MicroMaterials Research - Fraunhofer Institute IZM Berlin

Fraunhofer Institute IZM Berlin
Department: Mechanical Reliability and Micromaterials

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MicroMaterials 2000

MicroMaterials 1997

MicroMaterials Research

Fraunhofer Institute IZM Research:

	Introduction
	Stress Evaluation
	Fracture Electronics
	Materials Mechanics
	MicroDAC
	Microfabrication
	Experimental Techn.
	Special Service
	Technical Equipment
	Contact

Fracture Electronics

Crack problems in advanced packaging technologies

Crack and Fracture Analysis and Crack Avoidance

FEM Damage Simulation of a Crack in a SMD Component

Laser Scanning Micrograph of Glob Top Encapsulation

last update Oktober 30, 2003
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