Fraunhofer Institute IZM Research:

• Quality assurance and lifetime estimation of components, devices and systems
  
• Investigation of deformation and stress behavior of micro components under thermal and/or mechanical load
  
• Thermo-mechanical failure analysis for different kind of damage mechanisms (fatigue, cracking, delamination)
  
• Determination of material properties (e.g. temperature dependent CTE values, stress/strain and creep curves, and others) on unique and microscopic scale specimens
  
• Deformation measurement for different thermo-mechanical load conditions inside microscopic structures
  
• X-ray stress and texture analysis
  
• Damage analysis utilizing metallographic preparation techniques
  
• Scanning acoustic microscopy for failure detection
  
• Experimental fracture mechanics
  
• Thin layer spectrum ellipsometry for thickness measurement or material identification
  
• Measurements for component surface characterization (surface profiling, micro roughness measurement, and others)
  
• Thermo-mechanical layout optimization of micro sensors and actuators
  
• Thermo-mechanical analysis of solder interconnects
  
• Mechanical evaluation of plastic encapsulation (e.g. glob top) and ceramic packaging optimization
  
• Automized optical measurements under local clean-room conditions
  

Applied Methods