| MicroMaterials Research Fraunhofer Institute IZM Research:
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Materials
Mechanics of Packaging Technologies |
- Mechanical, thermo-mechanical and materials problems
in electronic packaging
- E.g. flip chip, ball grid arrays, chip scale
packages, chip cards etc.
- Special experience for adhesives, encapsulants,
metals, ceramics, polymers,
- Thin films (metallization, passivations) and
combinations of different materials
- Layer characterization by spectrum ellipsometry
- Materials mechanics for additive technologies
Chip Scale
Package - Finite Element Modelling
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