|
Review
Introduction
Program Committee
Topics
Selected Papers
Alph. Author
Index
Sponsors
Local Organ. Committee
Contacts
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TOPICS
| 1. |
Recent Developments in
Experimental Techniques for Micro Materials Characterization (Optical and Laser
Techniques, Acoustic Methods, Thermography, Magnetic Testing, CL, Raman Spectroscopy, STM,
AFM, microDAC, Image Correlation Techniques, X-Ray Diffraction and X-Ray Microscopy,
Tomography) |
| 2. |
Thermo-mechanical Analysis of
Microcomponents and Microsystems |
| 3. |
Thermal Characterization
(Thermal Management, Electronic Cooling, Thermal Conductivity, Heat Transfer) |
| 4. |
Stress and Strain in Thin
Layers, Internal Stress in Microcomponents, Microdeformation Analysis |
| 5. |
Advanced Mechanical Testing
Methods (Indentation Tests, DMA...) |
| 6. |
Materials Parameters and
Constitutive Behavior |
| 7. |
Nanomaterials |
| 8. |
Scaling of Material Properties
for Small Dimensions |
| 9. |
Properties of Polycrystalline,
Nanocrystalline and Amorphous Materials |
| 10. |
Micro Materials for Advanced
Electronic Packaging (CSP, BGA, Flip Chip, COF, COB...) |
| 11. |
Materials Problems in Printed
Circuit Boards and Electronic Systems with Advanced PCB (Characterization, Testing,
Reliability, Simulation, Design) |
| 12. |
Interfaces and Interface
Reactions |
| 13. |
Wide Band Gap Semiconductor
Materials (e.g. Diamond, SiC, GaN, cBN etc.) |
| 14. |
Special Materials and Combined
Materials (Materials Problems of Silicon, Ceramics, Polymers, Metalliza-tion Regions, Thin
Films, Solders and Special Combinations of Different Materials in Microsystems) |
| 15. |
Micro Materials Technologies,
Inter-connection and Packaging Technologies (Bonding, Bumping, Microsoldering etc.), Thin
Film (CVD, PVD etc.), Microforming, Etching, LIGA, Laser Treatment |
| 16. |
Micro Materials Aspects for
Ultraprecision Manufacturing of Microcomponents |
| 17. |
Simulation of Micro Materials
(Simulation Tools, Design, Applica-tions, Relations between Simulation and Experiment) |
| 18. |
Crack and Fracture Problems
(Crack Detection, Prediction and Prevention, Failure Criteria, Fracture Electron-ics) |
| 19. |
Damage Modelling (e.g. Creep
Damage, Damage Accumulation, Life Time of Components) |
| 20. |
Probabilistic and Stochastic
Methods for Characterization of Microcomponents |
| 21. |
Microtribology, Hard Coatings
and Superhard Materials |
SPECIAL
SESSIONS AND WORKSHOPS
| I. |
Materials Aspects for
Microfabrication and Modular Microsystem Tech-nology |
| II. |
Nondestructive Testing of
Micro Materials and Microcomponents [organized together with the German Society for
Nondestructive Testing] |
| III. |
Micro- and NanoProbe
Techniques [organized together with the DVM/DGM Working Group MNP] |
| IV. |
Micro Materials for
Adaptronics |
| V. |
Polymeric Materials for
Electronics (Polytronics) |
| VI. |
Micro Materials for High
Temperature Electronics |
| VII. |
Micro Materials for High
Frequency Applications |
| VIII. |
Software Tools for MST
Applications and Databanks |
| IX. |
Micro Materials Special
Applications in the Fields of • Sensors and Actuator
Materials (MEMS, MOEMS)
• Automotive (Airbag, Sensors...)
• Telecommunication
• Medical and Biological Products
• Micro Materials for Harsh Environment
• Display
• Consumer Electronics |
| X. |
Aspects of Recycling and
Environmental Engineering Related to Micro Materials Applications |
| XI. |
Reliability Issues, Failure
Assessment |
The official language of the oral presentations is English. There is
no translation of the papers. The posters and the exhibition stands should either be
prepared in English or in German with additional English abstracts.
SPECIAL AWARDS
o best paper awards (in different topics)
o best poster award
o special awards given by sponsoring societies and companies
INSTRUCTIONS FOR AUTHORS (ORAL
PRESENTATIONS AND POSTERS)
Abstracts (1 page A4 format) must be mailed to the Secretariat
MicroMat 2000 before September 30, 1999. The abstracts should contain the title, names of
authors, affiliation and address. The conference abstracts will be handed out at the
meeting. Additionally the proceedings will be published as soon as possible after the
conference.
POSTER SESSION
Following the very successful poster presentations on MicroMat
‘95 and ‘97 also on MicroMat 2000 special attention will be given to the poster
exhibition. The best poster award and further prices awarded by sponsoring companies and
scientific societies will contribute to make the poster exhibition most attractive. The
outstanding facilities of the FORUM conference area will provide a very comfortable
atmosphere for poster stands close to the session rooms.
ACCOMMODATION
The conference hotel FORUM in Berlin is located at the subway
station Alexanderplatz in the center of Berlin. It offers a good and comfortable
accommodation. The final conference circular in February 1999 will offer a choice of
different hotels. |
