Introduction

Call for Papers

Topics

Program Committee

Local Organizing Committee

Registration Form

Contacts

B. Michel Fraunhofer Institute IZM Berlin, Germany   -General Chair-

H.-J. Fecht University Ulm, Germany

M. Werner Deutsche Bank Berlin, Germany

International Program Committee

E. Arzt Max-Planck Institute Stuttgart, Institute for Metal Research, Germany

W. Benecke University Bremen, IMSAS, Germany

G.Y. Baaklini NASA, Cleveland, USA

M. Bauer Fraunhofer Institute IZM Berlin/EPC Teltow, Germany

S. Büttgenbach Technical University Braunschweig, Germany

B. Courtois TIMA-CMPGrenoble, France

C. Drevon Alcatel Espace, Toulouse, France

J. Dual ETH Zurich, Switzerland

L.J. Ernst Technical University Delft, Netherlands

W. R. Fahrner University Hagen, Germany

Z.X. Fu Fudan University Shanghai, China

H. H. Gatzen University Hannover, Germany

T. Gessner Chemnitz University of Technology, Chemnitz, Germany

H. Gleiter Research Center Karlsruhe, Germany

W. Grünwald Robert Bosch GmbH, Stuttgart, Germany

W. Hager EADS, Ulm, Germany

T. Hauck Motorola AISL Europe, Munich, Germany

L. Heinze VDI/VDE-IT, Teltow, Germany

A. Inoue Tohoku University, Sendai, Japan

C. Johnston Oxford Applied Technology Ltd., U.K.

J. Jüptner BIAS Bremen, Germany

V. Kempe AMS Unterpremstaetten, Austria

K. Kempter Siemens AG Munich, Germany

K. Kishimoto Tokyo Institute of Technology, Japan

O. Kraft Research Center Karlsruhe, Germany

M. Kujawinska Warsaw University of Technology, Poland

S.-B. Lee Seoul National University, KAIST, ROK

J. Liu The Swedish Institute for Production Engineering, Mölndal, Sweden

J. Lu Université de Technology de Troyes, France

R. Maeda AIST, Miti, Tsukuba, Japan

P. Mayr Institute of Materials Technology (IWT) Bremen, Germany

N. Meyendorf University of Dayton, USA

J.R. Morante University of Barcelona, Spain

N. F. Morozov St. Petersburg University, Russia

J. Morris State University of New York, Binghamton, USA

K. Nihei Oki Electric Industry Co., Tokyo, Japan

J.H.-L. Pang Nanyang Technological University Singapore, Singapore

O. Paul University Freiburg, Germany

M. Pecht University of Maryland, CALCA, College Park, USA

W.J. Plumbridge Open University Milton Keynes, Great Britain

P. D. Portella Federal Institute for Materials Research and Testing (BAM) Berlin, Germany

T. Rang Technical University Tallinn, Estonia

E. Reese EPCOS GmbH Munich, Germany

H. Reichl Fraunhofer Institute IZM Berlin, Germany

E.O. Ristolainen Tampere University of Technology, Finland

J. Roggen I.M.E.C. Leuven, Belgium

N. F. de Rooij University Neuchâtel, Switzerland

H. P. Rossmanith Technical University Vienna, Austria

W. Scheel Fraunhofer Institute IZM Berlin, Germany

H. Schmidt Institute for New Materials (INM) Saarbrucken, Germany

B. Schuch Conti Temic GmbH Nuremburg, Germany

E. Seitz Research Center Juelich, Germany

R. W. Siegel Rensselaer Polytechn. Institute, Troy, USA

E. Siegmund TU Cottbus, Germany

T. Suga University of Tokyo, Japan

E. Suhir Bell Labs, Lucent Technol., Murray Hill, USA

A. A. O. Tay National University of Singapore, Singapore

C. V. Thompson M.I.T. Cambridge, USA

W. Totzauer HTW Mittweida, Germany

R. R. Tummala Georgia Institute of Technology, Atlanta, USA

J. Villain University of Augsburg (FH), Germany

B. Weiss University of Vienna, Austria

E. Wolfgang Siemens AG Munich, Germany

K.-J. Wolter Technical University Dresden, Germany

W. Wondrak DaimlerChrysler AG Frankfurt am Main, Germany

S. W. Yu Tsinghua University Beijing, P.R. China

T. Winkler CWM GmbH Chemnitz, Germany, Secretary