| MicroMaterials
Research Fraunhofer
Institute IZM Research:
|
- MicroDAC
Measurement Concept
- MicroDAC
Features
- Main
Application Areas
- Why does microDAC
enhance R & D competitiveness?
- IZM Services
- Contact
Information
MicroDAC
Measurement Concept
microDAC means micro Deformation Analysis by means of Correlation based algorithms. The method allows to determine deformation fields on
surfaces of stressed objects by the help of digital image processing. Vector displacement
and strain fields are calculated by comparing micrographs from different object load
states. In order to extract a set of local displacement values cross correlations are
evaluated for small windows of the digitized micrographs. Subsequent displacement field
processing leads to surface in-plane strain fields. At present microDAC mainly applies to
scanning electron and optical micrographs. For mechanical and / or thermal in-situ loading
inside microscopes a modular load stage conception has been realized.
Top of Page
microDAC
Features
- easy micrograph processing by user friendly microDAC
software under WINDOWS 95 or WINDOWS 3.1
- resultant displacement and strain values from micrographs
within a regular surface grid or finite element mesh nodes
- data export option compatible to graphic programs like
SURFER and EXCEL
- measurement resolution for a microscopic field of view D l
[µm] and a N by N pixel array
d u = 0.1 D l / N (displacements)
d e = 1× 10-3 (strains, shear)
- lateral resolution (independent measurement points)
d x = 20 D l / N
Top of Page
Main Application Areas
- determination of strain distributions in microscopic
components under mechanical and/or thermal load
- localization of regions of maximum stresses
- verification of finite element simulations to make sure that
mechanical modeling and used material parameters are adequate to real specimen conditions
- detection of mechanical failure modes in micro components
(cracking, delamination, fatigue and others)
- measurement of material properties, like e.g. coefficients
of thermal expansion (CTE) and bending strengths
Areas of application in microelectronics and
microsystem technology include:
- different kind of solder interconnects
- flip chip bonding
- chip scale packaging (CSP)
- glob top encapsulations
- fracture in silicon, adhesion problems in packaging.
Top of Page
Why
does microDAC enhance R & D competitiveness?
- powerful tool in combination with finite element (FE)
simulation (verification of FE modeling)
- excellent down scaling capability for measurement resolution
in dependence on micrograph acquisition device
- study of dynamic deformation processes (impact, vibration,
thermal transient processes) possible
- no special preparation of object surface for measurement as
for Moiré techniques
- no strong environmental restrictions during measurement as
for interferometric techniques
- rather simple experimental arrangements and software code
Top of Page
IZM
Services
- strain field measurements on customer objects (different
mechanical and thermal load conditions)
- strain field extraction from customer provided migrographs
on digital data storage or photographs
- complex strain/stress analysis by combined finite element
(FE) simulation and microDAC measurement, life time estimations for components, failure
analysis, mechanical design optimization
- VEDDAC and winDAC software code distribution (stand alone
program version)
- development, completion and distribution of microDAC
measurement systems for customer defined purposes
Top of Page
For
detailed information, please contact
Dr Dietmar Vogel / IZM Berlin
Fraunhofer Institute IZM Berlin
Dept. Mechan. Reliability
Gustav-Meyer-Allee 25
D-13355 Berlin
Germany
Tel.: +49 - (0)30 - 464 03 -214/-200
Fax: +49 - (0)30 - 464 03 -211
e-mail: d_vogel@izm.fhg.de
Top of Page |
