Fraunhofer Institute IZM Research:

• In-situ Deformation Measurement Methods

  E.g. microDAC - deformation analysis by means of correlation method

• Thermo-Mechanical Problems of Solder Joint Reliability

  Reliability assessment of solder joints and micro solder interconnects

• Development of Special Simulation Tools for Applications in Microtechnologies

• In-situ Experiments by Means of Laser Methods Combined with Image Processing

  Laser scanning experiments combined with FEM
  Speckle photography and speckle interferometry
  On-line measurements on MEMS and microelectronics packages
  3D-topography
  Material mechanics for additive technologies

• Residual Stress Evaluation

  X-ray stress and texture analysis
  Stresses in thin films and layers

• Thermal Deformation and Temperature Field Measurement

• Defectoscopy (e.g. by acoustic microscopy, laser measurement techniques etc.)

• Microfabrication Strategies, especially for SME

  Modular microsystems, modular design principles for MEMS and 3D-packages
  In-situ measurement techniques for packaging microfabrication modules

X-Ray Diffraction Equipment