MicroMaterials Conference "MicroMat 2000"

Berlin, April 17 - 19 , 2000

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Program Committee


Selected Papers

Alph. Author Index


Local Organ. Committee




1. Recent Developments in Experimental Techniques for Micro Materials Characterization (Optical and Laser Techniques, Acoustic Methods, Thermography, Magnetic Testing, CL, Raman Spectroscopy, STM, AFM, microDAC, Image Correlation Techniques, X-Ray Diffraction and X-Ray Microscopy, Tomography)
2. Thermo-mechanical Analysis of Microcomponents and Microsystems
3. Thermal Characterization (Thermal Management, Electronic Cooling, Thermal Conductivity, Heat Transfer)
4. Stress and Strain in Thin Layers, Internal Stress in Microcomponents, Microdeformation Analysis
5. Advanced Mechanical Testing Methods (Indentation Tests, DMA...)
6. Materials Parameters and Constitutive Behavior
7. Nanomaterials
8. Scaling of Material Properties for Small Dimensions
9. Properties of Polycrystalline, Nanocrystalline and Amorphous Materials
10. Micro Materials for Advanced Electronic Packaging (CSP, BGA, Flip Chip, COF, COB...)
11. Materials Problems in Printed Circuit Boards and Electronic Systems with Advanced PCB (Characterization, Testing, Reliability, Simulation, Design)
12. Interfaces and Interface Reactions
13. Wide Band Gap Semiconductor Materials (e.g. Diamond, SiC, GaN, cBN etc.)
14. Special Materials and Combined Materials (Materials Problems of Silicon, Ceramics, Polymers, Metalliza-tion Regions, Thin Films, Solders and Special Combinations of Different Materials in Microsystems)
15. Micro Materials Technologies, Inter-connection and Packaging Technologies (Bonding, Bumping, Microsoldering etc.), Thin Film (CVD, PVD etc.), Microforming, Etching, LIGA, Laser Treatment
16. Micro Materials Aspects for Ultraprecision Manufacturing of Microcomponents
17. Simulation of Micro Materials (Simulation Tools, Design, Applica-tions, Relations between Simulation and Experiment)
18. Crack and Fracture Problems (Crack Detection, Prediction and Prevention, Failure Criteria, Fracture Electron-ics)
19. Damage Modelling (e.g. Creep Damage, Damage Accumulation, Life Time of Components)
20. Probabilistic and Stochastic Methods for Characterization of Microcomponents
21. Microtribology, Hard Coatings and Superhard Materials


I. Materials Aspects for Microfabrication and Modular Microsystem Tech-nology
II. Nondestructive Testing of Micro Materials and Microcomponents [organized together with the German Society for Nondestructive Testing]
III. Micro- and NanoProbe Techniques [organized together with the DVM/DGM Working Group MNP]
IV. Micro Materials for Adaptronics
V. Polymeric Materials for Electronics (Polytronics)
VI. Micro Materials for High Temperature Electronics
VII. Micro Materials for High Frequency Applications
VIII. Software Tools for MST Applications and Databanks
IX. Micro Materials Special Applications in the Fields of

• Sensors and Actuator Materials (MEMS, MOEMS)

• Automotive (Airbag, Sensors...)

• Telecommunication

• Medical and Biological Products

• Micro Materials for Harsh Environment

• Display

• Consumer Electronics

X. Aspects of Recycling and Environmental Engineering Related to Micro Materials Applications
XI. Reliability Issues, Failure Assessment


The official language of the oral presentations is English. There is no translation of the papers. The posters and the exhibition stands should either be prepared in English or in German with additional English abstracts.


o best paper awards (in different topics)

o best poster award

o special awards given by sponsoring societies and companies


Abstracts (1 page A4 format) must be mailed to the Secretariat MicroMat 2000 before September 30, 1999. The abstracts should contain the title, names of authors, affiliation and address. The conference abstracts will be handed out at the meeting. Additionally the proceedings will be published as soon as possible after the conference.


Following the very successful poster presentations on MicroMat ‘95 and ‘97 also on MicroMat 2000 special attention will be given to the poster exhibition. The best poster award and further prices awarded by sponsoring companies and scientific societies will contribute to make the poster exhibition most attractive. The outstanding facilities of the FORUM conference area will provide a very comfortable atmosphere for poster stands close to the session rooms.


The conference hotel FORUM in Berlin is located at the subway station Alexanderplatz in the center of Berlin. It offers a good and comfortable accommodation. The final conference circular in February 1999 will offer a choice of different hotels.

last update Oktober 30, 2003