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Mechanical
and Thermal Stress Evaluation |
Thermo-mechanical finite element modeling based on
current software tools and high performance work-stations
Numerical simulation of complicated thermal and
mechanical behavior of parts, components, packages and structures preferably used in
microtechnology
Powerful simulation tools (FEM) for any kind of
practical stress analysis in macro- and micro-application
Stochastic and probabilistic reliability estimation
tools (e.g. stochastic FEM)
Micro Materials Characterization
Estimation of material parameters (CTE,
Young’s modulus, Poisson’s ratio, thermal conductivity, creep parameters etc.)
Mechanical Reliability and Optimal
Design of Microsystems
Fatigue and Creep Behavior of
Microcomponents
Flip Chip
Solder Bump
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