaging of sensors and MCMs

Riepl, T., Lugert, G.
Siemens AG, Regensburg, Germany
Interconnection materials for Flip Chip technology in high temperature automotive applications - a comparative study

Roosen, A.
University of Erlangen-Nuremberg, Erlangen, Germany
New lamination technique to join ceramic green tapes in multilayer processing

Rümmler, N., Schnitzer, R.*, Döring, R.*, Kaulfersch, E.**, Faust, W.***, Michel, B.***
Angewandte Micromechatronic GmbH, München, *Chemnitzer Werkstoffmechanik GmbH, Chemnitz, **Angewandte Micro-Messtechnik GmbH, Rangsdorf, ***Fraunhofer IZM Berlin, Germany
Reliability investigations of vibration excited circuit boards

Rümmler, N., Schnitzer, R.*, Grosser, V.**, Michel, B.**
Angewandte Micromechatronic GmbH, München, *Chemnitzer Werkstoffmechanik GmbH, Chemnitz, **Fraunhofer IZM Berlin, Germany
Mode shape analysis of microstructures by means of laser-optical methods

Sadowski, T., Samborski, S.
Technical University of Lublin, Poland
Distributed crack propagation in porous ceramic materials

Saglam, E.S., Kynak, C., Akovali, G.
Middle East Technical University , Ankara, Turkey
Interface studies between epoxy and recycled rubber

Saotome, Y., Inoue, A.*
Gunma University, Kiryu, *Tohoku University, Japan
Micro/nano formability of amorphous alloys in the supercooled liquid state

Saotome, Y., Iwazaki, H.
Gunma University, Kiryu, Japan
Superplastic extrusion of microgear shaft with photochemically maschinable glass dies

Saotome, Y., Kurosawa, Y., Kinuta, S.*, Inoue, A.**
Gunma University, Kiryu, *Optonics precision Co., Ltd., ** Tohoku University, Japan
Superplastic microforming of amorphous alloy with microdies fabricated by UV-LIGA process

Saotome, Y., Yanagisawa, T.
Gunma University, Kiryu, Japan
Development of in-situ nanoindentation system in a Scanning Electron Microscopy

Savastiouk, S., Siniaguine, O., Korczynski, E.
Tru-Si Technologies, Sunnyvale, USA
3D wafer level packaging

Schaper, M., Jurisch, M.*, Klauß, H.-J., Balke,H., Bergner, F.
Technische Universität Dresden, *Freiberger Compound Materials GmbH, Freiberg, Germany
Fracture strength of GaAs-wafers

Scherer, V., Kullenberg, E., Arnold, W.
Fraunhofer IZFP, Saarbrücken, Germany
New perspectives of microtribology - methods and applications

Schmid, P., Ertl, S., Adamschik, M., Kohn, E.
University of Ulm, Ulm, Germany
Performance of high-speed diamond microswitch

Schmidt, H.
Institut für Neue Materialien GmbH, Saarbrücken, Germany
Nanostructural materials for microtechnologies

Schneider, D., Schwarz, T., Witke, T., Schultrich, B.
Fraunhofer-Institut für Werkstoff- und Strahltechnik, Dresden, Germany
Mechanical characterization of thin and ultrathin films by laser induced surface waves (Laser acoustics)

Schneider, H., Huber, K., Aktaa, J.
Forschungszentrum Karlsruhe Technik und Umwelt, Karlsruhe, Germany
Investigation of microshaped samples of metallic materials and carbon fibers

Schneider, W.
Microelectronic Packaging Dresden GmbH, Dresden, Germany
Glob Top materials – Technical demands, properties, principles of material selection

Schönecker, A., Gebhardt, S., Seffner, L., Steinhausen, R.*, Hauke, T.*, Seifert, W.*, Beige, H.*
Fraunhofer-IKTS, Dresden, *Martin-Luther-Universität Halle-Wittenberg, Halle/S., Germany
Preparation and modelling of fine-scaled 1-3 piezoelectric composites

Schreiber, J., Melov, V.G., Herms, M.
Fraunhofer Institute of Non-destructive Testing Dresden, Germany
Breakdown of elasticity in copper and aluminium interconnects

Schubert, A., Michel, B., Reichl, H.
Fraunhofer IZM, Berlin, Germany
Package reliability studies by experimental and numerical analysis

Schulgow, W.
Belarussian State University of Informatics and Radioelectronics, Minsk, Belarus
Die Untersuchung der Strukturregelmäßigkeit von porösen Anodenoxiden des Aluminiums (in German)

Schwencke, B., Becker, K.-F., Müller, J.
Fraunhofer Institute for Reliability and Microintegration IZM Berlin, Germany
Estimation of curing degree on epoxy resin systems by FTIR

Schwencke, B., Müller, J., Griese, H.-J.
Fraunhofer Institute for Reliability and Microintegration IZM Berlin, Germany
Analytic of micromaterials

Seeboth, A., Schneider, J., Fischer, Th., Holzbauer, H.-R., Kriwanek, J., Lötzsch, D., Patzak, A.
WITEGA Applied Materials Research Berlin, Germany
Lyotropic liquid crystalline polymers - a new thermotropic material

Seidel, M., Macht, M.-P., Mechler, S., Wanderka, N.
Hahn-Meitner-Institut Berlin, Berlin, Germany
Microforging of ZrTiCuNiBe-bulk glass in the supercooled liquid state

Seifert, W., Werner, M.*
Fachhochschule Münster, Münster, *Deutsche Bank AG, Microtechnology Innovation Team, Berlin, Germany
Impact of a single grain boundary and the surrounding crystallites on the electronic properties of MOS transistors

Seiler, B., Kieselstein, E., Dost, M., Wielage, B.*, Michel, B.**
Chemnitzer Werkstoffmechanik GmbH, Chemnitz, *TU Chemnitz, **Fraunhofer IZM Berlin, Germany
Characterisation of micromaterials and microcomponents by combination of microbending test and UNIDAC

Seitz, E.
Forschungszentrum Jülich GmbH, Jülich, Germany
Micromaterials topics in the German materials research program MaTech

Seliger, N., Ramminger, S., Franke, T., Wachutka, G.*
Siemens AG, Munich, *TU Munich, Munich, Germany
A study of heel crack failures in wire bonds under mechanical cycling

Sergeev, O., Gaponenko, N.V., Gnaser, H.*, Heiderhoff, R.**, Cramer, R.M.**, Balk, L.J.**
Belarussian State University of Informatics and Radioelectronics, Minsk, Belarus, * Universität Kaiserslautern, ** Bergische Universität Gesamthochschule Wuppertal, Germany
Characterization of erbium-doped titania films synthetized by sol-gel method on porous alumina

Sezi, R., Schmidt, G., Engelhardt, M., Helneder, H.*, Schrenk, M.*, Schwerd, M.*, Seidel, U.*, Körner, H.*
Infineon Technologies AG, Erlangen, *Technology Development, Munich, Germany
Properties and integration study of oxazole dielectric OxD

Sharp, R.
HITEN Office, AEA Technology, Abingdon, U.K.
Materials problems in high temperature electronics

Sharpe, W.N.jr.
John Hopkins University, Baltimore, USA
Tensile testing of MEMS materials

Shimojo, M., Meakawa, S., Ichikawa, Y., Takashima, K., Higo, Y., Sugiura, S.*, Swain, M.V.**
Tokyo Institute of Technology, Tokyo, *Nissei Sangyo Co., Ltd., Tokyo, Japan, **University of Sydney, Australia
Fatigue life and crack growth properties of micro-sized Ni-P amorphous alloy specimens

Shiolashvili, Z., Jishiashvili, D.*, Eterashvili, T.*, Gobronidze, V.*
Georgian Academy of Science, Tbilisi, *Georgian Technical University, Tbilisi, Georgia
Application of the zinc-silicate glass and GeO₂ thin films as diffusion sources and encapsulants for GaAs and InP

Shukla, A., Parameswaran, V.
University of Rhode Island, Kingston, USA
Developing polymer and cement based micromaterials using reclaimed micro-balloons

Shull, R.D.
National Institute of Science and Technology, Gaithersburg, USA
Giant magnetoresistance: basic and applications

Siegel, R.W.
Rensselear Polytechnic Institute, Troy, USA
New developments in nanomaterials

Simon, J.
Fraunhofer IZM Berlin, Germany
Manufacturing CSP’s at waferlevel or Flip Chip without underfill

Sitaraman, S.K.
Georgia Institute of Technology, Atlanta, USA
Application of fracture mechanics for advanced packages

Smith, D.L.
NanoNexus, Inc, San Jose, USA
Thin-film metal cantilever springs made by sputter deposition stress control, with application to fine-pitch chip probing and packaging

Sokol, V.A., Vorobyova, A.I., Outkina, E.A.
Belarussian State University of Informatics and Radioelectronics, Minsk, Belarus
Micropillared layers based on porous alumina

Sommer, J.-P., Michel, B., Döring, R., Hager, W.*, Rehme, F.*
Fraunhofer IZM, Berlin, *DaimlerChrysler Aerospace AG, Ulm, Germany
Thermo-mechanical design support by means of FEA for advanced millimeter wave communication devices

Stampfl, J., Prinz, F.B.
Stanford University, Stanford, USA
Rapid prototyping of mesoscopic devices

Stolle, T., Valizadeh, S., Lambert, D.
Fraunhofer IZM Berlin, Germany, *ACREO AB, Norrköping, Sweden, **Bull, VLSI Packaging, Les Clais-sous-Bois, France
Semiadditive and fully additive copper deposition on ORMOCER - a comparison

Strunskus, T., Behnke, K., Zaporojtchenko, V., Faupel, F.
University of Kiel, Kiel, Germany
Metal/polymer interfaces and composite materials prepared by vapor phase deposition

Suhir, E.
Bell laboratories, Lucent Technologies, Murray Hill, USA
The future of microelectronics and photonics, and the role of mechanical, materials and reliability engineering

Suhir, E.
Bell laboratories, Lucent Technologies, Murray Hill, USA
Microelectronic package structure: Design for reliability

Sussmann, R.S.
De Beers Industrial Diamond Division Ltd., Sunninghill, U.K.
Applications of CVD diamond

Szeloch, R.F., Gotszalk, T.P., Radojewski, J., Janus, P., Orawski, W., Pedrak, R.
Wroclaw University of Technology, Poland
Thermo-graphical characterisation of the AFM cantilever

Szeloch, R.F., Gotszalk, T.P., Radojewski, J., Janus, P., Pedrak, R., Orawski, W.
Wroclaw University of Technology, Poland
Near-field and far-field thermography in characterisation of microsystems

Szilassi, Z., Pászti, Z.*, Hopp, B.**, Chichak, S.***, Ripka, G., Mojzes, I.
Technical University of Budapest, Budapest, *Research Institute for Technical Physics and Materials Science of the Hungarian Academy of Science, **Research Group on Laser Physics of the Hungarian Academy of Sciences, Budapest, Hungary, ***Uzhgorod State University, Uzhgorod, Ukraine
Electrical conductivity model of excimer laser treated polyimide

Takashima, K., Ichikawa, Y., Shimojo, M., Higo, Y., Swain, M.V.*
Tokyo Institute of Technology, Tokyo, Japan, *University of Sydney, Sydney, Australia
Fracture toughness measurements of micro-sized Ni-P amorphous alloy specimens

Tatasciore, P., Meyer-Piening, H.-R.
Swiss Federal Institute of Technology, Zürich, Switzerland
On recovery of interference fringes in holographic interferometry

Thebaud, J.-M., Woirgard, E., Zardini, C.
Université Bordeaux, Bordeaux, France
Relation between accelerated ageing tests and actual operation: Finite Element simulation evaluation

Todorova, V.
Technical University Gabrovo, Gabrovo, Bulgaria
Investigations and development of tactile ferropiezoelectric array sensors

Tong, Quinn K., Ma, B., Savoca, A.
National Starch and Chemical Company, Bridgewater, USA
Wafer level Flip Chip packaging

Tönshoff, H.K., Alvensleben, F. von, Körber, K., Beil, A.
Laser Zentrum Hannover e.V., Hannover, Germany
Qualification of different standard photo resins and new laser sources for micro-stereolithography

Toth, L.
Bay Zoltan Foundation for Applied Research, Miskolctapolca, Hungary
Scale effect in fracture

Trampert, A., Wagner, T., Thamm, T., Brandt, O., Ploog, K.H.
PDI, Berlin, Germany
Microstructure at indented thin GaN (0001) epilayers grown on 6H-SiC substrated

Uhlenbrock, R., Melbert, J.
Ruhr-University Bochum, Germany
Electrothermal interaction in power semiconductors

Uhlig, C., Bauer, M., Kahle, O.
Fraunhofer IZM, Branch Lab EPC Teltow, Germany
Crack propagation behavior in highly crosslinked polymers – A case study for a range of toughened and single phase thermosetting resins

Uhlig, C., Bauer, M., Kahle, O., Wienecke, B.*
Fraunhofer IZM, Branch Lab EPC Teltow, *LaVision 2D-Meßtechnik GmbH, Göttingen, Germany
A simple but powerful optical technique for monitoring crack propagation during fracture mechanical tests of polymers

Ullner, C., Beckmann, J.
Bundesanstalt für Materialforschung und –prüfung (BAM), Berlin, Germany
Effect of inhomogeneity on the instrumented indentation test

Urbánek, M., Spousta, J., Jiruše, J., Zlámal, J., ChmelÍk, R., Nebojsa, A.*, Šikola, T.
Brno University of Technology, Brno, *Masaryk University, Brno, Czech Republic
Monitoring of surface homogeneity of optical parameters of thin films

Varin, R.A., Bystrzycki, J.*, Paszula, J.*, Song, K.
University of Waterloo, Waterloo, Canada,*Military University of Technology, Poland
Nanostructured shock-wave consolidated intermetallics

Vasilescu, E. , Vasilescu, I.*, Brenoaie, I.**
University"Dunarea de Jos", Galatzi, *SIDEX"S.A., Galatzi, **Metallurgical Surveyor-Lloyd’s Register, Romania
Characteristics of micro-metallic powders intended to be used in the production of electrochemical supplies of current

Villain, J., Brüller, O.*
University of Applied Sciences Augsburg, *Technical University München, Garching, Germany
Influence of specimen dimensions on creep behavior of solder material

Villain, J., Müller,T.*, Michel, B.**, Totzauer, W.*
University of Applied Sciences Augsburg, *University of Applied Science Mittweida, **Fraunhofer IZM Berlin, Germany
Database for materials in micro systems

Vogel, D., Gollhardt, A., Schubert, A., Kühnert, R.*, Michel, B.
Fraunhofer IZM Berlin, *Kühnert & Tränkner Meßsysteme GmbH Chemnitz, Germany
microDAC strain measurement for FEA support

Vogel, D., Liu, J.*
Fraunhofer IZM Berlin, Germany, *IVF Mölndal, Sweden
Reliability of ACA bonded Flip Chip

Vogel, J.*, Sommer, J.-P., Noack, E.**, Kieselstein, E.**, Grosser, V., Auerswald, E., Gentzsch, S.***, Michel, B.
Fraunhofer IZM Berlin, *Angewandte Micro-Meßtechnik GmbH Rangsdorf, **Chemnitzer Werkstoffmechanik GmbH, Chemnitz, ***now with: DLR, Berlin, Germany
Micromaterials characterization for microrelays and microsensors

Vogel, J., Dost, M.*, Osten, W.**, Fassler, R.***, Köpp, N.****, Döring, R.*, Sommer, J.-P.*****, Michel, B.*****
Angewandte Micro-Meßtechnik GmbH, Rangsdorf, *Chemnitzer Werkstoffmechanik GmbH, Chemnitz, **BIAS Bremer Institut für Angewandte Strahltechnik, ***Jenoptik Laser.Optik.Systeme GmbH Jena, ****VEW Vereinigte Elektronikwerkstätten GmbH Bremen, *****Fraunhofer IZM Berlin, Germany
Modular loading and measuring system for materials characterization of microcomponents

Vorobyova, A.I., Outkina, E.A.
Belarussian State University of Informatics and Radioelectronics, Minsk, Belarus
Pillared microstructures of Al and Ta anodic oxides - advanced system for display technology

Vrublevsky I., Parkoun, V.
Belarussian State University of Informatics and Radioelectronics, Minsk, Belarus
The aluminium film plastic deformation analysis during local anodic oxidation

Vrublevsky I., Parkoun, V.
Belarussian State University of Informatics and Radioelectronics, Minsk, Belarus
Aluminium film internal stress effect on the conductor cross section being formed by anodization

Walter, H., Bieroegel, C.*, Grellmann, W.*, Fedtke, M., Michel, B.
Fraunhofer IZM Berlin, *Martin-Luther-University Halle-Wittenberg, Germany
Fracture mechanics characterization of epoxy resins with Mini-Compact-Tension(CT)- specimens

Walter, H., Schubert, A., Schneider,W.*, Kieselstein, E.**, Auerswald, E., Michel, B.
Fraunhofer IZM Berlin, *Microelectronic Packaging Dresden, **Chemnitzer Werkstoffmechanik, Chemnitz, Germany
Evaluation of GlobTop materials for COB applications

Wang, L., Fang, H., Qian, Y., Wang, G.*
Harbin Institute of Technology, Harbin, *Shanghai Institute of Metallurgy of Academy of Sciences of China
A study on rupture behavior of SMT solder joint with mechanical heterogeneity

Wang, Z., Chu, J., Maeda, R.
Agency of Industrial Science and Technology, Tsukuba, Japan
Effect of bottom electrodes on microstructures and electrical properties of sol gel derived Pb (Zr_0.53, Ti_0.47) 0₃ thin film

Wang, Z., Maeda, R., Kikuchi, K.
Agency of Industrial Science and Technology, Tsukuba, Japan
Sol gel derived Pb (Zr_0.53, Ti_0.47) 0₃ thin films for MEMS applications

Weima, J.A., Fahrner, W.R., Blum, F., Kosaca, G.C., Zaitsev, A.M.*
University of Hagen, Hagen, *Ruhr University of Bochum, Bochum, Germany
Surface characterization of thermochemically polished CVD diamonds film

Weimar, U.
University of Tübingen, Tübingen, Germany
Nanoparticles for sensors: Technology, basic understanding and applications

Weining, W., Lefu, Z.*, Yiping, W.*
Capital Normal University Beijing, *Huazhong University of Science and Technology, Wuhan, P.R. China
The measurement of thermal deformation in BGA assemblies using real-time holographic interferometry

Weiß, U., Löbner, B., Geßner, T., Hoyer, W., Grambole, D.*
Chemnitz University of Technology, Chemnitz, * Research Centre Rossendorf, Schönfeld-Weißig, Germany
Application of new materials for integrated low-energy ignition elements in airbag systems – characterization and simulation

Wiemer, M., Hiller*, K., Gessner, T.*
Fraunhofer Institute of Reliability and Microintegration, *Chemnitz University of Technology, Chemnitz, Germany
Patterning of SOI-materials for fabrication of resonator systems using waferbonding approaches

Wiese, S., Feustel, F., Rzepka, F., Meusel, E.
Dresden University of Technology, Dresden, Germany
A constitutive material model of eutectic SnPb Flip Chip solder for ANSYS®

Wiese, S., Jakschik, S., Feustel, F., Heeg, J., Meusel, E.
Dresden University of Technology, Dresden, Germany
Crack propagation in Flip Chip solder joints

Wilde, J., Becker,K.*, Bitz, C.**
University of Freiburg, *University of Applied Science Bingen, **DaimlerChrysler AG, Frankfurt a.M., Germany
Modelling of material properties for advanced packaging

Will, P., Helbig, S.
University of Applied Sciences Mittweida, Germany
Electromechanical transducer and stochastic damages

Witke, T., Schultrich, B., Scheibe, H.-J., Siemroth, P.
Fraunhofer Institut für Werkstoff- und Strahltechnik, Dresden, Germany
Superhard and ultrasmooth carbon films for micromechanical components

Wolf, R., Gruska, B., Wandel, K.
Sentech Instruments Berlin GmbH, Berlin, Germany
KOH etch rate and optical proporties of ICPECVD silicon nitride

Wondrak, W., Senske, W., Wilde, J.*
DaimlerChrysler AG, Research and Technology, Frankfurt, *University of Freiburg, Freiburg, Germany
Reliability requirements for microtechnologies used in automotive applications

Yang, L., Schubach, H., Wegner, R., Ettemeyer, A.
Dr. Ettemeyer GmbH & Co., Neu-Ulm, Germany
3D-Microscope-ESPI: Potential for displacement analysis of micromechanic components

Yasuda, K., Kitada, T., Fujimoto, K., Nakata, S.
Osaka University, Osaka, Japan
Numerical analysis of meniscus geometry and wetting force for wettability evaluation in reflow-mode wetting balance test

Yi, S., Poon, W.K., Chen, W.T.*
Nanyang Technological University, Singapore, *National University of Singapore, Singapore
Kinking/Emanating Cracks in Flip Chip Packages

Zakel, E., Oppert, T., Teutsch, T., Tovar, D.*
Packaging Technologies GmbH, Nauen, Germany, *Pac Tech USA, Fremont, USA
Low cost bumping on waferlevel for 300 mm wafers